Laser ablated wireless humidity sensor

Patent metadata

Field	Value
Publication number	US-12366545-B2
Application number	US-202318103592-A
Country	US
Kind code	B2
Filing date	Jan 31, 2023
Priority date	Mar 31, 2022
Publication date	Jul 22, 2025
Grant date	Jul 22, 2025

Abstract

A humidity sensor may include a metalized substrate comprising a laser ablated portion and a remaining metal portion. The remaining metal portion may include a spiral inductor and an interdigitated capacitor. The interdigitated capacitor may be coupled in parallel with the spiral inductor. The interdigitated capacitor may be centrally positioned with respect to the spiral inductor and surrounded by spirals of the spiral inductor. The spiral inductor and interdigitated capacitor may be formed by selectively ablating the metallized substrate to define the inductor and capacitor.

First claim

What is claimed is:

1. A method for manufacturing a humidity sensor, comprising:
selectively ablating, with a laser, a metal coated substrate to define an inductor and an interdigitated capacitor in a remainder of the metal surface which is not ablated, the inductor having spirals surrounding the interdigitated capacitor.

2. The method of claim 1 , wherein the inductor and interdigitated capacitor comprise Al and the etched surface comprises Al 2 O 3 formed by the laser ablation.

3. The method of claim 1 , further comprising:
cutting away a portion of the substrate having the inductor and interdigitated capacitor.

4. The method of claim 1 , wherein ablating the metal coated substrate further comprises:
defining a first side of the interdigitated capacitor connected to an inner spiral of the inductor;
defining a second side of the interdigitated capacitor; and
defining a lead of the outer spiral for connecting the outer spiral to the second side of the interdigitated capacitor.

5. The method of claim 4 , further comprising:
connecting the lead of the outer spiral to the interdigitated capacitor.

6. The method of claim 5 , wherein connecting the lead of the outer spiral to the interdigitated capacitor further comprises:
folding a portion of the ablated surface over a portion of the lead of the outer spiral; and
folding a portion of the substrate and the folded portion of the ablated surface over the spirals of the inductor thereby connecting the lead of the inductor to the second side of the interdigitated capacitor, wherein the folded portion of the ablated surface forms a passivation layer between the spiral and the lead.

7. The method of claim 5 , wherein connecting the lead of the outer spiral to the interdigitated capacitor further comprises:
Laser welding the lead to the second side of the interdigitated capacitor.

8. A humidity sensor comprising
a metalized substrate comprising a laser ablated portion and a remaining metal portion, wherein the remaining metal portion comprises:
a spiral inductor;
an interdigitated capacitor, the interdigitated capacitor coupled in parallel with the spiral inductor, the interdigitated capacitor centrally positioned with respect to the spiral inductor and surrounded by spirals of the spiral inductor;
a lead connected to an outer spiral of the spiral conductor, wherein the lead is folded over the spiral inductor to connect the lead to the interdigitated capacitor; and
a passivation layer is positioned between the lead and the spirals of the spiral inductor.

9. A humidity sensor comprising:
a metalized substrate comprising a laser ablated portion and a remaining metal portion, wherein the remaining metal portion comprises:
a spiral inductor;
an interdigitated capacitor, the interdigitated capacitor coupled in parallel with the spiral inductor, the interdigitated capacitor centrally positioned with respect to the spiral inductor and surrounded by spirals of the spiral inductor,
wherein the laser ablated portion comprises Al 2 O 3 and the remaining metal portion comprises Al.

10. The humidity sensor of claim 8 , wherein the passivation layer comprises the laser ablated portion folded and positioned between the lead and the spiral.

11. A system comprising:
a container;
a passive humidity sensor attached to a surface of the container; the passive humidity sensor comprising a metalized substrate having a laser ablated surface which defines a spiral inductor encircling an interdigitated capacitor, the interdigitated capacitor connected in parallel to the spiral inductor; and
a processor, the processor configured to:
transmit an interrogation signal to the humidity sensor;
receive a response signal from the humidity sensor; and
determine, based on the response signal, a humidity measurement.

12. A system comprising:
a container having a surface, wherein at least a portion of the surface is a passive humidity sensor defined directly on the surface, the passive humidity sensor comprising a metalized substrate having a laser ablated surface which defines a spiral inductor encircling an interdigitated capacitor, the interdigitated capacitor connected in parallel to the spiral inductor; and
a processor, the processor configured to:
transmit an interrogation signal to the humidity sensor;
receive a response signal from the humidity sensor; and
determine, based on the response signal, a humidity measurement.

13. The system of claim 11 , wherein the metalized substrate comprises a laser ablated portion, the laser ablated portion comprising Al 2 O 3 and a remaining metal portion of the metalized substrate comprising Al.

14. The system of claim 12 , wherein the metalized substrate comprises a laser ablated portion, the laser ablated portion comprising Al 2 O 3 and a remaining metal portion of the metalized substrate comprising Al.

Assignees

• Purdue Research Foundation

Inventors

• Rahimi Rahim

Classifications

• B23K26/38

  by boring or cutting · CPC title

• B23K26/21

  by welding · CPC title

• B23K26/0846

  for moving elongated workpieces longitudinally, e.g. wire or strip material · CPC title

• B23K26/362

  Laser etching · CPC title

• B23K2101/36

  Electric or electronic devices · CPC title