Systems and methods for thermal processing of a substrate
US-10115900-B2 · Oct 30, 2018 · US
US12379159B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12379159-B2 |
| Application number | US-201916519724-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 23, 2019 |
| Priority date | Jul 23, 2018 |
| Publication date | Aug 5, 2025 |
| Grant date | Aug 5, 2025 |
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A drying chamber for drying a substrate patterned with display areas wetted by OLED materials dissolved or suspended in a volatile carrier liquid and separated from one another by dry boundary regions. A mask adjusts drying rate of the carrier liquid during vacuum extraction using vapor-transmissive areas opposite the wet areas and vapor-barrier regions opposite the dry boundary regions, or by confining the wet areas collectively in a chamber volume small enough to quickly saturate with the carrier liquid before vacuum extraction.
Opening claim text (preview).
What is claimed is: 1. A drying chamber comprising: a substrate support disposed within an enclosure, the substrate support having a support surface; a gas source coupled to the enclosure; a vacuum source coupled to a ceiling of the enclosure; a movable mask having vapor-transmissive areas and vapor-barrier regions disposed across the support surface of the substrate support within the enclosure and spaced apart from a ceiling of the enclosure to provide an adjustable distance between the mask and the support surface; and a gas distribution element disposed between the mask and the vacuum source, the gas distribution element comprising a vapor barrier surrounding a gap between the mask and the gas distribution element. 2. The drying chamber of claim 1 , wherein the mask has mask supports that extend outside the enclosure. 3. The drying chamber of claim 2 , wherein the mask supports are located on two opposite sides of the mask. 4. The drying chamber of claim 1 , wherein the gas source is coupled to the enclosure at a location that provides a gas flow outside the vapor barrier. 5. The drying chamber of claim 1 , wherein the mask includes a wall extending from a proximate surface of the mask toward the support surface. 6. The drying chamber of claim 1 , wherein the substrate support includes temperature-control elements. 7. The drying chamber of claim 1 , wherein the mask comprises a rigid material disposed over and spaced apart from the substrate. 8. The drying chamber of claim 1 , wherein each vapor-transmissive area has a single opening, a plurality of openings, a mesh, a screen, or a porous material. 9. A method for drying a substrate having wet areas wet with a carrier liquid separated by dry boundary regions, the method comprising: orienting a mask and a gas distribution element having a vapor barrier relative to the substrate within an enclosure, the mask having vapor-transmissive areas and vapor-barrier regions; supporting the mask on movable mask supports located on opposite sides of the mask to vary a gap between the mask and a ceiling of the enclosure; positioning the vapor barrier to surround a gap between the mask and the gas distribution element; and drawing the carrier liquid from the wet areas of the substrate through the vapor-transmissive areas of the mask using a vacuum port coupled to the ceiling of the enclosure. 10. The method of claim 9 , wherein orienting a mask relative to the substrate positions the vapor-transmissive areas opposite the wet areas and the vapor-barrier regions opposite the dry boundary regions. 11. The method of claim 10 , further comprising setting a gap between the substrate and the mask. 12. The method of claim 9 , wherein the gas distribution element is perforated, and the drawing the carrier liquid from the wet areas of the substrate comprises passing the carrier liquid through the perforated gas-distribution element. 13. The method of claim 12 , wherein each of the wet areas are of a first shape and each of the vapor-transmissive areas extend over a similar second shape, the method further comprising aligning the wet areas relative to the vapor-transmissive areas.
Temperature; Pressure · CPC title
Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title
Thermal treatment, e.g. annealing in the presence of a solvent vapour · CPC title
the products to be dried being disposed on one or more containers, which may have at least partly gas-previous walls, e.g. trays or shelves in a stack (F26B9/003 takes precedence; in combination with duct systems F26B21/00) · CPC title
for drying materials in a batch operation in an enclosure having a plurality of shelves which may be heated (F26B5/045 takes precedence) · CPC title
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