Photonic annealing of electrically-conductive thermoplastics

Patent metadata

Field	Value
Publication number	US-12365152-B2
Application number	US-202016866396-A
Country	US
Kind code	B2
Filing date	May 4, 2020
Priority date	May 4, 2020
Publication date	Jul 22, 2025
Grant date	Jul 22, 2025

Abstract

Photonic annealing is used to treat electrically-conductive thermoplastic. The thermoplastic forms, partially or wholly, a part which may be formed by additive manufacturing, like fused filament fabrication (FFF). The photonic annealing improves part conductivity and also alter, enhance, or give rise to other material properties while taking significantly less time than other conventional post-process methods. For instance, the baseline conductivity of the electrically-conductive thermoplastic material may be on the order of 10 3 S/m or lower. After the photonic annealing, its conductivity may be raised to the order of 10 4 -10 5 S/m or more. This represents an improvement of 10-100× or even more of conductivity of the electrically-conductive thermoplastic compared to electrically-conductive thermoplastic prior to the photonic annealing.

First claim

We claim:

1. A method comprising:
forming by depositing, partially or wholly, a part from an electrically-conductive thermoplastic consisting of a thermoplastic having metallic particles uniformly mixed in the thermoplastic when deposited having an initial electrical conductivity of 1000 S/m or lower; and
increasing the electrical conductivity of at least a portion of the deposited part from 1000 S/m or lower to 10 4 -10 5 S/m or more by photonic annealing said at least a portion of the part using visible light at an exposure energy density of at least 8.4 J/cm 2 .

2. The method of claim 1 , wherein the deposited electrically-conductive thermoplastic consisting of the thermoplastic having the metallic particles uniformly mixed in the thermoplastic of the part is formed by additive manufacturing.

3. The method of claim 2 , further comprising forming non-conductive portion(s) of the part by additive manufacturing.

4. The method of claim 2 , where the additive manufacturing comprises a fused filament fabrication (FFF) process.

5. The method of claim 1 , wherein the photonic annealing comprises multiple exposures.

6. The method of claim 1 , wherein the part formed comprises: an inductor, an antenna, a conductive electrode, a printed circuit board, a non-planar circuit, a 3D circuit, or a circuit embedded into a 3D-plastic part.

7. The method of claim 1 , wherein the thermoplastic is selected from the group consisting of: PLA (polylactic acid), PCL (Polycaprolactone), OBC (olefin block copolymers) and polyester.

8. A method comprising:
depositing, partially or wholly, a part from an electrically-conductive thermoplastic consisting of a thermoplastic having metallic particles uniformly mixed in the thermoplastic when deposited; and
increasing the electrical conductivity of at least a portion of the deposited part to at least 10 4 S/m or more by photonic annealing said at least a portion of the part using visible light at an exposure energy density of at least 8.4 J/cm 2
wherein the thermoplastic is selected from the group consisting of: PLA (polylactic acid), PCL (Polycaprolactone), OBC (olefin block copolymers) and polyester, and
the metallic particles are selected from the group consisting of: silver, gold, nickel and copper.

9. The method of claim 1 , wherein the metallic particles are selected from the group consisting of: silver, gold, nickel and copper.

10. The method of claim 1 , wherein the metallic particles are 20-70% by weight of the electrically-conductive thermoplastic.

11. The method of claim 1 , wherein the electrically-conductive thermoplastic consisting of the thermoplastic having the metallic particles uniformly mixed in the thermoplastic is filament of a biodegradable polyester mixed with copper particles.

12. The method of claim 1 , wherein the initial electrical conductivity is greater than 0 S/m.

13. The method of claim 1 , wherein the exposure energy density of the photonic annealing is 8.4-25 J/cm 2 .

Assignees

• U S Army Combat Capabilities Development Command Army Res Laboratory
• Us Army

Inventors

• Cardenas Jorge A
• Lazarus Nathan S
• Tsang Harvey H

Classifications

• B33Y30/00

  Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

• B29K2101/12

  Thermoplastic materials · CPC title

• B29C2071/022

  Annealing · CPC title

• B33Y80/00

  Products made by additive manufacturing · CPC title

• B33Y40/20

  Post-treatment, e.g. curing, coating or polishing · CPC title