Multilayer electronic component

US12400791B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12400791-B2
Application numberUS-202318127226-A
CountryUS
Kind codeB2
Filing dateMar 28, 2023
Priority dateNov 15, 2022
Publication dateAug 26, 2025
Grant dateAug 26, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A multilayer electronic component including: a body including a dielectric layer and internal electrodes; and external electrodes disposed outside the body and connected to the internal electrodes, wherein 1.5≤Hfs/Hfc≤5.0 when the internal electrode includes hafnium (Hf), Hfc indicates an average Hf content (at %) in a center of the internal electrode, and Hfs indicates an average Hf content (at %) in the internal electrode, measured from the center of the internal electrode to an interface thereof in contact with the dielectric layer.

First claim

Opening claim text (preview).

What is claimed is: 1. A multilayer electronic component comprising: a body including a dielectric layer and internal electrodes including hafnium (Hf); and external electrodes disposed outside the body and connected to the internal electrodes, wherein 1.5≤Hfs/Hfc≤5.0, Hfc indicates an average Hf content (at %) in a center of at least one of the internal electrodes, and Hfs indicates an average Hf content (at %) in the at least one of the internal electrodes measured from the center of the at least one of the internal electrodes to an interface between the at least one of the internal electrodes and the dielectric layer. 2. The component of claim 1 , wherein the average Hf content (at %) included in the at least one of the internal electrodes increases from the center of the at least one of the internal electrodes toward the interface. 3. The component of claim 1 , wherein 1.5≤Hfs1/Hfc≤5.0, Hfs1 indicates an average Hf content (at %) in a region within 100 nm from the interface toward the center of the internal electrode. 4. The component of claim 1 , wherein the average Hf content included in the at least one of the internal electrodes is 0.01 at % or more and 20.0 at % or less. 5. The component of claim 4 , wherein the average Hf content included in the at least one of the internal electrodes is 5.0 at % or more and 20.0 at % or less. 6. The component of claim 5 , wherein Hf is present as hafnium oxide. 7. The component of claim 6 , wherein an area of hafnium oxide included in the at least one of the internal electrodes is 0.001% or more and 1.0% or less relative to that of the at least one of the internal electrodes. 8. The component of claim 1 , wherein an average Hf content (wt %) included in the at least one of the internal electrodes is 0.025 wt % or more and 50.0 wt % or less. 9. The component of claim 1 , wherein the at least one of the internal electrodes has an average thickness of 0.6 μm or less. 10. The component of claim 9 , wherein the dielectric layer has an average thickness of 0.6 μm or less. 11. The component of claim 1 , wherein the body includes first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction, an active part forming capacitance by including the internal electrodes alternately disposed in the first direction while having the dielectric layer interposed therebetween, and a cover part disposed on each of two end surfaces of the active part opposing each other in the first direction. 12. The component of claim 11 , wherein the body further includes a margin portion disposed on each of two end surfaces of the body opposing each other in the third direction. 13. A multilayer electronic component comprising: a body including a dielectric layer and internal electrodes including hafnium oxide; and external electrodes disposed outside the body and connected to the internal electrodes, wherein an area of the hafnium oxide included in the at least one of the internal electrodes is 0.001% or more and 1.0% or less relative to that of the at least one of the internal electrodes. 14. The component of claim 13 , wherein 1.5≤Hfs/Hfc≤5.0, Hfc indicates an average Hf content (at %) in a center of at least one of the internal electrodes, and Hfs indicates an average Hf content (at %) in the at least one of the internal electrodes measured from the center of the at least one of the internal electrodes to an interface between the at least one of the internal electrodes and the dielectric layer. 15. The component of claim 14 , wherein 1.5≤Hfs1/Hfc≤5.0, Hfs1 indicates an average Hf content (at %) in a region within 100 nm from the interface toward the center of the internal electrode. 16. The component of claim 13 , wherein an average Hf content included in the at least one of the internal electrodes is 0.01 at % or more and 20.0 at % or less. 17. The component of claim 13 , wherein the at least one of the internal electrodes has an average thickness of 0.6 μm or less. 18. The component of claim 13 , wherein the dielectric layer has an average thickness of 0.6 μm or less. 19. The component of claim 13 , wherein the body includes first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction, an active part forming capacitance by including the internal electrodes alternately disposed in the first direction while having the dielectric layer interposed therebetween, and a cover part disposed on each of two end surfaces of the active part opposing each other in the first direction. 20. The component of claim 19 , wherein the body further includes a margin portion disposed on each of two end surfaces of the body opposing each other in the third direction.

Assignees

Inventors

Classifications

  • H01G4/30Primary

    Stacked capacitors (H01G4/33 takes precedence) · CPC title

  • H01G4/012Primary

    Form of non-self-supporting electrodes · CPC title

  • H01G4/0085Primary

    Fried electrodes · CPC title

  • Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

  • H01G4/1227Primary

    based on alkaline earth titanates · CPC title

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What does patent US12400791B2 cover?
A multilayer electronic component including: a body including a dielectric layer and internal electrodes; and external electrodes disposed outside the body and connected to the internal electrodes, wherein 1.5≤Hfs/Hfc≤5.0 when the internal electrode includes hafnium (Hf), Hfc indicates an average Hf content (at %) in a center of the internal electrode, and Hfs indicates an average Hf content (a…
Who is the assignee on this patent?
Samsung Electro Mech
What technology area does this patent fall under?
Primary CPC classification H01G4/30. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 26 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).