Light emitting apparatus and method for producing the same

Patent metadata

Field	Value
Publication number	US-12396304-B2
Application number	US-202318344460-A
Country	US
Kind code	B2
Filing date	Jun 29, 2023
Priority date	Nov 29, 2007
Publication date	Aug 19, 2025
Grant date	Aug 19, 2025

Abstract

A light emitting apparatus includes: a mount substrate; one or more light emitting devices located above the mount substrate; a light conversion member located above the one or more light emitting devices; and a covering member that contains a light reflective material and covers the one or more light emitting devices. The light conversion member includes: a light emission surface facing upward, a lateral surface facing laterally, and a light receiving surface facing downward. The covering member covers the lateral surface of the light conversion member, and is interposed between the mount substrate and the one or more light emitting devices.

First claim

The invention claimed is:

1. A light emitting apparatus comprising:
a mount substrate;
one or more light emitting devices located above the mount substrate;
a light conversion member located above the one or more light emitting devices; and
a covering member that contains a light reflective material and covers the one or more light emitting devices; wherein:
the light conversion member includes:
a light emission surface facing upward,
a lateral surface facing laterally, and
a light receiving surface facing downward; and

the covering member covers the lateral surface of the light conversion member, and is interposed between the mount substrate and the one or more light emitting devices.

2. The light emitting apparatus according to claim 1 , wherein:
the light conversion member comprises an inorganic material.

3. The light emitting apparatus according to claim 1 , wherein:
the one or more light emitting devices are attached to the light conversion member via an adhesive material.

4. The light emitting apparatus according to claim 1 , wherein:
the one or more light emitting devices are mounted on the mount substrate in a flip-chip manner.

5. The light emitting apparatus according to claim 1 , wherein:
the light conversion member is plate-shaped.

6. The light emitting apparatus according to claim 1 , wherein:
in a top plan view, the one or more light emitting devices are enclosed by said light conversion member.

7. The light emitting apparatus according to claim 1 , wherein:
the covering member includes an externally exposed surface that is coplanar with the light emission surface.

8. The light emitting apparatus according to claim 1 , wherein:
the one or more light emitting devices comprise a plurality of light emitting devices; and
the light receiving surface of the light conversion member is attached to the plurality of the light emitting devices.

9. The light emitting apparatus according to claim 8 , wherein:
in a top plan view, the plurality of light emitting devices are enclosed by said light conversion member.

10. The light emitting apparatus according to claim 8 , wherein:
the light receiving surface of the light conversion member includes:
junction areas in which the plurality of the light emitting devices are attached, and
a covering area covered by the covering member.

11. The light emitting apparatus according to claim 10 , wherein:
the plurality of the light emitting devices are separated from each other, and a separation area is formed between the junction areas on the light receiving surface of the light conversion member, and
the covering area is located in the separation area.

12. The light emitting apparatus according to claim 10 , wherein:
the light conversion member includes a protrusion area that protrudes outward relative to the plurality of the light emitting devices, and
the covering area is located in the protrusion area.

13. The light emitting apparatus according to claim 8 , wherein:
the light conversion member comprises a phosphor capable of converting a wavelength of at least a part of light emitted from the one or more light emitting devices.

14. The light emitting apparatus according to claim 13 , wherein the light conversion member comprises a sintered material of an inorganic substance and the phosphor.

15. The light emitting apparatus according to claim 14 , wherein the inorganic substance comprises Al 2 O 3 , and the phosphor comprises Y 3 Al 5 O 012 .

16. The light emitting apparatus according to claim 1 , wherein:
the light reflective material comprises at least one of Al 2 O 3 , AlN, MgF, TiO 2 , ZrO 2 , Nb 2 O 5 , or SiO 2 .

17. The light emitting apparatus according to claim 1 , wherein:
in a top view, the covering member forms an outer periphery of the light emitting apparatus.

18. The light emitting apparatus according to claim 1 , wherein:
in a top view, a distance from a first outermost surface of the covering member to a corresponding first outermost surface of the light conversion member is longer than a distance from a second outermost surface of the covering member to a corresponding second outermost surface of the light conversion member.

Assignees

• Nichia Corp

Inventors

• Minato Shunsuke
• Sano Masahiko

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/923

  Bond pads having multiple stacked layers · CPC title