Polishing head and polishing apparatus

US12377516B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12377516-B2
Application numberUS-202117796844-A
CountryUS
Kind codeB2
Filing dateJan 7, 2021
Priority dateFeb 5, 2020
Publication dateAug 5, 2025
Grant dateAug 5, 2025

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The disclosed subject matter relates to a polishing head for pressing a polishing tool against a substrate, such as a wafer. Further, the disclosed subject matter relates to a polishing apparatus for polishing a substrate with such a polishing head. A polishing head includes an annular elastic member configured to press a polishing tool against the substrate, and a pressing-tool body having a pressing surface configured to press the polishing tool against the substrate via the elastic member, wherein the pressing surface has a first fitting groove in which a first portion of the elastic member fits, the first portion ( 41 ) protrudes from the pressing surface, the elastic member is put on the pressing-tool body ( 43 ) with the elastic member elastically deformed, and the polishing head is configured to press the polishing tool against the substrate by the first portion.

First claim

Opening claim text (preview).

The invention claimed is: 1. A polishing head for polishing a substrate, comprising: an annular elastic member configured to press a polishing tool against the substrate; and a pressing-tool body having a pressing surface configured to press the polishing tool against the substrate via the elastic member, wherein a first portion of the elastic member is inset into the a first fitting groove of the pressing surface, the first portion being in tight contact with the first fitting groove and being out of contact with a region of the pressing surface other than the first fitting groove, the first portion protrudes from the pressing surface, the elastic member is put on the pressing-tool body with the elastic member elastically deformed, and the polishing head the first portion in the first fitting groove is configured to press the polishing tool against the substrate by the first portion. 2. The polishing head according to claim 1 , wherein the elastic member is detachably put on the pressing-tool body. 3. The polishing head according to claim 1 , wherein the elastic member has a circular cross section. 4. The polishing head according to claim 3 , wherein the first fitting groove has a semi-circular cross section in tight contact with the circular cross section of the first portion. 5. The polishing head according to claim 1 , wherein the elastic member is covered with a coating layer containing a fluororesin. 6. The polishing head according to claim 1 , wherein the pressing-tool body further has a tapered surface extending obliquely from the pressing surface. 7. The polishing head according to claim 1 , wherein a side surface of the pressing-tool body has a second fitting groove in which a second portion of the elastic member fits, the side surface being separated from the pressing surface, and the second fitting groove extending in a longitudinal direction of the polishing tool. 8. The polishing head according to claim 1 wherein the pressing-tool body has a protrusion on a side surface of the pressing-tool body, the side surface being separated from the pressing surface, and the protrusion supports the elastic member. 9. The polishing head according to claim 1 , wherein the first fitting groove comprises a plurality of first fitting grooves located away from each other, and the first portion comprises a plurality of first portions fitting in the plurality of first fitting grooves, respectively. 10. The polishing head according to claim 1 , wherein the first fitting groove has an arc shape having the same curvature as a curvature of the substrate. 11. A polishing apparatus comprising: a substrate holder configured to hold a substrate; and the polishing head, according to claim 1 , configured to press a polishing tool against the substrate to polish the substrate. 12. The polishing head according to claim 1 , wherein the first portion has a convex cross section, and the first fitting groove has a concave cross section that conforms with the convex cross section of the first portion and is in tight contact with the convex cross section of the first portion. 13. The polishing head according to claim 1 , wherein a longitudinal direction of the first portion is parallel with the first fitting groove. 14. The polishing head according to claim 1 , wherein the first portion and the first fitting groove extend obliquely across the pressing surface.

Assignees

Inventors

Classifications

  • Grinding heads for working on plane surfaces · CPC title

  • B24B21/08Primary

    Pressure shoes; {Pressure members, e.g.} backing belts · CPC title

  • Headstocks; Working-spindles; Features relating thereto · CPC title

  • of thin, brittle parts, e.g. semiconductors, wafers · CPC title

  • by liquid or gas pressure (B24B47/16 takes precedence) · CPC title

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Frequently asked questions

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What does patent US12377516B2 cover?
The disclosed subject matter relates to a polishing head for pressing a polishing tool against a substrate, such as a wafer. Further, the disclosed subject matter relates to a polishing apparatus for polishing a substrate with such a polishing head. A polishing head includes an annular elastic member configured to press a polishing tool against the substrate, and a pressing-tool body having a p…
Who is the assignee on this patent?
Ebara Corp
What technology area does this patent fall under?
Primary CPC classification B24B21/08. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 05 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).