Device for manufacturing side line, method of manufacturing side line and method of manufacturing display device

Patent metadata

Field	Value
Publication number	US-12376274-B2
Application number	US-202117502985-A
Country	US
Kind code	B2
Filing date	Oct 15, 2021
Priority date	Nov 20, 2019
Publication date	Jul 29, 2025
Grant date	Jul 29, 2025

Abstract

According to an aspect of the present disclosure, a device for manufacturing a side line includes a stage on which a substrate is loaded, a side guide configured to be disposed adjacent to a side portion of the substrate loaded on the stage, and a printing unit configured to print a conductive paste on the substrate.

First claim

What is claimed is:

1. A device for manufacturing a side line, the device comprising:
a stage on which a substrate is loaded;
a side guide configured to be disposed adjacent to a side portion of the substrate loaded on the stage; and
a printing unit configured to print a conductive paste on the substrate,
wherein the printing unit includes a printing pad for printing the side line on the substrate and a printing pad driver configured to move the printing pad,
wherein the printing pad driver lowers the printing pad to print the side line on a top surface and a side surface of the substrate while the substrate is loaded on the stage, and
wherein a width of the substrate disposed between side guides including the side guide is different from an integer multiple of a width of the printing pad in a longitudinal direction.

2. The device of claim 1 , wherein the side guide is disposed on the stage and protrudes from a top surface of the stage.

3. The device of claim 2 , wherein a thickness of the side guide and a thickness of the substrate are the same.

4. The device of claim 1 , further comprising:
a side guide driver configured to move the side guide,
wherein the side guide is configured separately from the stage.

5. The device of claim 4 , wherein the side guide driver is configured to dispose the side guide to be adjacent to a side portion of the substrate after the substrate is loaded on the stage.

6. The device of claim 4 , wherein when the substrate is loaded on the stage and the side guide is disposed adjacent to a side portion of the substrate, a height of a top surface of the side guide and a height of a top surface of the substrate are the same.

7. The device of claim 1 , wherein when the side line is printed on an end of the substrate, a part of the printing pad overlaps the substrate, and another part of the printing pad overlaps the side guide.

8. The device of claim 1 , wherein the side guide is made of a material having a same modulus as that of the substrate.

9. The device of claim 1 , further comprising:
a buffer layer configured to be disposed on one surface of the side guide between the side guide and the substrate.

10. The device of claim 1 , wherein the side guide is formed of a plurality of stacked layers, and
the plurality of layers is configured to enable assembly and disassembly.

11. The device of claim 1 , wherein the side guide has a shape corresponding to a shape of a side surface of the substrate loaded on the stage.

12. The device of claim 11 , wherein a corner of the substrate loaded on the stage has a rounded shape, and
the side guide has a shape corresponding to the rounded shape.

13. The device of claim 12 , wherein the printing unit includes a printing pad for printing the side line on the substrate and a printing pad driver configured to move the printing pad, and
the printing pad driver moves the printing pad toward a side surface of the substrate to print the side line on a top surface, a bottom surface, and the side surface of the substrate while the substrate is loaded onto the stage.

14. A method of manufacturing a side line, the method comprising:
loading a substrate on a stage;
disposing a side guide on a side portion of the substrate; and
printing a plurality of first side lines of the side line on a second surface of the substrate and on a side surface of the substrate using a printing pad, the second surface being opposite to a first surface of the substrate contacting with the stage,
wherein the printing pad is moved by a printing pad driver,
wherein the printing pad driver lowers the printing pad to print the side line on a top surface and a side surface of the substrate while the substrate is loaded on the stage, and
wherein a width of the substrate disposed between side guides including the side guide is different from an integer multiple of a width of the printing pad in a longitudinal direction.

15. The method of claim 14 , wherein the disposing of the side guide on the side portion of the substrate includes disposing the side guide having the same thickness as a thickness of the substrate.

16. The method of claim 14 , wherein the disposing of the side guide on the side portion of the substrate includes disposing the side guide to be adjacent the side portion of the substrate.

17. The method of claim 16 , wherein the printing of the plurality of first side lines includes printing the plurality of first side lines on the substrate plural times using the printing pad.

18. The method of claim 17 , wherein the printing of the plurality of first side lines includes printing the plurality of first side lines on both of one side of the substrate and one side of the side guide disposed adjacent to the one side of the substrate using the printing pad.

19. The method of claim 14 , further comprising:
disposing the substrate so that the second surface of the substrate is in contact with the stage; and
printing a plurality of second side lines connected to the plurality of first side lines on the first surface of the substrate and the side surface of the substrate using the printing pad.

20. The method of claim 14 , wherein the loading of the substrate on the stage includes disposing the substrate to protrude to an outside of the stage,
the disposing of the side guide on the side portion of the substrate includes disposing the side guide to protrude to the outside of the stage, and
the method of manufacturing the side line further comprises printing a plurality of second side lines on the first side surface of the substrate and the side surface of the substrate using the printing pad.

21. The method of claim 14 , wherein the printing of the plurality of first side lines includes simultaneously printing the plurality of first side lines on all of the first surface of the substrate in contact with the stage, the second surface which is opposite to the first surface of the substrate, and the side surface of the substrate, using the printing pad.

22. The device of claim 21 , wherein a corner of the substrate has a rounded shape, and
the side guide has a shape corresponding to the rounded shape.

Assignees

• Lg Display Co Ltd

Inventors

• Lee Hyoseob
• Tak Yoonsung
• Kim Youngho
• Bae Sungeun
• KIM Jeehun

Classifications

• H10P72/0444 Primary

  Apparatus for wiring semiconductor or solid-state device · CPC title

• H10P72/70

  for supporting or gripping · CPC title

• H10W20/091

  by printing or stamping · CPC title

• H10W20/01

  Manufacture or treatment · CPC title

• H10H29/142

  Two-dimensional arrangements, e.g. asymmetric LED layout · CPC title