Input sensing circuit and display device including the same
US-11387293-B2 · Jul 12, 2022 · US
US12379817B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12379817-B2 |
| Application number | US-202118704014-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 29, 2021 |
| Priority date | Dec 29, 2021 |
| Publication date | Aug 5, 2025 |
| Grant date | Aug 5, 2025 |
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A touch panel includes: a first metal wire formed on an underlayer; an insulating film formed to cover the first metal wire; and a second metal wire formed on the insulating film. The second metal wire has: a first pattern extending in a first direction; and a plurality of second patterns formed to be insulated from the first pattern. The first metal wire has: a bridge pattern connecting together, in a second direction, a pair of second patterns arranged to sandwich the first pattern; and a dummy pattern formed to be insulated from the bridge pattern, the second direction intersecting with the first direction, and the pair of second patterns being included in the plurality of second patterns.
Opening claim text (preview).
The invention claimed is: 1. A touch panel, comprising: a first metal wire formed on an underlayer; an insulating film formed to cover the first metal wire; and a second metal wire formed on the insulating film, wherein the second metal wire has: a first pattern extending in a first direction, and a plurality of second patterns formed to be insulated from the first pattern, the first metal wire has: a bridge pattern connecting together, in a second direction, a pair of second patterns arranged to sandwich the first pattern, and a dummy pattern formed to be insulated from the bridge pattern, the second direction intersecting with the first direction, and the pair of second patterns being included in the plurality of second patterns, the bridge pattern is formed in a V-shaped mesh pattern as a whole, each of the first pattern, the second pattern, and the dummy pattern is formed in a mesh pattern, and the dummy pattern is positioned to overlap with the first pattern and the second pattern as a whole. 2. The touch panel according to claim 1 , wherein the dummy pattern is electrically connected to the first pattern and the second pattern, and a portion of the dummy pattern connected to the first pattern and another portion of the dummy pattern connected to the second pattern are insulated from each other. 3. The touch panel according to claim 1 , wherein the first metal wire has a multilayer structure including titanium, aluminum, and titanium. 4. A touch panel manufacturing method, comprising: forming step of forming a first metal wire having a bridge pattern and a dummy pattern on an underlayer; covering the bridge pattern with a resist and removing a product produced on the underlayer during the forming of the first metal wire; delaminating the resist from the bridge pattern; forming an insulating film that covers the first metal wire; and forming step of forming a second metal wire on the insulating film, wherein the second metal wire has: a first pattern extending in a first direction, and a plurality of second patterns formed to be insulated from the first pattern, the bridge pattern connects together, in a second direction, a pair of second patterns arranged to sandwich the first pattern, the second direction intersecting with the first direction, the pair of second patterns being included in the plurality of second patterns, and the dummy pattern is insulated from the bridge pattern. 5. The touch panel according to claim 2 , wherein the insulating film has a contact hole, and the dummy pattern is electrically connected to the first pattern and the second pattern through the contact hole.
Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title
using a single layer of sensing electrodes · CPC title
Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material · CPC title
Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate · CPC title
using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes · CPC title
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