Electronic device including optical sensing element

Patent metadata

Field	Value
Publication number	US-12392937-B2
Application number	US-202418668821-A
Country	US
Kind code	B2
Filing date	May 20, 2024
Priority date	Jan 26, 2022
Publication date	Aug 19, 2025
Grant date	Aug 19, 2025

Abstract

An electronic device is provided. The electronic device includes a substrate, a first light-shielding layer, a second light-shielding layer, a third light-shielding layer and an optical sensing element. The first light-shielding layer is disposed on the substrate and has a first opening. The second light-shielding layer is disposed on the first light-shielding layer and has a second opening. The third light-shielding layer is disposed on the second light-shielding layer and has a third opening. The optical sensing element is disposed on the substrate, and overlapped with the first opening. In addition, in a top-view diagram, centers of the first opening, the second opening and the third opening are separated from each other along a first direction, and the first direction is a line connecting a center of the first opening and a center of the third opening.

First claim

What is claimed is:

1. An electronic device, comprising:
a substrate;
a first light-shielding layer disposed on the substrate and having a first opening;
a second light-shielding layer disposed on the first light-shielding layer and having a second opening;
a third light-shielding layer disposed on the second light-shielding layer and having a third opening; and
an optical sensing element disposed on the substrate, and overlapped with the first opening;
wherein in a top-view diagram, centers of the first opening, the second opening and the third opening are separated from each other along a first direction, and the first direction is a line connecting a center of the first opening and a center of the third opening,
wherein in a cross-sectional diagram, the first light-shielding layer comprises a first portion and a second portion located at opposite sides of the first opening, the third light-shielding layer comprises a third portion and a fourth portion located at opposite sides of the third opening, the first portion and the third portion are located at the same side of the third opening, wherein a width of the first portion is less than a width of the second portion, and a width of the third portion is greater than a width of the fourth portion.

2. The electronic device as claimed in claim 1 , wherein the first opening is not overlapped with the third opening.

3. The electronic device as claimed in claim 1 , wherein a size of the first opening is different from a size of the third opening.

4. The electronic device as claimed in claim 1 , wherein a first distance between an inner edge of the third light-shielding layer and an edge of the substrate along a direction parallel to a surface of the substrate is greater than a second distance between an inner edge of the first light-shielding layer and the edge of the substrate along the direction.

5. The electronic device as claimed in claim 1 , wherein at least one of the first light-shielding layer, the second light-shielding layer and the third light-shielding layer comprises an organic material.

6. The electronic device as claimed in claim 1 , wherein at least one of the first light-shielding layer, the second light-shielding layer and the third light-shielding layer comprises a metal material.

7. The electronic device as claimed in claim 1 , wherein the first light-shielding layer, the second light-shielding layer and the third light-shielding layer overlap each other.

8. The electronic device as claimed in claim 1 , wherein the third portion of the third light-shielding layer at least partially overlaps the first portion of the first light-shielding layer.

9. The electronic device as claimed in claim 1 , wherein sizes of the first opening, the second opening and the third opening are different.

10. The electronic device as claimed in claim 1 , wherein the optical sensing element is overlapped with the second opening and the third opening.

11. The electronic device as claimed in claim 1 , wherein the optical sensing element is configured to receive a light which passes through at least one of the first opening, the second opening and the third opening.

Assignees

• Innolux Corp

Inventors

• Lee Te-Yu
• Liu Yu-Tsung
• Liao Wei-Ju
• Lin Po-Hsin
• Lin Chao-Yin

Classifications

• G06V40/1318

  using electro-optical elements or layers, e.g. electroluminescent sensing · CPC title

• G06V40/1324

  by using geometrical optics, e.g. using prisms (G06V40/1312 takes precedence) · CPC title

• G02B3/0056

  arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses (G02B3/0043 takes precedence; miniaturised objectives for electronic devices employing wafer level optics G02B13/0085) · CPC title

• H10F39/18

  Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors · CPC title

• H10F39/8063

  Microlenses · CPC title