Antenna device

Patent metadata

Field	Value
Publication number	US-12381306-B2
Application number	US-202318099918-A
Country	US
Kind code	B2
Filing date	Jan 21, 2023
Priority date	Jul 27, 2020
Publication date	Aug 5, 2025
Grant date	Aug 5, 2025

Abstract

The present invention relates to an antenna device and, particularly, comprises: a radiation cover; a plurality of radiation elements which are arranged on the front surface of the radiation cover so as to be exposed to outside air and which implement beamforming; and an antenna housing body on which the radiation cover is provided, wherein the heat, which is generated by a heating element arranged behind the radiation elements and the radiation cover, is released to the front of the antenna housing body through the front surface of the radiation cover and the radiation elements which are exposed to outside air, and thus the radiation performance of a product is remarkably improved, and the manufacturing cost of the product is reduced.

First claim

The invention claimed is:

1. An antenna device comprising:
a heat-dissipation cover;
a plurality of radiation elements disposed on a front surface of the heat-dissipation cover and directly exposed to outside air without being covered, and configured to implement beamforming; and
an antenna housing body on which the heat-dissipation cover is installed,
wherein heat generated from the radiation elements and heating elements disposed behind the heat-dissipation cover is discharged forward from the antenna housing body through at least any one of the radiation element exposed to the outside air and the front surface of the heat-dissipation cover,
wherein front surfaces of a plurality of radio frequency (RF) filters and front surfaces of a plurality of PSU elements are disposed in direct contact with a rear surface of the heat-dissipation cover.

2. The antenna device of claim 1 , wherein the plurality of radiation elements are adopted as any one of a dipole type dipole antenna and a patch type patch antenna.

3. The antenna device of claim 1 , wherein the plurality of radiation elements includes some radiation elements each comprising a patch plate made of a conductive material and a pair of feed terminals made of the conductive material connected to the patch plate.

4. The antenna device of claim 3 , wherein the dielectric molding material is adopted as a predetermined thermal conductive material so that the heat generated between the antenna housing body and the heat-dissipation cover is transmitted forward from the antenna housing body in a thermal conduction method.

5. The antenna device of claim 4 , wherein the predetermined thermal conductive material includes an Ultem material.

6. The antenna device of claim 3 , wherein the plurality of radiation elements are bonded on the front surface of the heat-dissipation cover via a predetermined adhesive material.

7. The antenna device of claim 3 , wherein a plurality of positioning protrusions are formed to protrude forward from the front surface of the heat-dissipation cover, and
the plurality of radiation elements are press-fitted into and coupled to the plurality of positioning protrusions, respectively.

8. The antenna device of claim 3 , wherein the plurality of radiation elements are bonded to the front surface of the heat-dissipation cover via a predetermined adhesive material and press-fitted into and coupled to a plurality of positioning protrusions formed to protrude forward from the front surface of the heat-dissipation cover.

9. The antenna device of claim 3 , wherein a feed terminal through hole passing through the heat-dissipation cover in a front-rear direction is formed, and
the plurality of radiation elements are connected to an antenna sub-board disposed in direct contact with the rear surface of the heat-dissipation cover after each of the pair of feed terminals passes through the feed terminal through hole.

10. The antenna device of claim 3 , wherein a rear surface of the dielectric molding material is fixed to and in direct contact with the front surface of the heat-dissipation cover to minimize thermal conduction resistance.

11. The antenna device of claim 3 ,
wherein the patch plate and the pair of feed terminals are insert-injection-molded by a dielectric molding material having a predetermined thermal conductivity and a predetermined permittivity.

12. The antenna device of claim 1 , wherein a fine heat-dissipation uneven portion which increases a heat-dissipation surface area of the remaining portion except for a portion of the front surface of the heat-dissipation cover in contact with the plurality of radiation elements is integrally formed on the heat-dissipation cover.

13. The antenna device of claim 12 , wherein the fine heat-dissipation uneven portion is provided in the form of a plurality of ribs protruding a predetermined length from the front surface of the heat-dissipation cover and formed lengthily in a vertical direction.

14. The antenna device of claim 13 , wherein a plurality of flat installation portions to which each of a plurality of heat-dissipation elements is surface-fixed is formed on the front surface of the heat-dissipation cover, and
the fine heat-dissipation uneven portion includes:
a first fine uneven portion formed between the plurality of flat installation portions; and
a second fine uneven portion formed outside the plurality of flat installation portions.

15. The antenna device of claim 14 , wherein a power supply unit (PSU) having a plurality of PSU elements mounted on a front surface thereof is correspondingly disposed on the rear surface of the heat-dissipation cover on which the second fine uneven portion is formed.

16. The antenna device of claim 1 , wherein the plurality of RF filters are adopted as any one of a cavity filter and a ceramic waveguide filter.

17. The antenna device of claim 1 , wherein a heat-dissipation cover heat accommodating portion is further formed to be recessed forward from the rear surface of the heat-dissipation cover so that the front surfaces of the plurality of PSU elements are accommodated in direct contact therewith, and
the front surfaces of the plurality of PSU elements are accommodated to be in surface thermal contact with the heat-dissipation cover heat accommodating portion.

18. The antenna device of claim 1 , wherein the heat-dissipation cover is mold-manufactured in a die-casting method with a metal molding material of any one of an aluminum (Al) material or a magnesium (Mg) material.

19. An antenna device comprising:
a heat-dissipation cover;
a plurality of radiation elements disposed on a front surface of the heat-dissipation cover, exposed to outside air, and configured to implement beamforming;
an antenna housing body on which the heat-dissipation cover is installed and having a plurality of heat-dissipation fins integrally formed on a rear surface thereof; and
a main board disposed to be laminated in an internal space between the antenna housing body and the heat-dissipation cover,
wherein heat generated between the main board and the heat-dissipation cover is branched and discharged to a front side on which the heat-dissipation cover is disposed and a rear side on which the plurality of heat-dissipation fins are disposed, and
wherein front surfaces of a plurality of radio frequency (RF) filters and front surfaces of a plurality of PSU elements are disposed in direct contact with the rear surface of the heat-dissipation cover.

20. An antenna device comprising:
a heat-dissipation cover;
a plurality of radiation elements disposed on a front surface of the heat-dissipation cover, exposed to outside air, and configured to implement beamforming; and
an antenna housing body on which the heat-dissipation cover is installed and having a plurality of heat-dissipation fins integrally formed on a rear surface thereof,
wherein at least some of heat generated from the radiation elements and heating elements disposed behind the heat-dissipation cover is discharged forward from the antenna housing body through at least any one of the radiation element exposed to the outside air and the front surface of the heat-dissipation cover, and
at least some of the heating elements disposed inside the antenna housing body are discharged rearward from the antenna housing body via the plurality of heat-dissipation fins formed on the rear surface of the antenna housing body,
wherein the plurality of radiation elements includes some radiation elements each comprising a patch pla

Assignees

• Kmw Inc

Inventors

• Kim Duk Yong
• Ji Kyo Sung
• Ryu Chi Back
• Choi Oh Seog
• Kang Seong Man
• Seo Yong Won

Classifications

• H01Q21/065

  Patch antenna array · CPC title

• H01Q1/246

  specially adapted for base stations · CPC title

• H01Q21/061

  Two dimensional planar arrays · CPC title

• H01Q1/02 Primary

  Arrangements for de-icing; Arrangements for drying-out {; Arrangements for cooling; Arrangements for preventing corrosion} · CPC title