Uninterruptible power supply having a liquid cooling device

US12402287B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12402287-B2
Application numberUS-202318105335-A
CountryUS
Kind codeB2
Filing dateFeb 3, 2023
Priority dateMay 29, 2020
Publication dateAug 26, 2025
Grant dateAug 26, 2025

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A liquid cooling device for cooling at least one target component that includes: a base member to be in thermal contact with the at least one target component to be cooled by the liquid cooling device, the base member including a lower surface configured to be placed in contact with the at least one target component, the base member defining a plurality of pockets spaced apart from one another on an upper side thereof and defining a plurality of fluid conduits configured to internally circulate a cooling liquid therethrough. Each of the plurality of pockets arranged to accommodate a corresponding fluid conduit and an interconnecting channel defined by the base member and extending between two neighboring pockets of the plurality of pockets for distributing the cooling fluid from the fluid conduit of one pocket to the fluid conduit of a neighboring pocket.

First claim

Opening claim text (preview).

What is claimed is: 1. A liquid cooling device for cooling at least one target component, the liquid cooling device comprising: a base member configured to be in thermal contact with the at least one target component to be cooled by the liquid cooling device, the base member including a lower surface configured to be placed in contact with the at least one target component, the base member defining, on an upper side thereof, a plurality of pockets spaced apart from one another; the base member defining in part a plurality of fluid conduits configured to internally circulate a cooling liquid therethrough, each of the plurality of pockets arranged to accommodate a corresponding fluid conduit of the plurality of fluid conduits; an interconnecting channel structure defined by the base member and extending between two neighboring pockets of the plurality of pockets and configured to distribute the cooling liquid from a fluid conduit of one pocket to a fluid conduit of a neighboring pocket; and a plurality of covers, wherein each cover is connected to the base member and is received in a pocket of the plurality of pockets, wherein a first cover of the plurality of covers comprises a fluid inlet for receiving the cooling liquid, and wherein a second cover of the plurality of covers comprises a fluid outlet for discharging the cooling liquid, wherein, the interconnecting channel structure comprises a first interconnecting channel and a second interconnecting channel such that, each of the plurality of pockets incorporates the first interconnecting channel to service neighboring pockets disposed along a first dimension of the base member and incorporates the second interconnecting channel defined by the base member to service neighboring pockets disposed along a second dimension of the base member. 2. The liquid cooling device of claim 1 , wherein each of the fluid conduits comprises a fluid inlet to receive the cooling liquid and a fluid outlet to discharge the cooling liquid. 3. The liquid cooling device of claim 2 , wherein the fluid outlet of a fluid conduit of a first neighboring pocket distributes the cooling liquid to the fluid inlet of a fluid conduit of a second neighboring pocket via the interconnecting channel structure. 4. The liquid cooling device of claim 1 , wherein the interconnecting channel structure is formed between adjacent sidewalls of respective neighboring pockets. 5. The liquid cooling device of claim 1 , wherein the interconnecting channel structure comprises a slanted-shaped profile in which one end of the first interconnecting channel is disposed vertically higher than another end of the first interconnecting channel. 6. The liquid cooling device of claim 1 , wherein the interconnecting channel structure comprises a V-shaped profile in which both ends of the first interconnecting channel are disposed vertically higher than a downwardly-angled vertex point. 7. The liquid cooling device of claim 1 , wherein the plurality of pockets comprises an even number of pockets arranged along a two dimensional plane of the base member. 8. The liquid cooling device of claim 1 , wherein: the first cover comprises an overhead fluid inlet tube for supplying the cooling liquid to the plurality of pockets from a liquid source and the second cover comprises an overhead fluid outlet tube for expelling the cooling liquid back to the liquid source. 9. The liquid cooling device of claim 1 , wherein the base member comprises a lateral fluid inlet tube, disposed along a side surface of the base member, for supplying the cooling liquid to the plurality of pockets from a liquid source and a lateral fluid outlet tube, disposed along a side surface of the base member, for expelling the cooling liquid back to the liquid source. 10. The liquid cooling device of claim 1 , wherein the interconnecting channel structure is formed by a milling or drilling process. 11. The liquid cooling device of claim 1 , wherein the plurality of pockets are distributed in a grid formation, the grid formation having a plurality of rows and a plurality of columns. 12. A liquid cooling device for cooling at least one target component, the liquid cooling device comprising: a base member configured to be in thermal contact with the at least one target component to be cooled by the liquid cooling device, the base member including a lower surface configured to be placed in contact with the at least one target component, the base member defining, on an upper side thereof, a plurality of pockets spaced apart from one another; the base member defining in part a plurality of fluid conduits configured to internally circulate a cooling liquid therethrough, each of the plurality of pockets arranged to accommodate a corresponding fluid conduit of the plurality of fluid conduits, wherein each fluid conduit of the plurality of fluid conduits is shaped in a generally sinusoidal pattern within the plurality of pockets; and the base member defining in part an interconnecting channel structure extending between two neighboring pockets of the plurality of pockets and configured to distribute the cooling liquid from a fluid conduit of one pocket to a fluid conduit of a neighboring pocket, wherein, the interconnecting channel structure comprises a first interconnecting channel and a second interconnecting channel such that, each of the plurality of pockets incorporates the first interconnecting channel to service neighboring pockets disposed along a first dimension of the base member and incorporates the second interconnecting channel defined by the base member to service neighboring pockets disposed along a second dimension of the base member. 13. The liquid cooling device of claim 12 , wherein a fluid outlet of a fluid conduit of a first neighboring pocket distributes the cooling liquid to a fluid inlet of a fluid conduit of a second neighboring pocket via the interconnecting channel structure.

Assignees

Inventors

Classifications

  • Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

  • within sub-racks for removing heat from electronic boards · CPC title

  • within cabinets for removing heat from sub-racks, e.g. plenum · CPC title

  • Liquid coolant without phase change · CPC title

  • within cabinets for removing heat from sub-racks · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US12402287B2 cover?
A liquid cooling device for cooling at least one target component that includes: a base member to be in thermal contact with the at least one target component to be cooled by the liquid cooling device, the base member including a lower surface configured to be placed in contact with the at least one target component, the base member defining a plurality of pockets spaced apart from one another …
Who is the assignee on this patent?
OVH
What technology area does this patent fall under?
Primary CPC classification H05K7/20927. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 26 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).