Electronic device

Patent metadata

Field	Value
Publication number	US-12368795-B2
Application number	US-202118001753-A
Country	US
Kind code	B2
Filing date	Aug 25, 2021
Priority date	Dec 15, 2020
Publication date	Jul 22, 2025
Grant date	Jul 22, 2025

Abstract

Embodiments of this application provide an electronic device, in which a heat sink in the electronic device is multiplexed as a heat dissipation component and a radiator of an antenna. The heat sink provided by the embodiments of this application can be used as a heat dissipation component to distribute heat evenly, such as to cool down an overheated electronic element. In addition, the heat sink can be used as a radiator of an antenna to form an antenna unit with a feed unit and generate radiation to the outside. The heat sink in a first region can be used as a main radiator of the antenna unit to meet the demand for the number of antennas in a 5G wireless communication system, and can also be applied to other communication systems.

First claim

What is claimed is:

1. An electronic device, comprising:
a middle frame;
a rear cover;
a printed circuit board (PCB) arranged in a space enclosed by the middle frame and the rear cover;
a heat sink having at least a portion that is arranged between the PCB and the rear cover, wherein the heat sink comprises a first feed point; and
a first feed unit that is electrically connected to the heat sink at the first feed point.

2. The electronic device of claim 1 , further comprising a battery arranged in the space enclosed by the middle frame and the rear cover, wherein the portion of the heat sink is arranged between the battery and the rear cover.

3. The electronic device of claim 1 , further comprising a second feed unit, wherein the heat sink comprises a second feed point, and wherein the second feed unit is electrically connected to the heat sink at the second feed point.

4. The electronic device according to claim 3 , further comprising a ground, wherein the heat sink comprises a first ground point, and the heat sink is electrically connected to the ground at the first ground point.

5. The electronic device of claim 4 , wherein the heat sink being electrically connected to the ground at the first ground point comprises the heat sink being directly connected to or indirectly coupled to the ground at the first ground point.

6. The electronic device of claim 3 , wherein the heat sink comprises a gap.

7. The electronic device of claim 6 , wherein the gap is an open gap or a closed gap.

8. The electronic device of claim 2 , further comprising a metal member arranged above the heat sink.

9. The electronic device of claim 8 , wherein the metal member being arranged above the heat sink comprises the metal member being arranged either a) between the heat sink and the PCB, or b) between the heat sink and the battery, or c) between the heat sink and the rear cover, or d) on a surface of the rear cover away from the heat sink.

10. The electronic device of claim 1 , wherein the first feed unit being electrically connected to the heat sink at the first feed point comprises the first feed unit being directly connected to or indirectly coupled to the heat sink at the first feed point.

11. The electronic device of claim 10 , further comprising a coupling member, wherein the first feed unit is electrically connected to the coupling member, and the coupling member provides indirect coupling feeding at the first feed point for an antenna unit formed by the first feed unit and the heat sink.

12. An electronic device, comprising:
a middle frame;
a rear cover;
a ground;
a printed circuit board (PCB) arranged in a space enclosed by the middle frame and the rear cover;
a heat sink having at least a portion that is arranged between the PCB and the rear cover, wherein the heat sink comprises a first feed point, at least one gap, and a first ground point, wherein the heat sink is electrically connected to the ground at the first ground point, and wherein the heat sink is made of graphite; and
a first feed unit that is electrically connected to the heat sink at the first feed point.

13. The electronic device of claim 12 , wherein the gap is an open gap or a closed gap.

14. The electronic device of claim 12 , further comprising a second feed unit, wherein the heat sink comprises a second feed point, and wherein the second feed unit is electrically connected to the heat sink at the second feed point.

15. The electronic device of claim 14 , further comprising a third feed unit, wherein the heat sink comprises a third feed point, and wherein the third feed unit is electrically connected to the heat sink at the third feed point.

16. The electronic device according to claim 15 , further comprising a battery arranged in the space enclosed by the middle frame and the rear cover, wherein the portion of the heat sink is arranged between the battery and the rear cover.

17. The electronic device of claim 16 , further comprising a metal member arranged above the heat sink.

18. The electronic device of claim 17 , wherein the metal member being arranged above the heat sink comprises the metal member being arranged either a) between the heat sink and the PCB, or b) between the heat sink and the battery, or c) between the heat sink and the rear cover, or d) on a surface of the rear cover away from the heat sink.

19. The electronic device of claim 12 , further comprising a coupling member, wherein the first feed unit is electrically connected to the coupling member, and the coupling member provides indirect coupling feeding at the first feed point for an antenna unit formed by the first feed unit and the heat sink.

20. The electronic device of claim 14 , further comprising a coupling member, wherein the second feed unit is electrically connected to the coupling member, and the coupling member provides indirect coupling feeding at the second feed point for an antenna unit formed by the second feed unit and the heat sink.

Assignees

• Honor Device Co Ltd

Inventors

• Sun Qiao
• Li Kun
• Huyan Silei
• Ye Mao

Classifications

• H05K7/2039 Primary

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• H01Q1/02

  Arrangements for de-icing; Arrangements for drying-out {; Arrangements for cooling; Arrangements for preventing corrosion} · CPC title

• H05K7/20445

  the coupling element being an additional piece, e.g. thermal standoff · CPC title

• H01Q1/243

  with built-in antennas · CPC title

• H01Q1/44

  using equipment having another main function to serve additionally as an antenna {, e.g. means for giving an antenna an aesthetic aspect}(H01Q1/27 - H01Q1/34 take precedence) · CPC title