Display apparatus and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-12368145-B2
Application number	US-202318543133-A
Country	US
Kind code	B2
Filing date	Dec 18, 2023
Priority date	Jul 23, 2015
Publication date	Jul 22, 2025
Grant date	Jul 22, 2025

Abstract

A display apparatus including a panel substrate, and a light emitting source disposed on the panel substrate, in which the light emitting source includes a substrate, an electrode disposed on the substrate, a light emitting structure disposed on the electrode and having an n-type semiconductor layer, a p-type semiconductor layer, an n-type electrode, and a p-type electrode, a transparent electrode disposed on the light emitting structure, and an adhesive layer disposed on the light emitting structure, the n-type electrode is electrically connected to the electrode, the p-type electrode is electrically connected to the transparent electrode, and the adhesive layer is disposed between the p-type electrode and the transparent electrode.

First claim

The invention claimed is:

1. A display apparatus comprising:
a panel substrate; and
a light emitting source disposed on the panel substrate;
wherein the light emitting source includes:
a substrate;
an electrode disposed on the substrate;
a light emitting structure disposed on the electrode and having an n-type semiconductor layer, a p-type semiconductor layer, an n-type electrode, and a p-type electrode;
a transparent electrode disposed on the light emitting structure; and
an adhesive layer disposed on the light emitting structure,

wherein the p-type electrode is electrically connected to the electrode,
wherein the n-type electrode is electrically connected to the transparent electrode, and
wherein the adhesive layer covers a region of a surface of the transparent electrode and overlaps an edge of the transparent electrode in plan view.

2. The display apparatus of claim 1 , wherein at least one side of the electrode is surrounded by a non-conductive region.

3. The display apparatus of claim 1 , wherein light generated from the light emitting source is configured to be emitted through the transparent electrode.

4. The display apparatus of claim 1 , wherein the adhesive layer includes a conductive material.

5. The display apparatus of claim 1 , wherein the light emitting source includes a plurality of light emitters configured to emit light having different colors.

6. The display apparatus of claim 1 , wherein the panel substrate includes a circuit for active matrix driving or passive matrix driving.

7. A display apparatus comprising:
a panel substrate;
an electrode disposed on the panel substrate;
a light emitting source disposed on the panel substrate;
an adhesive layer disposed on the light emitting source; and
a transparent electrode layer disposed on the panel substrate,
wherein the light emitting source includes a plurality of light emitters, each light emitter of the plurality of light emitters including a first conductive type semiconductor layer, a second conductive type semiconductor layer, a first electrode, and a second electrode,
wherein the first electrode is electrically connected to the electrode,
wherein the second electrode is electrically connected to the transparent electrode layer,
wherein the plurality of light emitters includes a blue light emitter, a green light emitter, and a red light emitter, and
wherein the adhesive layer covers a region of a surface of the transparent electrode and overlaps an edge of the transparent electrode in plan view.

8. The display apparatus of claim 7 , further comprising a support substrate disposed on the transparent electrode layer.

9. The display apparatus of claim 8 , wherein the support substrate includes a transparent material.

10. The display apparatus of claim 7 , wherein at least one side of the electrode is surrounded by a non-conductive region.

11. The display apparatus of claim 7 , wherein light generated from the light emitting source is configured to be emitted through the transparent electrode layer.

12. The display apparatus of claim 7 , wherein the adhesive layer includes a conductive material.

13. The display apparatus of claim 7 , wherein the panel substrate includes a circuit for active matrix driving or passive matrix driving.

14. A display apparatus comprising:
a panel substrate;
an electrode disposed on the panel substrate;
a light emitting source disposed on the panel substrate;
a transparent electrode layer disposed on the light emitting source; and
an adhesive layer disposed on the light emitting source,
wherein the light emitting source includes a plurality of light emitters, each light emitter of the plurality of light emitters including a first conductive type semiconductor layer, a second conductive type semiconductor layer, a first electrode, and a second electrode,
wherein the first electrode is electrically connected to the electrode,
wherein the second electrode is electrically connected to the transparent electrode layer, and
wherein the adhesive layer covers a region of a surface of the transparent electrode layer and overlaps an edge of the transparent electrode in plan view.

15. The display apparatus of claim 14 , further comprising a transparent substrate disposed on the transparent electrode layer.

16. The display apparatus of claim 14 , wherein at least one side of the electrode is surrounded by a non-conductive region.

17. The display apparatus of claim 15 , wherein light generated from the light emitting source is configured to be emitted through the transparent substrate.

18. The display apparatus of claim 14 , wherein the adhesive layer includes a conductive material.

19. The display apparatus of claim 14 , wherein the panel substrate includes a circuit for active matrix driving or passive matrix driving.

Assignees

• Seoul Semiconductor Co Ltd

Inventors

• Takeya Motonobu
• Kim Young Hyun

Classifications

• H10P72/7434

  used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate · CPC title

• H10P72/7428

  used to support diced chips prior to mounting · CPC title

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7414

  the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support · CPC title

• H10P72/742

  involving stretching of the auxiliary support post dicing · CPC title