Display device and method for manufacturing same

Patent metadata

Field	Value
Publication number	US-12396339-B2
Application number	US-202017913650-A
Country	US
Kind code	B2
Filing date	Apr 9, 2020
Priority date	Apr 9, 2020
Publication date	Aug 19, 2025
Grant date	Aug 19, 2025

Abstract

A non-display region is provided within a display region, a through-hole is provided in the non-display region, a plurality of inner protruding portions are provided in the non-display region so as to surround the through-hole, a lower resin layer of each of the inner protruding portions is separated by a plurality of inner slits formed in the resin substrate layer, some of the plurality of display wiring lines are separated by the through-hole, and a first non-display conductive layer at a bottom portion of the inner slit closest to the display region side is provided so as to overlap the display wiring line separated by the through-hole at one end portion on a side of the through-hole and another end portion on a side of the through-hole.

First claim

The invention claimed is:

1. A display device comprising:
a resin substrate layer;
a thin film transistor layer provided on the resin substrate layer and including a lower inorganic insulating film, a lower wiring line layer, and an organic insulating film layered in order; and
a light-emitting element layer provided on the thin film transistor layer, and including a plurality of first electrodes, a plurality of light-emitting function layers, and a common second electrode layered in order corresponding to a plurality of subpixels constituting a display region,
wherein a non-display region with an island shape is provided inside the display region,
a through-hole passing through the resin substrate layer in the non-display region in a thickness direction is provided,
an electronic component is installed in the through-hole,
in the non-display region, a plurality of inner protruding portions each are provided to surround the through-hole,
each of the plurality of inner protruding portions includes a lower resin layer constituted by the resin substrate layer and a lower inorganic insulating layer provided on the lower resin layer and formed in the same layer with the same material as the lower inorganic insulating film,
the lower resin layer of each of the plurality of the inner protruding portions is separated by a plurality of inner slits each formed on a surface of the resin substrate layer on a side of the lower inorganic insulating film,
the lower inorganic insulating layer is provided to protrude from the lower resin layer in an eaves shape to at least one of a side of the through-hole and a side of the display region,
in the display region, a plurality of display wiring lines are provided to extend in parallel to each other as the lower wiring line layer,
some of the plurality of display wiring lines are separated by the through-hole,
at a bottom portion of each of the plurality of inner slits, a first non-display conductive layer is formed in the same layer with the same material as the second electrode, and
the first non-display conductive layer closest to the display region is provided to overlap each of the some of the plurality of display wiring lines separated by the through-hole at one end portion on a side of the through-hole and another end portion on a side of the through-hole.

2. The display device according to claim 1 ,
wherein each of the plurality of inner slits is annularly provided to surround the through-hole.

3. The display device according to claim 2 ,
wherein the first non-display conductive layer is provided annularly.

4. The display device according to claim 1 ,
wherein the first non-display conductive layer is provided separately in two.

5. The display device according to claim 1 , comprising:
a sealing film provided to cover the light-emitting element layer, and including a first inorganic sealing film, an organic sealing film, and a second inorganic sealing film layered in order;
in a frame region around the display region, an outer dam wall provided to surround the display region and overlapping an outer peripheral end portion of the organic sealing film; and
in the non-display region, an inner dam wall provided to surround the plurality of inner protruding portions, and to overlap an inner peripheral end portion of the organic sealing film,
wherein among the plurality of inner slits, an inner slit closest to the inner dam wall is provided with an eaves portion including the lower inorganic insulating film protruding from the side of the display region to the side of the through-hole.

6. The display device according to claim 5 ,
wherein the thin film transistor layer includes an upper inorganic insulating film provided on an upper side of the lower inorganic insulating film, and
the eaves portion is in contact with the first inorganic sealing film with the upper inorganic insulating film interposed between the eaves portion and the first inorganic sealing film.

7. The display device according to claim 6 ,
wherein the lower resin layer of each of the plurality of inner protruding portions is in contact with the first inorganic sealing film with the upper inorganic insulating film interposed between the lower resin layer and the first inorganic sealing film.

8. The display device according to claim 5 ,
wherein in the non-display region, between the plurality of inner protruding portions and the inner dam wall, another inner dam wall is provided to overlap the eaves portion.

9. The display device according to claim 1 ,
wherein in the non-display region, a second non-display conductive layer formed in the same layer with the same material as the second electrode is provided on a side of the display region of the plurality of inner slits, and
the second non-display conductive layer is provided to overlap each of the some of the plurality of display wiring lines separated by the through-hole at the one end portion on the side of the through-hole and the other end portion on the side of the through-hole.

10. The display device according to claim 1 ,
wherein the resin substrate layer includes a first resin substrate layer provided on an opposite side to the thin film transistor layer, a second resin substrate layer provided on a side of the thin film transistor layer, and an in-substrate inorganic insulating film provided between the first resin substrate layer and the second resin substrate layer, and
the plurality of inner slits are each provided in the second resin substrate layer.

11. The display device according to claim 1 ,
wherein any one of the plurality of display wiring lines separated by the through-hole is disconnected, and
a portion of the display wiring line disconnected on a side of the through-hole is electrically connected to a corresponding one of the plurality of display wiring lines separated by the through-hole via the first non-display conductive layer closest to a side of the display region.

12. The display device according to claim 1 ,
wherein each of the plurality of light-emitting function layers is an organic electroluminescence layer.

13. A method for manufacturing a display device comprising:
forming a thin film transistor layer including a lower inorganic insulating film, a lower wiring line layer, and an organic insulating film layered in order on a resin substrate layer;
on the thin film transistor layer, forming a light-emitting element layer including a plurality of first electrodes, a plurality of light-emitting function layers, and a common second electrode layered in order corresponding to a plurality of subpixels constituting a display region; and
forming a through-hole passing through the resin substrate layer in a thickness direction in a non-display region defined in an island shape inside the display region,
an electronic component is installed in the through-hole,
wherein the forming a thin film transistor layer includes
in the display region, forming a plurality of display wiring lines extending parallel to each other as the lower wiring line layer,
by patterning the lower inorganic insulating film, in the non-display region, forming a plurality of lower inorganic insulating layers to surround the through-hole formed in the forming a through-hole, and
by forming a plurality of inner slits on a surface of the resin substrate layer exposed from the plurality of lower inorganic insulating layers and forming a plurality of lower resin layers by the resin substrate layer, forming a plurality of inner protruding portions in which each of the plurality of lower inorganic insulating layers is layered on each of the plurality of lower resin l

Assignees

• Sharp Kk

Inventors

• Saitoh Takao
• Miwa Masahiko
• Yamanaka Masaki
• Kanzaki Yohsuke
• Sun Yi

Classifications

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• H10K59/65

  OLEDs integrated with inorganic image sensors · CPC title

• H10K50/841

  Self-supporting sealing arrangements · CPC title

• H10K59/1201

  Manufacture or treatment · CPC title

• H10K59/353

  characterised by the geometrical arrangement of the RGB subpixels · CPC title