Compositions and methods thereof

Patent metadata

Field	Value
Publication number	US-12371575-B2
Application number	US-202418737608-A
Country	US
Kind code	B2
Filing date	Jun 7, 2024
Priority date	Dec 21, 2020
Publication date	Jul 29, 2025
Grant date	Jul 29, 2025

Abstract

Aspects of the present disclosure include compositions and methods of making and use thereof. In at least one aspect, a composition, includes a polyaniline and a polysiloxane having a density of about 1.05 g/cm 3 or greater. The composition optionally includes a solvent. In at least one aspect, a method includes introducing a polyaniline with a polysiloxane having a density of about 1.05 g/cm 3 or greater to form a composition. In at least one aspect, a method includes disposing a composition onto a substrate. The composition includes a polyaniline and a polysiloxane having a density of about 1.05 g/cm 3 or greater.

First claim

What is claimed is:

1. A circuit board comprising a composition layer disposed thereon, the composition layer comprising a cured product prepared from a composition comprising:
about 5 wt % to about 30 wt % of a polyaniline comprising a weight average molecular weight (Mw) of about 100,000 g/mol to about 130,000 g/mol; and
a polysiloxane having a density of about 1.05 g/cm 3 or greater as measured by ASTM D792;
wherein the composition layer has a thickness of about 1 μm to about 20 mm and a resistivity of about 4 E+5Ω/□ to about 2.5 E+11Ω/□.

2. The circuit board of claim 1 , wherein the composition comprises about 70 wt % to about 95 wt % polysiloxane, wherein an amount of polyaniline+polysiloxane does not exceed 100 wt %.

3. The circuit board of claim 1 , wherein the composition layer has a resistivity of about 4 E+5Ω/□ to about 3 E+8Ω/□.

4. The circuit board of claim 1 , wherein the polysiloxane has a thermal stability of about 150° C. to about 160° C. for at least 24 hours.

5. The circuit board of claim 1 , wherein the polysiloxane has a density of about 1.1 g/cm 3 to about 1.5 g/cm 3 as measured by ASTM D792.

6. The circuit board of claim 1 , wherein the polyaniline has a thermal stability of about 150° C. to about 160° C. for at least 24 hours.

7. The circuit board of claim 1 , wherein the polyaniline has a molecular weight distribution (MWD) of about 1 to about 5.

8. The circuit board of claim 1 , wherein the polyaniline has an outgassing % of about 0.1% or less, according to ASTM E595-93.

9. The circuit board of claim 1 , wherein the composition layer has a resistivity of about 4 E+5Ω/□ to about 3 E+6Ω/□.

10. The circuit board of claim 9 , wherein the composition layer is cured at curing temperatures of about 130° C. to about 155° C.

11. The circuit board of claim 1 , wherein the polysiloxane has an elongation of about 100% to about 700%.

12. The circuit board of claim 1 , wherein the polysiloxane has a tensile modulus of about 70 psi to about 420 psi.

13. The circuit board of claim 1 , wherein the composition layer has a thickness of about 1 μm to about 10 μm.

14. The circuit board of claim 13 , wherein the polyaniline has a molecular weight distribution (MWD) of about 1.3 to about 1.7.

15. A method, comprising:
introducing a first mixture comprising about 5 wt % to about 30 wt % of a polyaniline comprising a weight average molecular weight (Mw) of about 100,000 g/mol to about 130,000 g/mol in a first aromatic hydrocarbon solvent with a second mixture comprising a polysiloxane and a second aromatic hydrocarbon solvent, wherein the second mixture comprises a density of about 1.05 g/cm 3 or greater as measured by ASTM D792 to form a composition,
disposing the composition onto a substrate to form a composition layer, and

curing the composition layer at a temperature of about 100° C. to about 175° C. to produce a cured composition layer having a thickness of about 1 μm to about 20 mm and a resistivity of about 4 E+5Ω/□ to about 2.5 E+11Ω/□.

16. The method of claim 15 , wherein the second aromatic hydrocarbon solvent is the same or different than the first aromatic hydrocarbon solvent.

17. A method, comprising:
disposing a composition onto a substrate to form a composition layer, the composition layer comprising a polyaniline comprising a weight average molecular weight (Mw) of about 100,000 g/mol to about 130,000 g/mol and a polysiloxane having a density of about 1.05 g/cm 3 or greater, and
curing the composition layer to form a cured composition layer at a curing temperatures between about 20° C. to about 200° C.,
wherein the cured composition layer has a thickness of about 1 μm to about 20 mm and a resistivity of about 4 E+5Ω/□ to about 2.5 E+11Ω/□.

18. The method of claim 17 , wherein curing the composition further comprises:
curing the composition layer at a first temperature of about 20° C. to about 50° C. for about 1 hour to about 48 hours; and
curing the composition layer at a second temperature of about 50° C. to about 200° C. for about 1 hour to about 48 hours, wherein the first temperature is different than the second temperature.

19. The method of claim 18 , wherein the second temperature is about 100° C. to about 175° C.

20. The method of claim 17 , further comprising rinsing the cured composition layer with a rinsing agent.

Assignees

• Boeing Co

Inventors

• Kinlen Patrick J

Classifications

• H05K1/0353

  consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement · CPC title

• C09D183/04

  Polysiloxanes · CPC title

• C09D179/02

  Polyamines · CPC title

• C09D7/20

  Diluents or solvents · CPC title

• C08L79/02

  Polyamines · CPC title