Adhesives comprising cyclic imide addition-fragmentation and adhesion agents

US12398301B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12398301-B2
Application numberUS-202218706151-A
CountryUS
Kind codeB2
Filing dateNov 18, 2022
Priority dateDec 6, 2021
Publication dateAug 26, 2025
Grant dateAug 26, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An adhesive composition is described comprising at least one cyclic imide monomer comprising an unsaturated carbonyl. The adhesive composition is a polymerizable composition or a polymerized composition. The polymerizable adhesive composition may comprise at least one monomer, oligomer, polymer, or a combination thereof comprising ethylenically unsaturated groups and/or an epoxy resin. The cyclic imide monomer may comprise an imide group with an α, β-unsaturated carbonyl in a heterocyclic ring wherein the ring comprises at least 6 covalently bonded atoms. Also described are methods of forming an adhesive coated substrate and articles.

First claim

Opening claim text (preview).

What is claimed is: 1. A composition comprising an adhesive composition and a cyclic imide monomer having the structure: wherein L is a covalent bond or an organic linking group; Y is alkyl, aryl, hydroxyl, carboxylic acid, or an ethylenically unsaturated polymerizable group; and R 1 and R 2 are substituents; and an epoxy resin. 2. The composition of claim 1 wherein R 1 and R 2 are substituents such that the cyclic imide monomer ring-opens during polymerization thereby forming radicals including C1 to C4 alkyl groups. 3. The composition of claim 1 wherein L is (hetero) alkylene or (hetero) arylene. 4. The composition of claim 1 wherein Y is a carboxylic acidic group or a (meth)acrylate group. 5. The composition of claim 1 wherein L comprises at least one hydroxyl group. 6. A composition comprising an adhesive composition and a cyclic imide monomer having the structure: wherein R is an organic linking group; and R 1 and R 2 are independently substituents; and an epoxy resin. 7. The composition of claim 6 wherein R 1 and R 2 are substituents such that the cyclic imide monomer ring-opens during polymerization thereby forming radicals including C1 to C4 alkyl groups. 8. The composition of claim 6 wherein R is (hetero) alkylene or (hetero) arylene, optionally comprising at least one pendant ethylenically unsaturated polymerizable group. 9. The composition of claim 1 wherein the adhesive composition comprises less than 10, 9, 8, 7, 6, 5, 4, 3, 2, or 1 wt. % of the cyclic imide monomer. 10. The composition of claim 1 wherein the cyclic imide monomer comprises a (meth)acryl group. 11. The composition of claim 1 wherein the adhesive composition is a polymerizable composition or a polymerized composition. 12. The composition of claim 11 wherein the polymerizable composition comprises at least one monomer, oligomer, polymer, or a combination thereof comprising ethylenically unsaturated groups. 13. An adhesive coated article comprising a first substrate and the polymerized composition of claim 1 and a second substrate such the polymerized composition bonds the first substrate to the second substrate. 14. A composition comprising: polymerized units having the structure: wherein L is a covalent bond or a linking group; Y is alkyl, aryl, hydroxyl, carboxylic acid, or an ethylenically unsaturated group; R 1 and R 2 are independently substituents; and P and P′ are independently polymerized units of an ethylenically unsaturated polymerizable monomer, oligomer, polymer, or combination thereof; and an epoxy resin; wherein the composition is an adhesive composition. 15. The composition of claim 6 wherein the adhesive composition comprises less than 10, 9, 8, 7, 6, 5, 4, 3, 2, or 1 wt. % of the cyclic imide monomer. 16. The composition of claim 6 wherein the cyclic imide monomer comprises a (meth)acryl group. 17. The composition of claim 6 wherein the adhesive composition is a polymerizable composition or a polymerized composition. 18. The composition of claim 17 wherein the polymerizable composition comprises at least one monomer, oligomer, polymer, or a combination thereof comprising ethylenically unsaturated groups. 19. An adhesive coated article comprising a first substrate and the polymerized composition of claim 6 and a second substrate such the polymerized composition bonds the first substrate to the second substrate. 20. An adhesive coated article comprising a first substrate and the polymerized composition of claim 14 and a second substrate such the polymerized composition bonds the first substrate to the second substrate.

Assignees

Inventors

Classifications

  • Epoxidised polymerised polyenes · CPC title

  • {Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond} in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00 · CPC title

  • C09J133/12Primary

    Homopolymers or copolymers of methyl methacrylate · CPC title

  • C09J4/00Primary

    Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond {; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16} · CPC title

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What does patent US12398301B2 cover?
An adhesive composition is described comprising at least one cyclic imide monomer comprising an unsaturated carbonyl. The adhesive composition is a polymerizable composition or a polymerized composition. The polymerizable adhesive composition may comprise at least one monomer, oligomer, polymer, or a combination thereof comprising ethylenically unsaturated groups and/or an epoxy resin. The cycl…
Who is the assignee on this patent?
3M Innovative Properties Company
What technology area does this patent fall under?
Primary CPC classification C09J133/12. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 26 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).