Substrate processing method including thickness monitoring

Patent metadata

Field	Value
Publication number	US-12387952-B2
Application number	US-202017770653-A
Country	US
Kind code	B2
Filing date	Oct 15, 2020
Priority date	Oct 30, 2019
Publication date	Aug 12, 2025
Grant date	Aug 12, 2025

Abstract

The substrate has a plurality of chip regions each being provided with a structure to be a power device, and is provided with a to-be-processed film. The thickness profile of the to-be-processed film in the radial direction is measured by scanning with the sensor in the radial direction while the substrate is rotated. The average thickness of the thickness profile is calculated. At least one radial position where the thickness profile has an average thickness is extracted as at least one candidate position. At least one of the at least one candidate position is determined to be at least one measurement position. Processing liquid is supplied from a nozzle onto the to-be-processed film of the substrate while the substrate is rotated. The sensor monitors the time-dependent change in the thickness of the to-be-processed film in at least one measurement position while the substrate is rotated.

First claim

The invention claimed is:

1. A substrate processing method for processing at least one substrate that has a radial direction, has a plurality of chip regions each being provided with a structure to be a power device, and is provided with a to-be-processed film, the substrate processing method comprising steps of:
(a) obtaining a thickness profile of said to-be-processed film in said radial direction by scanning with a sensor in said radial direction while rotating said substrate;
(b) calculating an average thickness of said to-be-processed film from said thickness profile;
(c) identifying at least one radial position of said to-be-processed film as at least one candidate position by using said thickness profile to identify said at least one radial position at which said to-be-processed film has said average thickness calculated in said step (b);
(d) selecting at least one measurement position from said at least one candidate position;
(e) supplying processing liquid from a nozzle onto said to-be-processed film of said substrate while rotating said substrate; and
(f) monitoring a time-dependent change in a thickness of said to-be-processed film at said at least one measurement position by said sensor while rotating said substrate.

2. The substrate processing method according to claim 1 , further comprising a step of
(g) stopping supply of processing liquid onto a surface of said substrate on a basis of said thickness of said to-be-processed film at said at least one measurement position.

3. The substrate processing method according to claim 2 , wherein said step (g) is performed so that said thickness of said to-be-processed film is maintained at 20 μm or more at said at least one measurement position.

4. The substrate processing method according to claim 1 , wherein
periodic displacement in said radial direction is given to said nozzle in said step (e), and
periodic displacement in said radial direction is given to said sensor in said step (f), and timing at which said sensor comes closest to a center of said substrate is different from timing at which said nozzle comes closest to said center of said substrate.

5. The substrate processing method according to claim 1 , wherein
said at least one substrate includes a first substrate and a second substrate, and said substrate processing method is a substrate processing method of processing said first substrate by performing said steps (a) to (f) and then processing said second substrate by performing said steps (a) to (f) again, and
at least a part of said processing liquid in said step (e) for said first substrate is reused as said processing liquid in said step (e) for said second substrate.

6. The substrate processing method according to claim 5 , wherein
said second substrate is a substrate to be processed immediately after said first substrate, and
the substrate processing method further comprises a step of calculating a predicted range of said time-dependent change in said step (f) for said second substrate on a basis of a result of said step (f) for said first substrate.

7. The substrate processing method according to claim 1 , wherein
said substrate has a radius R, and
in said step (d), positive values r L and r U satisfying 0<r L <r U <R have been preset and said at least one measurement position is selected from said at least one candidate position located within a range of r L or more and r U or less from a center of said substrate.

8. The substrate processing method according to claim 1 , wherein
said step (d) includes steps of:
(d1) displaying said at least one candidate position; and
(d2) accepting an instruction as to which of said at least one candidate position is determined to be said at least one measurement position.

9. The substrate processing method according to claim 1 , wherein
said step (a) includes a step of:
(a1) accepting information on an estimated thickness of said to-be-processed film, and
in said step (a), only a thickness within a predetermined allowable range based on said estimated thickness is used for said thickness profile.

10. The substrate processing method according to claim 9 , wherein said power device has a trench gate structure.

11. A substrate processing method for processing at least one substrate that has a radial direction, has a plurality of chip regions each being provided with a structure to be a semiconductor device that is a non-power device, and is provided with a to-be-processed film, the substrate processing method comprising steps of:
(a) obtaining a thickness profile of said to-be-processed film in said radial direction by scanning with a sensor in said radial direction while rotating said substrate;
(b) calculating a minimum thickness of said to-be-processed film from said thickness profile;
(c) identifying at least one radial position of said to-be-processed film as at least one candidate position by using said thickness profile to identify said at least one radial position at which said to-be-processed film has said minimum thickness calculated in said step (b);
(d) selecting at least one measurement position from said at least one candidate position;
(e) supplying processing liquid from a nozzle onto said to-be-processed film of said substrate while rotating said substrate; and
(f) monitoring a time-dependent change in a thickness of said to-be-processed film at said at least one measurement position by said sensor while rotating said substrate.

12. The substrate processing method according to claim 11 , further comprising a step of
(g) stopping supply of processing liquid onto a surface of said substrate on a basis of said thickness of said to-be-processed film at said at least one measurement position.

13. The substrate processing method according to claim 12 , wherein said step (g) is performed so that said thickness of said to-be-processed film is reduced to 10 μm or less at said at least one measurement position.

14. The substrate processing method according to claim 11 , wherein
periodic displacement in said radial direction is given to said nozzle in said step (e), and
periodic displacement in said radial direction is given to said sensor in said step (f), and timing at which said sensor comes closest to a center of said substrate is different from timing at which said nozzle comes closest to said center of said substrate.

15. The substrate processing method according to claim 11 , wherein
said at least one substrate includes a first substrate and a second substrate, and said substrate processing method is a substrate processing method of processing said first substrate by performing said steps (a) to (f) and then processing said second substrate by performing said steps (a) to (f) again, and
at least a part of said processing liquid in said step (e) for said first substrate is reused as said processing liquid in said step (e) for said second substrate.

16. The substrate processing method according to claim 15 , wherein
said second substrate is a substrate to be processed immediately after said first substrate, and
the substrate processing method further comprises a step of calculating a predicted range of said time-dependent change in said step (f) for said second substrate on a basis of a result of said step (f) for said first substrate.

17. The substrate processing method according to claim 11 , wherein
said substrate has a radius R, and
in said step (d), positive values r L and r U satisfying 0<r L <r U <R have been preset and said at least one measurement position is selected from said at least one

Assignees

• Screen Holdings Co Ltd

Inventors

• Hinode Taiki
• Ota Takashi
• Itahara Takao
• Nakanishi Kyohei
• Shimano Tatsuya

Classifications

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/7618

  characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

• H10P72/0424

  using mainly spraying means, e.g. nozzles · CPC title

• H10P50/642 Primary

  Chemical etching · CPC title

• H10P72/0604 Primary

  Process monitoring, e.g. flow or thickness monitoring · CPC title