Wave control medium, wave control element, wave control member, wave control device, and manufacturing method of wave control medium

Patent metadata

Field	Value
Publication number	US-12394889-B2
Application number	US-202118038148-A
Country	US
Kind code	B2
Filing date	Oct 13, 2021
Priority date	Nov 27, 2020
Publication date	Aug 19, 2025
Grant date	Aug 19, 2025

Abstract

To provide a wave control medium that can absorb and control wave motion while achieving downsizing and wider bandwidth of a metamaterial and the like.
A wave control medium 5 includes a three-dimensional microstructure having a base 2 , a spiral part 3 , and a matching element 6 disposed between the base 2 and the spiral part 3 , in which the three-dimensional microstructure includes a material selected from any one of a metal, a dielectric, a magnetic body, a semiconductor, and a superconductor, or a combination of a plurality of these materials. The wave control medium 5 can absorb the wave motion by having the matching element 6 disposed between the base 2 and the spiral part 3 to moderate a change in the entire impedance value.

First claim

The invention claimed is:

1. A wave control medium comprising a three-dimensional microstructure having a base, a spiral part, and a matching element disposed between the base and the spiral part, wherein
the three-dimensional microstructure includes a material selected from any one of a metal, a dielectric, a magnetic body, a semiconductor, and a superconductor, or a combination of a plurality of the metal, the dielectric, the magnetic body, the semiconductor, and the superconductor.

2. The wave control medium according to claim 1 , wherein the spiral part has a multilayer structure.

3. The wave control medium according to claim 1 , wherein the spiral part has a cone shape.

4. The wave control medium according to claim 1 , further comprising at least two of the three-dimensional microstructures.

5. The wave control medium according to claim 4 , wherein the at least two of the three-dimensional microstructures have a continuous structure in which the structures are intertwined while facing each other without being in contact with each other.

6. The wave control medium according to claim 4 , wherein at least one of the three-dimensional microstructures has any one of a wire shape, a plate shape, and a sphere shape.

7. A wave control element wherein the wave control medium according to claim 1 is integrated in an array structure.

8. A wave control element wherein the wave control medium according to claim 1 is dispersedly disposed in plural numbers.

9. A wave control element comprising the wave control medium according to claim 1 , wherein the wave control element has a specific bandwidth of a response of 30% or more, and an absorption intensity in the specific bandwidth of 50% or more.

10. A wave control member comprising the wave control medium according to claim 1 .

11. A wave control device comprising a metamaterial having the wave control medium according to claim 1 .

12. A wave control device comprising an electromagnetic absorbing and/or shielding member having the wave control medium according to claim 1 .

13. A wave control device comprising a sensor having an electromagnetic absorbing and/or shielding member having the wave control medium according to claim 1 .

14. A wave control device that performs signal transmission/reception or light reception/emission using the wave control medium according to claim 1 .

15. A manufacturing method of a wave control medium, the manufacturing method comprising forming a microstructure into a three-dimensional structure using a molecular template that utilizes self-assembly of an organic substance, the microstructure including a material selected from any one of a metal, a dielectric, a magnetic body, a semiconductor, and a superconductor, or a combination of a plurality of the metal, the dielectric, the magnetic body, the semiconductor, and the superconductor, wherein the three-dimensional microstructure having a base, a spiral part, and a matching element disposed between the base and the spiral part.

Assignees

• Sony Group Corp

Inventors

• Igarashi Eri
• Kawamura Takashi

Classifications

• H01Q15/141

  Apparatus or processes specially adapted for manufacturing reflecting surfaces · CPC title

• H01Q1/362

  for broadside radiating helical antennas · CPC title

• H01P7/005

  Helical resonators; Spiral resonators · CPC title

• H01Q1/364

  using a particular conducting material, e.g. superconductor · CPC title

• H01Q15/10

  comprising three-dimensional [3D] array of impedance discontinuities, e.g. holes in conductive surfaces or conductive discs forming artificial dielectric · CPC title