Generating ambient thermal image map based on device temperature data

US12385789B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12385789-B2
Application numberUS-202217950834-A
CountryUS
Kind codeB2
Filing dateSep 22, 2022
Priority dateSep 22, 2022
Publication dateAug 12, 2025
Grant dateAug 12, 2025

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  5. First independent claim

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Abstract

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A system may include temperature sensors configured to measure temperatures of devices within an industrial automation system. The devices may be disposed within enclosures separate from one or more spaces of an ambient space of the industrial automation system. The system may include thermal image sensors configured to acquire thermal imagery data associated with the ambient space. The system may include a processor configured to receive a first set of temperature data acquired by the temperature sensors over a period of time. The processor may further generate a second set of temperature data representative of one or more predicted temperatures associated with one or more additional spaces of the ambient space. The temperature model may represent expected temperatures of the one or more spaces with respect to the temperatures within the enclosures. The processor may generate a heat map visualization including one or more thermal indicators representative of the predicted temperatures.

First claim

Opening claim text (preview).

What is claimed is: 1. A method, comprising: receiving, via at least one processor, a first set of temperature data acquired by a plurality of temperature sensors, wherein the plurality of temperature sensors is configured to measure a plurality of temperatures of a plurality of devices disposed within one or more enclosures part of an industrial automation system; receiving, via the at least one processor, a set of thermal imagery data associated with one or more spaces of the industrial automation system from one or more thermal image sensors; generating, via the at least one processor, a temperature model representative of one or more expected temperatures of the one or more spaces based on the first set of temperature data and the set of thermal imagery data; receiving, via the at least one processor, a second set of temperature data acquired by the plurality of temperature sensors; generating, via the at least one processor, a third set of temperature data representative of one or more predicted temperatures associated with one or more additional spaces based on the temperature model and the second set of temperature data; and generating, via the at least one processor, a heat map visualization comprising one or more thermal indicators representative of the one or more predicted temperatures. 2. The method of claim 1 , wherein the one or more additional spaces corresponds to the one or more spaces of the industrial automation system. 3. The method of claim 1 , wherein the first set of temperature data and the set of thermal imagery data are acquired during a same period of time. 4. The method of claim 3 , wherein the first set of temperature data comprises a first plurality of timestamps, wherein the set of thermal imagery data comprises a second plurality of timestamps, and wherein generating the temperature model comprises associating the first set of temperature data with the set of thermal imagery data based on the first plurality of timestamps and the second plurality of timestamps. 5. The method of claim 4 , wherein generating the temperature model comprises determining one or more correlations between the first set of temperature data and the thermal imagery data in view of the first plurality of timestamps and the second plurality of timestamps. 6. The method of claim 1 , wherein generating the third set of temperature data comprises: receiving air flow data related to the one or more spaces with respect to the one or more additional spaces; determining one or more thermal relationships between the one or more spaces with respect to the one or more additional spaces based on the temperature model and the air flow data; and determining the third set of temperature data based on the one or more thermal relationships and the second set of temperature data. 7. The method of claim 1 , wherein the temperature model is generated based on a set of operations data comprising a speed, an average current, an input voltage, an output voltage, an on-off state of one or more industrial automation machines, a throughput metric of the industrial automation system, an airflow metric, or a combination thereof. 8. The method claim 1 , comprising overlaying the heat map visualization on an additional visualization representative of a map of the industrial automation system. 9. The method of claim 1 , comprising: receiving, via the at least one processor, a first set of locations corresponding to the first set of temperature data and a second set of locations corresponding to the second set of temperature data; and generating, via the at least one processor, the temperature model based on the first set of locations and the second set of locations. 10. The method of claim 9 , wherein the first set of locations and the second set of locations are acquired by a plurality of location sensors. 11. A system, comprising: a plurality of temperature sensors configured to measure a plurality of temperatures of a plurality of devices within an industrial automation system, wherein the plurality of devices is configured to be disposed within one or more enclosures separate from an ambient space associated with the industrial automation system; one or more thermal image sensors configured to acquire thermal imagery data associated with one or more spaces in the ambient space; a processor configured to: receive a first set of temperature data acquired by the plurality of temperature sensors over a period of time; generate a second set of temperature data representative of one or more predicted temperatures associated with one or more additional spaces in the ambient space based on a temperature model and the first set of temperature data, wherein the temperature model is representative of one or more expected temperatures of the one or more spaces with respect to one or more temperatures within the one or more enclosures; and generate a heat map visualization comprising one or more thermal indicators representative of the one or more predicted temperatures. 12. The system of claim 11 , wherein the processor is configured to: receive a third set of temperature data acquired by the plurality of temperature sensors, over an additional period of time prior to the period of time; receive a set of the thermal imagery data acquired by the one or more thermal image sensors during the additional period of time; and generate the temperature model based on the first set of temperature data and the thermal imagery data. 13. The system of claim 11 , wherein the industrial automation system comprises a plurality of industrial automation machines in communication with the plurality of industrial automation devices, wherein the plurality of industrial automation machines comprises one or more motors and the plurality of industrial automation devices comprises one or more variable frequency drives configured to control speeds of the one or more motors. 14. The system of claim 13 , wherein the one or more enclosures are disposed in a room separate from the plurality of industrial automation machines. 15. The system of claim 11 , wherein the one or more thermal image sensors comprise infrared cameras configured to measure infrared energy associated with the one or more spaces of the industrial automation system. 16. The system of claim 11 , wherein the one or more additional spaces corresponds to the one or more spaces of the industrial automation system. 17. The system of claim 11 , wherein the temperature model represents one or more correlations between the first set of temperature data and the thermal imagery data. 18. One or more non-transitory, computer readable media containing instructions that, when executed by one or more processors, cause the one or more processors to: receive a first set of temperature data acquired by a first plurality of temperature sensors, wherein the first plurality of temperature sensors is configured to measure a first plurality of temperatures of a first plurality of devices disposed within one or more enclosures part of a first industrial automation system; receive a set of thermal imagery data associated with one or more spaces of the first industrial automation system from one or more thermal image sensors; generate a temperature model representative of one or more expected temperatures of the one or more spaces of the first industrial automation system based on the first set of temperature data and the set of thermal imagery data; receive a second set of temperature data acquired by a second plurality of temperature sensors, wherein t

Assignees

Inventors

Classifications

  • Transforming infrared radiation (cameras or camera modules for generating image signals from infrared radiation H04N23/20; circuitry of SSIS for transforming infrared radiation into image signals H04N25/20) · CPC title

  • Temperature by averaging, e.g. by scan · CPC title

  • Imaging · CPC title

  • G01J5/485Primary

    Temperature profile · CPC title

  • G01J5/025Primary

    Interfacing a pyrometer to an external device or network; User interface · CPC title

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What does patent US12385789B2 cover?
A system may include temperature sensors configured to measure temperatures of devices within an industrial automation system. The devices may be disposed within enclosures separate from one or more spaces of an ambient space of the industrial automation system. The system may include thermal image sensors configured to acquire thermal imagery data associated with the ambient space. The system …
Who is the assignee on this patent?
Rockwell Automation Tech Inc
What technology area does this patent fall under?
Primary CPC classification G01J5/485. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Aug 12 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).