Disconnect device

Patent metadata

Field	Value
Publication number	US-12374509-B2
Application number	US-202218552197-A
Country	US
Kind code	B2
Filing date	Feb 4, 2022
Priority date	Apr 6, 2021
Publication date	Jul 29, 2025
Grant date	Jul 29, 2025

Abstract

A disconnect device includes a heatsink, a substrate, a first charging relay disposed on a first heat transfer part, a second charging relay disposed on a second heat transfer part, a first discharging relay disposed on a third heat transfer part, a second discharging relay disposed on a fourth heat transfer part, and first and second power storage ends. The first and second discharging relays are disposed closer to the first and second power storage ends than the first and second charging relays are. The first, second, third, and fifth heat transfer parts are aligned in a first direction. The fourth and fifth heat transfer parts are aligned in a second direction perpendicular to the first direction. A heat dissipating performance of the heatsink on the third, fourth, and fifth heat transfer parts is higher than a heat dissipating performance of the heatsink on the first and second heat transfer parts.

First claim

The invention claimed is:

1. A disconnect device configured to operate together with a power storage element including a first electrode and a second electrode, the disconnect device comprising:
a heatsink;
a substrate having a first surface and a second surface opposite to the first surface and further having a first edge, a second edge, a third edge, and a fourth edge each connected to the first surface and the second surface, the first surface contacting the heatsink, the substrate including a first heat transfer part, a second heat transfer part, a third heat transfer part, a fourth heat transfer part, and a fifth heat transfer part which are provided along the second surface of the substrate;
a first charging relay provided on the second surface of the substrate, the first charging relay contacting the first heat transfer part;
a second charging relay provided on the second surface of the substrate, the second charging relay contacting the second heat transfer part;
a first discharging relay provided on the second surface of the substrate, the first discharging relay contacting the third heat transfer part;
a second discharging relay provided on the second surface of the substrate, the second discharging relay contacting the fourth heat transfer part;
a first charging end and a second charging end which are led out from the first edge of the substrate;
a first output end and a second output end which are led out from the second edge of the substrate, the first output end and a second output end being thermally coupled to the fifth heat transfer part;
a first power storage end led out from the third edge or the fourth edge of the substrate, the first power storage end being configured to be connected to the first electrode of the power storage element; and
a second power storage end led out from the third edge or the fourth edge of the substrate, the second power storage end being configured to be connected to the second electrode of the power storage element, wherein
both the first discharging relay and the second discharging relay are disposed closer to the first power storage end and the second power storage end than both the first charging relay and the second charging relay are,
the second edge of the substrate is positioned opposite to of the first edge of the substrate in a first direction,
the first heat transfer part, the second heat transfer part, the third heat transfer part, and the fifth heat transfer part are arranged in the first direction,
the fourth heat transfer part and the fifth heat transfer part are arranged in a second direction perpendicular to the first direction, and
a heat dissipating performance of the heatsink on the third heat transfer part, the fourth heat transfer part, and the fifth heat transfer part of the substrate is higher than a heat dissipating performance of the heatsink on the first heat transfer part and the second heat transfer part of the substrate.

2. The disconnect device according to claim 1 , wherein the first edge and the second edge of the substrate extend in parallel to each other.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Mihara Hiroyuki
• ASHIDA Hayato

Classifications

• H01H45/00

  Details of relays (electric circuit arrangements H01H47/00; of electromagnetic relays H01H50/00; details of electrically-operated selector switches H01H63/00) · CPC title

• H01M10/44

  Methods for charging or discharging (circuits for charging H02J7/00) · CPC title

• H01H45/04

  Mounting complete relay or separate parts of relay on a base or inside a case · CPC title

• H02H3/087

  for DC applications · CPC title

• H05K7/20

  Modifications to facilitate cooling, ventilating, or heating · CPC title