Two-phase immersion-cooling heat-dissipation structure having shortened evacuation route for vapor bubbles

Patent metadata

Field	Value
Publication number	US-12396131-B2
Application number	US-202318108058-A
Country	US
Kind code	B2
Filing date	Feb 10, 2023
Priority date	Feb 10, 2023
Publication date	Aug 19, 2025
Grant date	Aug 19, 2025

Abstract

A two-phase immersion-cooling heat-dissipation structure having shortened evacuation route for vapor bubbles includes an immersion-cooling substrate having a first surface and a second surface that are opposite to each other and immersion-cooling fins. The second surface contacts a heat source immersed in a two-phase coolant, and the first surface connects to the immersion-cooling fins. The immersion-cooling fins include at least one skived fin integrally formed on the first surface of the immersion-cooling substrate by skiving, and further include at least one functional fin. The functional fin is a single continuous fin extends lengthwise in a vapor bubbles evacuation direction, has a central portion corresponding in position to the heat source and upper and lower end portions located away from the heat source, and a height of the central portion is greater than at least one of a height of the upper and lower end portions.

First claim

What is claimed is:

1. A two-phase immersion-cooling heat-dissipation structure having shortened evacuation route for vapor bubbles, comprising:
an immersion-cooling substrate having a first surface and a second surface that are opposite to each other, wherein the second surface is used for contacting a heat source that is immersed in a two-phase coolant; and
a plurality of immersion-cooling fins, wherein the first surface is connected with the plurality of immersion-cooling fins, the plurality of immersion-cooling fins include at least one fin integrally formed on the first surface of the immersion-cooling substrate, and the plurality of immersion-cooling fins further include at least one functional fin;
wherein the at least one functional fin is a single continuous fin that extends lengthwise in a vapor bubbles evacuation direction, the at least one functional fin has a central portion corresponding in position to the heat source and an upper end portion and a lower end portion that are away from the heat source, and a height of the central portion is greater than at least one of a height of the upper end portion and a height of the lower end portion;
wherein an upper slope that gradually decreases in height from bottom to top is formed on the upper end portion of the at least one functional fin, and a lower slope that gradually decreases in height from top to bottom is formed on the lower end portion of the at least one functional fin.

2. The two-phase immersion-cooling heat-dissipation structure according to claim 1 , wherein a thickness of any one of the plurality of immersion-cooling fins ranges from 0.1 mm to 0.35 mm, a height of any one of the plurality of immersion-cooling fins ranges from 5 mm to 10 mm, and a gap between any two adjacent ones of the plurality of immersion-cooling fins ranges from 0.1 mm to 0.35 mm.

3. The two-phase immersion-cooling heat-dissipation structure according to claim 2 , wherein a gap between at least two adjacent ones of the plurality of immersion-cooling fins is different from a gap between another two adjacent ones of the plurality of immersion-cooling fins.

4. The two-phase immersion-cooling heat-dissipation structure according to claim 1 , wherein the plurality of immersion-cooling fins are made of copper or copper alloy.

5. The two-phase immersion-cooling heat-dissipation structure according to claim 1 , wherein a surface roughness (Ra) of each of the plurality of immersion-cooling fins is greater than 1.5 μm.

6. The two-phase immersion-cooling heat-dissipation structure according to claim 1 , further comprising: a reinforcement outer frame bonded to the immersion-cooling substrate and surrounding at least a portion of the plurality of immersion-cooling fins.

7. The two-phase immersion-cooling heat-dissipation structure according to claim 6 , wherein a plurality of through holes are formed on at least one of the immersion-cooling substrate and the reinforcement outer frame, and a plurality of spring screws are threaded through the plurality of through holes, respectively.

8. The two-phase immersion-cooling heat-dissipation structure according to claim 1 , further comprising: a highly thermally conductive structure attached to the second surface of the immersion-cooling substrate, such that the immersion-cooling substrate forms an indirect contact with the heat source through the highly thermally conductive structure, and wherein a vacuum airtight cavity is formed inside the highly thermally conductive structure, and the vacuum airtight cavity contains liquid.

Assignees

• Amulaire Thermal Tech Inc

Inventors

• Yang Ching-Ming
• Wu Chun-Te
• Chiu Yu-Wei
• Yeh Tze-Yang

Classifications

• H05K7/20809 Primary

  within server blades for removing heat from heat source · CPC title

• H05K7/203 Primary

  by immersion · CPC title