Structure with conductive pattern and method for manufacturing same

Patent metadata

Field	Value
Publication number	US-12376230-B2
Application number	US-202017770303-A
Country	US
Kind code	B2
Filing date	Nov 5, 2020
Priority date	Nov 8, 2019
Publication date	Jul 29, 2025
Grant date	Jul 29, 2025

Abstract

Provided are: a structure with a conductive pattern that can be obtained in a simple manufacturing process and that exhibits favorable interlayer adhesion; and a method for manufacturing same. An embodiment of the present invention provides a structure with a conductive pattern, the structure comprising a base material, and a copper-containing conductive layer arranged on the surface of the base material, wherein when a principal surface of the conductive layer on the side facing the base material is a first principal surface, and a principal surface of the conductive layer on the opposite side from the first principal surface is a second principal surface, the conductive layer: has a porosity of 0.01 to 50 volume percent in a first principal surface-side region that extends from the first principal surface to a depth of 100 nm in the thickness direction of the conductive layer.

First claim

The invention claimed is:

1. A structure with an electroconductive pattern comprising a substrate, and a copper-containing electroconductive layer disposed on the surface of the substrate,
wherein, when the main surface of the electroconductive layer on the opposite side from the substrate is defined as the first main surface and the main surface on the opposite side from the first main surface is defined as the second main surface, the electroconductive layer has a porosity of 0.01 vol % to 50 vol % in the first main surface-side region that extends from the first main surface to a depth of 100 nm in the thickness direction of the electroconductive layer, and has a porosity of 10 vol % or lower in the second main surface-side region that extends from the second main surface to a depth of 100 nm in the thickness direction of the electroconductive layer, and
wherein the element ratio of oxygen atoms to copper atoms in the first main surface-side region is greater than the element ratio of oxygen atoms to copper atoms in the second main surface-side region.

2. The structure with an electroconductive pattern according to claim 1 , wherein the porosity in the first main surface-side region is greater than the porosity in the second main surface-side region.

3. The structure with an electroconductive pattern according to claim 1 , wherein the element ratio of oxygen atoms to copper atoms in the first main surface-side region is greater than 0.025.

4. The structure with an electroconductive pattern according to claim 1 , wherein the second main surface includes nickel and/or gold.

5. The structure with an electroconductive pattern according to claim 1 , wherein part of the electroconductive layer is covered with a resin.

6. The structure with an electroconductive pattern according to claim 1 , which further comprises a solder layer situated on part of the surface of the electroconductive layer.

7. The structure with an electroconductive pattern according to claim 1 , wherein the electroconductive layer is an antenna.

8. The structure with an electroconductive pattern according to claim 1 , wherein the electroconductive layer is printed circuit board wiring.

9. A structure with an electroconductive pattern comprising a substrate, and a copper-containing electroconductive layer disposed on the surface of the substrate,
wherein, when the main surface of the electroconductive layer on the opposite side from the substrate is defined as the first main surface and the main surface on the opposite side from the first main surface is defined as the second main surface, the electroconductive layer has a porosity of 0.01 vol % to 50 vol % in the first main surface-side region that extends from the first main surface to a depth of 100 nm in the thickness direction of the electroconductive layer, and has a porosity of 10 vol % or lower in the second main surface-side region that extends from the second main surface to a depth of 100 nm in the thickness direction of the electroconductive layer, and wherein the element ratio of oxygen atoms to copper atoms in the first main surface-side region is greater than 0.025.

10. The structure with an electroconductive pattern according to claim 9 , wherein the porosity in the first main surface-side region is greater than the porosity in the second main surface-side region.

11. The structure with an electroconductive pattern according to claim 9 , wherein the second main surface includes nickel and/or gold.

12. The structure with an electroconductive pattern according to claim 9 , wherein part of the electroconductive layer is covered with a resin.

13. The structure with an electroconductive pattern according to claim 9 , which further comprises a solder layer situated on part of the surface of the electroconductive layer.

14. The structure with an electroconductive pattern according to claim 9 , wherein the electroconductive layer is an antenna.

15. The structure with an electroconductive pattern according to claim 9 , wherein the electroconductive layer is printed circuit board wiring.

Assignees

• Asahi Chemical Ind

Inventors

• Kozono Tomoko
• Yumoto Toru

Classifications

• H05K3/10

  in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern · CPC title

• H05K1/0237

  High frequency adaptations (H05K1/0216 takes precedence) · CPC title

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• C23C18/40 Primary

  using reducing agents · CPC title

• C23C18/1875

  only one step pretreatment · CPC title