Avoiding trapping unused additive manufacturing materials during production

US12384116B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12384116-B2
Application numberUS-202217816483-A
CountryUS
Kind codeB2
Filing dateAug 1, 2022
Priority dateAug 1, 2022
Publication dateAug 12, 2025
Grant dateAug 12, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

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The present disclosure provides techniques for analyzing trapped unused materials during AM. For example, given a geometry or shape to be manufactured using one or more AM materials, a tool path for solidifying the one or more AM materials is generated to turn the geometry into a physical object based on one or more manufacturing parameters related to AM resolutions. A processing device may compute a simulated manufactured geometry (e.g., a realistic representation of the actual shape of the corresponding physical object to be produced) based on the tool path and the one or more manufacturing parameters. The processing device analyzes the simulated manufactured geometry for a portion of removable AM materials trapped inside the simulated manufactured geometry. The processing device then generates a report regarding the portion of the removable AM materials trapped inside the simulated manufactured geometry.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of additive manufacturing (AM), the method comprising: receiving a geometry to be manufactured using one or more AM materials; generating a tool path for solidifying the one or more AM materials to turn the geometry into a physical object based on one or more manufacturing parameters related to AM resolutions; computing, by a processing device, a simulated manufactured geometry based on the tool path and the one or more manufacturing parameters related to AM resolutions; analyzing, by the processing device, the simulated manufactured geometry for a portion of removable AM materials trapped inside the simulated manufactured geometry, wherein analyzing the simulated manufactured geometry for the portion of removable AM materials trapped inside the simulated manufactured geometry comprises: computing one or more over-deposited features based on the one or more manufacturing parameters related to the AM resolutions; and comparing the one or more over-deposited features to a cavity threshold for releasing the portion of removable AM materials, wherein the one or more over-deposited features cause a clog by enclosing an opening of the simulated manufactured geometry to be less than an allowable opening threshold; generating a report regarding the portion of removable AM materials trapped inside the simulated manufactured geometry; modifying the geometry to be manufactured based on the simulated manufactured geometry and the portion of the removable AM materials trapped to avoid the clog using the one or more manufacturing parameters related to AM resolutions; and controlling the AM based on the modified geometry. 2. The method of claim 1 , wherein: the one or more AM materials comprises at least one of: meltable powders or photosensitive liquids, and the portion of removable AM materials comprises a non-solidified portion of the one or more AM materials. 3. The method of claim 1 , wherein: the one or more AM materials comprise fusible materials comprising at least a first material fusible at a first temperature, and a second, support, material fusible at a second temperature lower than the first temperature, and the portion of removal AM materials comprises a non-solidified portion of the first material and a portion of the second material to be liquefied at the second temperature. 4. The method of claim 1 , wherein modifying the geometry comprises modifying the one or more over-deposited features based on the one or more manufacturing parameters such that an updated simulated manufactured geometry of the modified geometry includes similar opening sizes at the one or more over-deposited features of the received geometry. 5. The method of claim 1 , further comprising: updating the simulated manufactured geometry using a different set of one or more manufacturing parameters related to AM resolutions, wherein the one or more manufacturing parameters comprise at least one of: a dimension parameter that changes a minimal solidification size, an input power parameter that changes a minimal solidification size, or an orientation of a manufacturing direction. 6. The method of claim 5 , further comprising: modifying the received geometry based on the simulated manufactured geometry and the portion of the removable AM materials trapped to avoid the clog using the different set of one or more manufacturing parameters, wherein the modifying is in response to a user command. 7. An apparatus for additive manufacturing (AM), the apparatus comprising: a memory; a processing device unit operatively coupled to the memory, the processing device unit to: receive a geometry to be manufactured using one or more AM materials; generate a tool path for solidifying the one or more AM materials to turn the geometry into a physical object based on one or more manufacturing parameters related to AM resolutions; compute, by a processing device, a simulated manufactured geometry based on the tool path and the one or more manufacturing parameters related to AM resolutions; analyze, by the processing device, the simulated manufactured geometry for a portion of removable AM materials trapped inside the simulated manufactured geometry by: computing one or more over-deposited features based on the one or more manufacturing parameters related to the AM resolutions; and comparing the one or more over-deposited features to a cavity threshold for releasing the portion of removable AM materials, wherein the one or more over-deposited features cause a clog by enclosing an opening of the simulated manufactured geometry to be less than an allowable opening threshold; generate a report regarding the portion of removable AM materials trapped inside the simulated manufactured geometry; modify the geometry to be manufactured based on the simulated manufactured geometry and the portion of the removable AM materials trapped to avoid the clog using the one or more manufacturing parameters related to AM resolutions; and control the AM based on the modified geometry. 8. The apparatus of claim 7 , wherein: the one or more AM materials comprises at least one of: meltable powders or photosensitive liquids, and the portion of removable AM materials comprises a non-solidified portion of the one or more AM materials. 9. The apparatus of claim 7 , wherein: the one or more AM materials comprise fusible materials comprising at least a first material fusible at a first temperature, and a second, support, material fusible at a second temperature lower than the first temperature, and the portion of removal AM materials comprises a non-solidified portion of the first material and a portion of the second material to be liquefied at the second temperature. 10. The apparatus of claim 7 , wherein the processing device is to modify the geometry by modifying the one or more over-deposited features based on the one or more manufacturing parameters such that an updated simulated manufactured geometry of the modified geometry includes similar opening sizes at the one or more over-deposited features of the received geometry. 11. The apparatus of claim 7 , wherein the processing device is further to: update the simulated manufactured geometry using a different set of one or more manufacturing parameters related to AM resolutions, wherein the one or more manufacturing parameters comprise at least one of: a dimension parameter that changes a minimal solidification size, an input power parameter that changes a minimal solidification size, or an orientation of a manufacturing direction. 12. The apparatus of claim 11 , wherein the processing device is further to: modify the received geometry based on the simulated manufactured geometry and the portion of the removable AM materials trapped to avoid the clog using the different set of one or more manufacturing parameters, wherein the modifying is in response to a user command. 13. A non-transitory computer-readable storage medium having instructions stored thereon that, when executed by a processing device for additive manufacturing (AM), cause the processing device to: receive a geometry to be manufactured using one or more AM materials; generate a tool path for solidifying the one or more AM materials to turn the geometry into a physical object based on one or more manufacturing parameters related to AM resolutions; compute, by a processing device, a simulated manufactured geometry based on the tool path and the one or more manufacturing parameters related to AM resolutions; analyze, by the processing device, the simulated manufactured geometry for a portion of removable AM materials trapped inside the simulated

Assignees

Inventors

Classifications

  • Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof · CPC title

  • Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

  • for controlling or regulating additive manufacturing processes · CPC title

  • using layers of powder being selectively joined, e.g. by selective laser sintering or melting · CPC title

  • Means for applying layers · CPC title

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Frequently asked questions

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What does patent US12384116B2 cover?
The present disclosure provides techniques for analyzing trapped unused materials during AM. For example, given a geometry or shape to be manufactured using one or more AM materials, a tool path for solidifying the one or more AM materials is generated to turn the geometry into a physical object based on one or more manufacturing parameters related to AM resolutions. A processing device may com…
Who is the assignee on this patent?
Palo Alto Res Ct Inc, Xerox Corp
What technology area does this patent fall under?
Primary CPC classification B29C64/393. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 12 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).