Cooling mold, and apparatus and method for manufacturing resin molded article

US12397486B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12397486-B2
Application numberUS-202017602218-A
CountryUS
Kind codeB2
Filing dateApr 8, 2020
Priority dateApr 8, 2019
Publication dateAug 26, 2025
Grant dateAug 26, 2025

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A cooling mold for cooling a resin preform that has a gate portion protruding outward from a center of a bottom portion, in which an accommodating space that accommodates the preform is formed in the cooling mold, a bottom region facing the bottom portion of the preform in the accommodating space has a shape following the bottom portion of the preform, and an air sucking hole for sucking air is formed in the bottom region at a position shifted from the center of the bottom portion of the preform. In the accommodating space, a region facing a body portion of the perform and a bottom region facing the bottom portion of the perform are formed as a single member.

First claim

Opening claim text (preview).

The invention claimed is: 1. A mold for cooling a resin preform that has a gate portion protruding outward from a center of a bottom portion, wherein an accommodating space that accommodates the preform is formed in the mold, a bottom region facing the bottom portion of the preform in the accommodating space has an internal shape following an outer shape of the bottom portion of the preform, and a plurality of air sucking holes that sucks air is formed in the bottom region at a position shifted from the center of the bottom portion of the preform, such that there is no air sucking hole at a position facing the gate portion of the preform in the mold, and an internal surface of the bottom region following the outer shape of the bottom portion of the preform faces the gate portion, such that the mold is adapted for: sucking air from the air sucking holes of the mold and drawing the preform into the accommodating space; and collapsing the gate portion in the bottom region to remove the gate portion. 2. The mold according to claim 1 , wherein, wherein the accommodating space comprises a region facing the body portion of the preform and the bottom region facing the bottom portion of the preform, wherein the region and the bottom region of the accommodating space are formed as single member. 3. The mold according to claim 1 , wherein the plurality of the air sucking holes is formed in the bottom region so as to be rotationally symmetric with respect to the center of the bottom portion of the preform. 4. An apparatus for manufacturing a resin molded article, comprising: an injection molding unit configured to injection-mold a resin preform having a gate portion protruding outward from a center of a bottom portion; and a mold according to claim 1 , the mold is configured for accommodating and cooling the injection-molded resin preform in the accommodating space, wherein the mold is configured for sucking air from the air sucking holes to draw the preform into the accommodating space and collapsing the gate portion in the bottom region to remove the gate portion. 5. The apparatus for manufacturing the resin molded article according to claim 4 , wherein the mold is disposed in at least either a receiving unit configured to carry out the preform from the injection molding unit or a cooling unit configured to cool the preform carried out from the injection molding unit. 6. The apparatus for manufacturing the resin molded article according to claim 5 , further comprising: a heating unit configured to continuously convey and heat the preform cooled in the cooling unit; and a blow molding unit configured to blow-mold the preform after heating to manufacture a resin container. 7. The apparatus for manufacturing the resin molded article according to claim 6 , wherein a cycle of the blow molding in the blow molding unit is shorter than a cycle of injection molding of the preform in the injection molding unit, and a plurality of the preforms molded in one cycle of the injection molding unit is blow-molded in a plurality of the blow molding cycles. 8. A method for manufacturing a resin molded article using a mold according to claim 1 , the method comprising: accommodating and cooling a resin preform having a gate portion protruding outward from a center of a bottom portion in the accommodating space of the mold; sucking air from the air sucking holes of the mold; drawing the preform into the accommodating space; and collapsing the gate portion in the bottom region to remove the gate portion.

Assignees

Inventors

Classifications

  • with U-shaped holder · CPC title

  • Means specially adapted for transporting preforms · CPC title

  • Conveyors, e.g. flat conveyor or clamping between two bands · CPC title

  • Preform carriers for cooling preforms · CPC title

  • holding bottom portion or sprue · CPC title

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Frequently asked questions

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What does patent US12397486B2 cover?
A cooling mold for cooling a resin preform that has a gate portion protruding outward from a center of a bottom portion, in which an accommodating space that accommodates the preform is formed in the cooling mold, a bottom region facing the bottom portion of the preform in the accommodating space has a shape following the bottom portion of the preform, and an air sucking hole for sucking air is…
Who is the assignee on this patent?
Nissei Asb Machine Co Ltd
What technology area does this patent fall under?
Primary CPC classification B29C49/6427. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 26 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).