Signal transmission line

Patent metadata

Field	Value
Publication number	US-12374768-B2
Application number	US-202217959333-A
Country	US
Kind code	B2
Filing date	Oct 4, 2022
Priority date	Apr 24, 2020
Publication date	Jul 29, 2025
Grant date	Jul 29, 2025

Abstract

A signal transmission line includes a signal region that includes a signal conductor layer and insulating base material layers, and a first ground region that includes a first ground conductor layer and insulating base material layers and is located above the signal region. The signal region is not fixed to the first ground region in a first section of a base. One or more first spacers are fixed to the signal region and in contact with the first ground region without being fixed thereto, or are in contact with the signal region without being fixed thereto and fixed to the first ground region. The one or more first spacers are in the first section.

First claim

What is claimed is:

1. A signal transmission line comprising:
a base including a plurality of insulating base material layers laminated in an up and down direction and a first section that is bent in the up and down direction;
a signal conductor layer in the base;
a first ground conductor layer in the base and above the signal conductor layer so as to be overlapped with the signal conductor layer as viewed in a downward direction; and
one or more first spacers; wherein
the signal transmission line further comprises:
a signal region that includes the signal conductor layer and some of the plurality of insulating base material layers; and
a first ground region that includes the first ground conductor layer and some of the plurality of insulating base material layers and is located above the signal region;

the signal region is not fixed to the first ground region in the first section of the base;
the one or more first spacers are fixed to the signal region and in contact with the first ground region without being fixed thereto, or are in contact with the signal region without being fixed thereto and fixed to the first ground region; and
the one or more first spacers are in the first section.

2. The signal transmission line according to claim 1 , wherein
the base includes a second section that has a radius of curvature larger than a radius of curvature of the first section;
the signal transmission line further includes one or more second spacers;
the one or more second spacers are fixed to the signal region and the first ground region; and
the one or more second spacers are in the second section.

3. The signal transmission line according to claim 2 , further comprising one or more third spacers and one or more fourth spacers.

4. The signal transmission line according to claim 3 , wherein the one or more third spacers are in contact with the signal region without being fixed thereto and fixed to a ground region.

5. The signal transmission line according to claim 3 , wherein the one or more third spacers are overlapped with a second ground conductor layer as viewed in the downward direction.

6. The signal transmission line according to claim 2 , wherein the one or more second spacers are fixed to the first ground conductor layer.

7. The signal transmission line according to claim 2 , wherein
a second gap is located between the signal conductor layer and the first ground conductor layer in the up and down direction in the second section; and
the second gap is located in the base so that the signal region is not fixed to the first ground region in the second section.

8. The signal transmission line according to claim 2 , wherein the second spacer includes a solder bump.

9. The signal transmission line according to claim 2 , wherein the second section is bent in the up and down direction.

10. The signal transmission line according to claim 1 , wherein the one or more first spacers are fixed to the signal region and in contact with the first ground region without being fixed thereto.

11. The signal transmission line according to claim 10 , wherein the one or more first spacers are in contact with the first ground conductor layer.

12. The signal transmission line according to claim 1 , wherein a Young's modulus of a material of the one or more first spacers is higher than a Young's modulus of a material of the base.

13. The signal transmission line according to claim 1 , wherein the first spacer includes a solder bump.

14. The signal transmission line according to claim 1 , further comprising a plurality of the first spacers.

15. The signal transmission line according to claim 1 , wherein
a first gap is located between the signal conductor layer and the first ground conductor layer in the up and down direction in the first section;
the signal region is not fixed to the first ground region in the first section; and
the one or more first spacers are inside the first gap.

16. The signal transmission line according to claim 1 , wherein the base is flexible.

17. The signal transmission line according to claim 1 , wherein the first section is bent with an upper surface of the base folded with a mountain fold and bent with the upper surface of the base folded with a valley fold.

18. The signal transmission line according to claim 1 , wherein the one or more first spacers are overlapped with the first ground conductor layer as viewed in the downward direction.

19. An electronic device comprising:
at least two circuit boards; and
the signal transmission line according to claim 1 connecting the at least two circuit boards.

20. A mobile phone comprising:
at least two circuit boards; and
the signal transmission line according to claim 1 connecting the at least two circuit boards.

Assignees

• Murata Manufacturing Co

Inventors

• Ikemoto Nobuo
• Iida Kanto

Classifications

• H05K1/0242

  Structural details of individual signal conductors, e.g. related to the skin effect · CPC title

• H04M1/026

  Details of the structure or mounting of specific components · CPC title

• H01P1/022

  in waveguides of polygonal cross-section (H01P1/065 takes precedence) · CPC title

• H05K1/147

  at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence) · CPC title

• H05K1/025

  Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance (H05K1/024 and H05K1/0243 take precedence; for semiconductor devices H10W44/20) · CPC title