Adhesive for endoscope, cured product thereof, endoscope, and method for manufacturing the same
US-2021380834-A1 · Dec 9, 2021 · US
US12378450B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12378450-B2 |
| Application number | US-202318169330-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 15, 2023 |
| Priority date | Sep 29, 2020 |
| Publication date | Aug 5, 2025 |
| Grant date | Aug 5, 2025 |
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An object of the present invention to provide an adhesive for an endoscope and a cured product of the adhesive, and an endoscope and a method for producing the endoscope. The adhesive is able to maintain sufficient adhesive strength even when exposed to high temperature for a long time in a state of being used for fixation of a member or subjected to powerful sterilization treatment with ozone water or the like and is suitable for use in fixing a member constituting the endoscope. The adhesive for an endoscope includes an epoxy resin, an epoxy resin curing component, and a radical scavenger.
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What is claimed is: 1. An adhesive for an endoscope, comprising components (A) to (C) below, Component (A): an epoxy resin Component (B): an epoxy resin curing component Component (C): a radical scavenger wherein the component (A) includes at least one of a bisphenol A epoxy resin, a bisphenol F epoxy resin, or a phenol novolac epoxy resin, the component (B) includes at least one of a phosphorus-containing compound, a polythiol compound, a dicyandiamide compound, a phenol compound, a polyamine compound having an unsubstituted amino group, an acid anhydride compound, or an imidazole compound, and the component (C) includes at least one of components (C-1) to (C-7) below, Component (C-1): a compound represented by general formula (C-1) below Component (C-2): a compound represented by general formula (C-2) below Component (C-3): a compound represented by formula (C-3) below Component (C-4): a compound represented by general formula (C-4) below Component (C-5): a compound represented by general formula (C-5) below Component (C-6): a compound having a structure represented by general formula (C-6) below Component (C-7): a compound having a structure represented by general formula (C-7) below where R 1 and R 2 each represent a hydrogen atom, an aliphatic group, an acyl group, an aliphatic oxycarbonyl group, an aromatic oxycarbonyl group, an aliphatic sulfonyl group, or an aromatic sulfonyl group, R 3 represents an aliphatic group, an aliphatic oxy group, an aromatic oxy group, an aliphatic thio group, an aromatic thio group, an acyloxy group, an aliphatic oxycarbonyloxy group, an aromatic oxycarbonyloxy group, a substituted amino group, a heterocyclic group, or a hydroxy group, R 1 and R 2 , R 2 and R 3 , or R 1 and R 3 may be bonded to each other to form a five- to seven-membered ring but do not form a piperidine skeleton, provided that R 1 and R 2 are not simultaneously hydrogen atoms and have a total of 7 or more carbon atoms, and R 1 , R 2 , and R 3 include no unsubstituted amino groups, where R 4 to R 7 each represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or an aryl group having 6 to 15 carbon atoms, where R 8 and R 9 each represent an alkyl group, an aryl group, an alkoxy group, an aryloxy group, or a halogen atom, R 10 represents an alkyl group or an aryl group, and at least two of R 8 , R 9 , and R 10 may be linked to each other via a divalent or higher valent group or a single bond, R 11 —S—R 12 general formula (C-5) where R 11 and R 12 each represent an alkyl group, where R 13 to R 16 each represent a hydrogen atom or an alkyl group having 1 to 12 carbon atoms, R 17 represents a hydrogen atom, an alkyl group having 1 to 18 carbon atoms, or OR 18 , where R 18 represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms, and * represents a bonding site, provided that R 13 to R 16 are not simultaneously hydrogen atoms, where R 19 and R 20 each represent a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, or an aralkyl group having 7 to 36 carbon atoms, and * represents a bonding site. 2. The adhesive for an endoscope according to claim 1 , wherein the component (C) includes at least one of the component (C-6) or the component (C-7). 3. The adhesive for an endoscope according to claim 1 , wherein the component (C) includes the component (C-6). 4. The adhesive for an endoscope according to claim 1 , wherein the component (C-6) includes at least one of a component (C-6-1) below or a component (C-6-2) below, Component (C-6-1): a compound represented by general formula (C-6-1) below Component (C-6-2): a compound having a constituent represented by general formula (C-6-2) below where R 13 to R 17 respectively have the same definitions as R 13 to R 17 in general formula (C-6), q represents an integer of 2 or greater, D1 represents a q-valent linking group, r represents an integer, Q represents an (s+2)-valent linking group, and s represents 1 or 2. 5. The adhesive for an endoscope according to claim 1 , wherein the component (C-7) includes at least one of a component (C-7-1) below or a component (C-7-2) below, Component (C-7-1): a compound represented by general formula (C-7-1) below Component (C-7-2): a compound represented by general formula (C-7-2) below where R 19 and R 20 respectively have the same definitions as R 19 and R 20 in general formula (C-7), L represents a single bond or a divalent linking group, t represents an integer of 2 to 4, A 1 represents a divalent to tetravalent linking group, R 21 to R 24 each have the same definition as R 19 , and R 25 represents a reactive organic substituent. 6. A cured product obtained by curing the adhesive for an endoscope according to claim 1 . 7. An endoscope comprising a member fixed with the cured product according to claim 6 . 8. A method for producing an endoscope, comprising fixing a member by using the adhesive for an endoscope according to claim 1 .
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