Stamp for micro-transfer printing

Patent metadata

Field	Value
Publication number	US-12372865-B2
Application number	US-202218056239-A
Country	US
Kind code	B2
Filing date	Nov 16, 2022
Priority date	Nov 18, 2021
Publication date	Jul 29, 2025
Grant date	Jul 29, 2025

Abstract

A stamp suitable for use in a micro-transfer printing process. The stamp comprises: a carrier layer; a plurality of stamp base sections, wherein: each stamp base section is attached on a first surface to the carrier layer, and separated from each adjacent stamp base section by a gap; and each stamp base section includes one or more stamping posts, for adhering to a source coupon, each stamping post extending from a second surface of its respective stamp base section.

First claim

The invention claimed is:

1. A stamp, suitable for use in a micro-transfer printing process, the stamp comprising:
a carrier layer; and
a plurality of stamp base sections,
wherein:
each of the plurality of stamp base sections is attached on a first surface to the carrier layer, and separated from each adjacent stamp base section of the plurality of stamp base sections by a gap; and
each of the plurality of stamp base sections includes one or more stamping posts, for adhering to a source coupon, each of the one or more stamping posts extending from a second surface of the respective stamp base section,

wherein the one or more stamping posts of the respective stamp base section are arranged in a post array, and each of the one or more stamping posts of the respective stamp base section is separated from the stamping posts of the adjacent stamp base sections by a stamping post gap, and
wherein each of the stamping post gaps between the stamping posts of the adjacent stamp base sections are respectively different sizes.

2. The stamp of claim 1 , wherein each of the gaps between each of the adjacent stamp base sections is a same size.

3. The stamp of claim 1 , wherein each of the gaps between each of the adjacent stamp base sections are respectively different sizes.

4. The stamp of claim 1 , wherein the stamp base sections are arranged in a stamp base array.

5. The stamp of claim 4 , wherein the gaps between each of the adjacent stamp base sections align to define a plurality of streets through the stamp base array.

6. The stamp of claim 1 , wherein the one or more stamping posts attached to each second surface of each of the stamp base sections include only one stamping post.

7. The stamp of claim 6 , wherein each stamping post is attached to the second surface of a respective stamp base section in a central position on the second surface.

8. The stamp of claim 1 wherein the one or more stamping posts attached to each second surface of each of the stamp base sections include a plurality of stamping posts.

9. The stamp of claim 8 , wherein a number of the plurality of stamping posts attached to each of the second surfaces of each of the stamp base sections is the same.

10. The stamp of claim 9 , wherein the pluralities of stamping posts respectively attached to each second surface of each of the stamp base sections are arranged in a same array pattern.

11. The stamp of claim 8 , wherein a number of the plurality of stamping posts attached to each of the second surfaces of each of the stamp base sections is respectively different.

12. The stamp of claim 1 , wherein each of the stamp base sections has respectively different cross-sectional areas, each cross-sectional area being an area of the second surface of each of the stamp base sections, wherein the cross-sectional area is measured in a direction perpendicular to a direction in which the one or more stamping posts extends.

13. The stamp of claim 1 , wherein each of the stamp base sections have respectively different volumes.

14. The stamp of claim 1 , wherein the carrier layer is formed from a glass.

15. The stamp of claim 1 , wherein a coefficient of thermal expansion of the carrier layer is not more than 1×10 −5 K −1 .

16. The stamp of claim 1 , wherein each of the stamp base sections is formed from polydimethylsiloxane, PDMS.

17. The stamp of claim 1 , wherein the one or more stamping posts is formed from polydimethylsiloxane, PDMS.

18. A method of preparing the stamp of claim 1 , the method comprising the steps of:
depositing a liquid precursor into a mould, the mould comprising the carrier layer and a fixed layer defining a shape of the plurality of stamping posts and a stamp base precursor;
wherein on one sidewall of the mould, the carrier layer contacts the liquid precursor to form the stamp base precursor and on the opposite sidewall of the mould, the fixed layer, containing pre-etched cavities, contacts the liquid precursor to form the stamping posts;
solidifying the liquid precursor to form a solid stamp precursor attached to the carrier layer;
removing material from the solid stamp precursor to define the plurality of stamp base sections with gaps therebetween; and
the method forming the stamp of claim 1 .

Assignees

• Rockley Photonics Ltd

Inventors

• Yu Guomin
• Zilkie Aaron John

Classifications

• H10P72/74

  using temporarily an auxiliary support · CPC title

• B29K2883/00

  Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as mould material · CPC title

• B29C33/40

  Plastics, e.g. foam or rubber · CPC title

• B29C33/3842

  Manufacturing moulds, e.g. shaping the mould surface by machining · CPC title

• G03F7/0002 Primary

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title