Optical assembly with a microlens component and contacts on a same surface of a vertical cavity surface emitting laser device

Patent metadata

Field	Value
Publication number	US-12374857-B2
Application number	US-202117449386-A
Country	US
Kind code	B2
Filing date	Sep 29, 2021
Priority date	Jul 26, 2021
Publication date	Jul 29, 2025
Grant date	Jul 29, 2025

Abstract

In some implementations, an optical assembly includes a substrate that includes a thermally conductive core, an IC driver chip that is disposed on a first surface of the substrate, and a VCSEL device that includes an electrically insulated surface that is disposed on the thermally conductive core of the substrate within a cavity formed in the second surface of the substrate. The VCSEL device includes a cathode contact disposed on a surface of the VCSEL device and an anode contact disposed on the surface of the VCSEL device. The VCSEL device includes a plurality of emitters and a microlens component that is disposed over the plurality of emitters on the surface of the VCSEL device.

First claim

What is claimed is:

1. An optical assembly, comprising:
a substrate;
an integrated circuit (IC) driver chip that is disposed on a first surface of the substrate; and
a vertical cavity surface emitting laser (VCSEL) device that is disposed on a second surface of the substrate, wherein:
the first surface is opposite the second surface,
at least a portion of the IC driver chip and at least a portion of the VCSEL device are vertically aligned on a same portion of the substrate, and
the VCSEL device includes:
a substructure,
a plurality of emitters disposed within the substructure of the VCSEL device,
a microlens component disposed over the plurality of emitters and on a top surface of the substructure of the VCSEL device,
a cathode contact disposed on the top surface of the substructure of the VCSEL device, and
an anode contact disposed on the top surface of the substructure of the VCSEL device.

2. The optical assembly of claim 1 , wherein the VCSEL device comprises:
a short-wave infrared (SWIR) VCSEL device;
an oxide confined VCSEL device;
an implant confined VCSEL device;
a mesa confined VCSEL device; or
a top emitting VCSEL device.

3. The optical assembly of claim 1 , wherein the substrate comprises:
one or more dielectric layers;
one or more metal layers; and
a thermally conductive core.

4. The optical assembly of claim 1 , wherein the substrate includes a thermally conductive core that comprises at least one of:
tungsten (W);
a W alloy;
copper (Cu);
a Cu alloy;
a CuW alloy;
molybdenum (Mo);
a Mo alloy;
a WMo alloy;
silver (Ag); or
an Ag alloy.

5. The optical assembly of claim 1 , wherein the substrate is configured to thermally conduct heat generated by the VCSEL device from the VCSEL device to the IC driver chip.

6. The optical assembly of claim 1 , wherein the substrate includes a cavity formed in the first surface of the substrate, and
wherein the IC driver chip is disposed on a region of the first surface of the substrate that is within the cavity.

7. The optical assembly of claim 1 , wherein the substrate includes a cavity formed in the second surface of the substrate, and
wherein the VCSEL device is disposed on a region of the second surface of the substrate that is within the cavity.

8. The optical assembly of claim 1 , wherein a surface of the VCSEL device is disposed on a thermally conductive core of the substrate within a cavity formed in the second surface of the substrate, and
wherein the surface of the VCSEL device is electrically insulated.

9. An optical assembly, comprising:
a substrate that includes a thermally conductive core;
an integrated circuit (IC) driver chip that is disposed on a first surface of the substrate; and
a vertical cavity surface emitting laser (VCSEL) device that is disposed on a second surface of the substrate, wherein:
the first surface is opposite the second surface, and
the VCSEL device includes:
a cathode contact disposed on a surface of the VCSEL device, and
an anode contact disposed on the surface of the VCSEL device.

10. The optical assembly of claim 9 , wherein at least a portion of the IC driver chip and at least a portion of the VCSEL device are respectively disposed on a same portion of the substrate.

11. The optical assembly of claim 9 , wherein the VCSEL device includes an electrically insulated surface, and
wherein the electrically insulated surface of the VCSEL device is disposed on the thermally conductive core of the substrate within a cavity formed in the second surface of the substrate.

12. The optical assembly of claim 9 , wherein the thermally conductive core of the substrate is configured to thermally conduct heat generated by the VCSEL device in a first direction from the first surface of the substrate to the second surface of the substrate and in a second direction within the thermally conductive core.

13. The optical assembly of claim 9 , further comprising one or more attachment structures, wherein:
the one or more attachment structures each have a thermally conductive core; and
the one or more attachment structures are configured to connect one or more portions of the substrate to a surface of another substrate.

14. The optical assembly of claim 9 , further comprising a thermally conductive epoxy that is configured to mechanically connect a surface of the IC driver chip to a surface of another substrate.

15. The optical assembly of claim 9 , further comprising an underfill material that is configured to mechanically connect a surface of another substrate to at least one of:
one or more portions of the substrate; or
a surface of the IC driver chip.

16. The optical assembly of claim 9 , further comprising a solder that is configured to mechanically connect a surface of another substrate to at least one of:
one or more portions of the substrate; or
a surface of the IC driver chip.

17. An optical assembly, comprising:
a substrate that includes a thermally conductive core;
an integrated circuit (IC) driver chip that is disposed on a first surface of the substrate; and
a vertical cavity surface emitting laser (VCSEL) device that includes an electrically insulated surface that is disposed on the thermally conductive core of the substrate within a cavity formed in a second surface of the substrate,
wherein the first surface is opposite the second surface.

18. The optical assembly of claim 17 , further comprising a housing and an optical element, wherein:
the optical element is held by at least one support component of the housing via an attachment material.

19. The optical assembly of claim 17 , wherein the VCSEL device includes a cathode contact and an anode contact, wherein:
the cathode contact is disposed on another surface of the VCSEL device; and
the anode contact is disposed on the other surface of the VCSEL device.

20. The optical assembly of claim 19 , wherein the VCSEL device includes a microlens component that is disposed on the other surface of the VCSEL device.

Assignees

• Lumentum Operations Llc

Inventors

• Shi Wei
• Wang Kevin
• Huang Hao
• Miller John Michael
• Cheung Siu Kwan
• Zhu Lijun

Classifications

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H01S5/02208

  characterised by the shape of the housings · CPC title

• H01S5/02345

  Wire-bonding · CPC title

• H01S5/02253

  using lenses · CPC title

• H01S5/02257

  using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing · CPC title