Light-emitting device with circular polarizing plate over bonding layer

Patent metadata

Field	Value
Publication number	US-12380815-B2
Application number	US-202318370927-A
Country	US
Kind code	B2
Filing date	Sep 21, 2023
Priority date	Oct 28, 2014
Publication date	Aug 5, 2025
Grant date	Aug 5, 2025

Abstract

A highly portable and highly browsable light-emitting device is provided. A light-emitting device that is less likely to be broken is provided. The light-emitting device has a strip-like region having high flexibility and a strip-like region having low flexibility that are arranged alternately. In the region having high flexibility, a light-emitting panel and a plurality of spacers overlap with each other. In the region having low flexibility, the light-emitting panel and a support overlap with each other. When the region having high flexibility is bent, the angle between normals of facing planes of the two adjacent spacers changes according to the bending of the light-emitting panel; thus, a neutral plane can be formed in the light-emitting panel or in the vicinity of the light-emitting panel.

First claim

The invention claimed is:

1. A semiconductor device comprising:
a flexible substrate;
a first insulating layer over the flexible substrate;
a thin film transistor over the first insulating layer;
a second insulating layer over the thin film transistor;
a lower electrode over the second insulating layer, and electrically connected to the thin film transistor;
a third insulating layer over a part of the lower electrode;
an electroluminescence layer over the lower electrode;
an upper electrode over the electroluminescence layer and the third insulating layer;
a first bonding layer over the upper electrode;
a first conductive layer over the first bonding layer;
a fourth insulating layer over the first conductive layer;
a second conductive layer over the fourth insulating layer;
a fifth insulating layer over the second conductive layer;
a second bonding layer over the fifth insulating layer; and
a circular polarizing plate over the second bonding layer.

2. The semiconductor device according to claim 1 , further comprising a third bonding layer interposed between the flexible substrate and the first insulating layer.

3. The semiconductor device according to claim 1 , further comprising another flexible substrate interposed between the second bonding layer and the circular polarizing plate.

4. The semiconductor device according to claim 1 , further comprising a coloring layer and a light-blocking layer between the upper electrode and the fourth insulating layer.

5. The semiconductor device according to claim 1 , wherein the first conductive layer intersects with the second conductive layer.

Assignees

• Semiconductor Energy Lab

Inventors

• Hiroki Masaaki
• Endo Akio

Classifications

• H10K50/8428

  Vertical spacers, e.g. arranged between the sealing arrangement and the OLED · CPC title

• H10K59/12

  Active-matrix OLED [AMOLED] displays · CPC title

• H10K59/873

  Encapsulations · CPC title

• H10K59/8723

  Vertical spacers, e.g. arranged between the sealing arrangement and the OLED · CPC title

• H10K2102/311

  Flexible OLED · CPC title