Single layer touch sensor panel architecture
US-2020026393-A1 · Jan 23, 2020 · US
US12376223B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12376223-B2 |
| Application number | US-202118246292-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 29, 2021 |
| Priority date | Sep 27, 2020 |
| Publication date | Jul 29, 2025 |
| Grant date | Jul 29, 2025 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
The present disclosure discloses a crystal oscillator circuit on a PCB. The crystal oscillator circuit includes a crystal oscillator including an input end, an output end, a first grounding end and a second grounding end; a first capacitor with one end connected to the input end; and a second capacitor with one end connected to the output end, wherein the first grounding end is connected to a first grounding hole, the second grounding end is connected to a second grounding hole, the other end of the first capacitor is connected to a third grounding hole, the other end of the second capacitor is connected to a fourth grounding hole. The present disclosure further discloses the PCB and a server.
Opening claim text (preview).
What is claimed is: 1. A crystal oscillator circuit on a PCB, comprising: a crystal oscillator comprising an input end, an output end, a first grounding end and a second grounding end; a first capacitor with one end connected to the input end; and a second capacitor with one end connected to the output end, wherein the first grounding end is connected to a first grounding hole, the second grounding end is connected to a second grounding hole, the other end of the first capacitor is connected to a third grounding hole, and the other end of the second capacitor is connected to a fourth grounding hole; and the first grounding hole, the second grounding hole, the third grounding hole and the fourth grounding hole are independent of one another and are not in ground connection to a motherboard on a layer where the crystal oscillator circuit is located; the crystal oscillator circuit on the PCB further comprises: a first differential signal line connected to one end of the first capacitor; a second differential signal line connected to one end of the second capacitor; and a guard trace constructed to surround the crystal oscillator, the first capacitor, the second capacitor, the first differential signal line and the second differential signal line, wherein the guard trace is provided with a plurality of fifth grounding holes; wherein the guard trace comprises a first part, a second part and a third part, wherein the first part and the second part are located on two sides of the crystal oscillator, widths of the first part and widths of the second part are within a third preset interval range, the third part is located below the crystal oscillator, and a width of the third part is not less than the width of the first part or the width of the second part. 2. The crystal oscillator circuit as claimed in claim 1 , wherein a distance between the first capacitor and the crystal oscillator and a distance between the second capacitor and the crystal oscillator are within a first preset interval range. 3. The crystal oscillator circuit as claimed in claim 1 , wherein the guard trace is not connected to the first grounding hole, the second grounding hole, the third grounding hole and the fourth grounding hole, and is not in ground connection to a motherboard on a layer where the crystal oscillator circuit is located. 4. The crystal oscillator circuit as claimed in claim 1 , wherein a distance between every two adjacent fifth grounding holes is within a second preset interval range. 5. The crystal oscillator circuit as claimed in claim 1 , wherein a distance between the first part and the first differential signal line is within a fourth preset interval range, a distance between the second part and the second differential signal line is within the fourth preset interval range, a distance between the first part and other signal lines or a ground wire of the layer where the crystal oscillator circuit is located is within the fourth preset interval range, and a distance between the second part and other signal lines or the ground wire of the layer where the crystal oscillator circuit is located is within the fourth preset interval range. 6. The crystal oscillator circuit as claimed in claim 1 , wherein a corner of the third part is greater than a preset value, or the corner of the third part is in an arc shape. 7. The crystal oscillator circuit as claimed in claim 1 , wherein the first capacitor, the second capacitor, the crystal oscillator and circuits corresponding to a control chip are placed on the same layer. 8. The crystal oscillator circuit as claimed in claim 1 , wherein a resistor is added behind the first capacitor and the second capacitor to be connected between an input line of the crystal oscillator and an output line of the crystal oscillator. 9. The crystal oscillator circuit as claimed in claim 1 , wherein the guard trace of the crystal oscillator and a GND of a PCB are subjected to low-impedance lap joint through the plurality of fifth grounding holes. 10. The crystal oscillator circuit as claimed in claim 1 , wherein the crystal oscillator is placed in the middle of a PCB, the width of the third part is the same with the width of the first part and the width of the second part, when the crystal oscillator is placed on the edge of the PCB, the width of the third part is greater than the width of the first part and the width of the second part. 11. A PCB, comprising a crystal oscillator circuit, wherein the crystal oscillator circuit comprising: a crystal oscillator comprising an input end, an output end, a first grounding end and a second grounding end; a first capacitor with one end connected to the input end; and a second capacitor with one end connected to the output end, wherein the first grounding end is connected to a first grounding hole, the second grounding end is connected to a second grounding hole, the other end of the first capacitor is connected to a third grounding hole, and the other end of the second capacitor is connected to a fourth grounding hole; and the first grounding hole, the second grounding hole, the third grounding hole and the fourth grounding hole are independent of one another and are not in ground connection to a motherboard on a layer where the crystal oscillator circuit is located; the crystal oscillator circuit further comprises: a first differential signal line connected to one end of the first capacitor; a second differential signal line connected to one end of the second capacitor; and a guard trace constructed to surround the crystal oscillator, the first capacitor, the second capacitor, the first differential signal line and the second differential signal line, wherein the guard trace is provided with a plurality of fifth grounding holes; wherein the guard trace comprises a first part, a second part and a third part, wherein the first part and the second part are located on two sides of the crystal oscillator, widths of the first part and widths of the second part are within a third preset interval range, the third part is located below the crystal oscillator, and a width of the third part is not less than the width of the first part or the width of the second part. 12. The PCB as claimed in claim 11 , wherein a distance between the first capacitor and the crystal oscillator and a distance between the second capacitor and the crystal oscillator are within a first preset interval range. 13. The PCB as claimed in claim 11 , wherein the guard trace is not connected to the first grounding hole, the second grounding hole, the third grounding hole and the fourth grounding hole, and is not in ground connection to a motherboard on a layer where the crystal oscillator circuit is located. 14. The PCB as claimed in claim 11 , wherein a distance between every two adjacent fifth grounding holes is within a second preset interval range. 15. The PCB as claimed in claim 11 , wherein a distance between the first part and the first differential signal line is within a fourth preset interval range, a distance between the second part and the second differential signal line is within the fourth preset interval range, a distance between the first part and other signal lines or a ground wire of the layer where the crystal oscillator circuit is located is within the fourth preset interval range, and a distance between the second part and other signal lines or the ground wire of the layer where the crystal oscillator circuit is located is within the fourth preset interval range. 16. A server, comprising a crystal oscillator circuit, wherein the crystal osc
Metal wires as connectors or conductors · CPC title
Non-printed oscillator · CPC title
Conductive traces · CPC title
Grounding of printed circuits by connection to external grounding means · CPC title
with frequency-determining element comprising distributed inductance and capacitance · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.