Display device with groove overlapped by metal layer
US-11387432-B2 · Jul 12, 2022 · US
US12364113B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12364113-B2 |
| Application number | US-202418644098-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 24, 2024 |
| Priority date | Apr 19, 2021 |
| Publication date | Jul 15, 2025 |
| Grant date | Jul 15, 2025 |
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Provided are a display apparatus including: a substrate; a pixel circuit disposed over the substrate and comprising a thin film transistor and a storage capacitor; an insulating layer covering the pixel circuit; a bridge electrode disposed over the insulating layer and electrically connected to the pixel circuit through a contact hole formed in the insulating layer; a pixel electrode disposed over the insulating layer and electrically connected to the bridge electrode; a pixel definition layer disposed over the pixel electrode and including an opening overlapping a portion of the pixel electrode; an opposite electrode over the pixel electrode; and an emission layer disposed between the pixel electrode and the opposite electrode, wherein the pixel electrode does not overlap the contact hole of the insulating layer in a plan view.
Opening claim text (preview).
What is claimed is: 1. A method of manufacturing a display apparatus, the method comprising: forming a pixel circuit comprising a thin film transistor and a storage capacitor over a substrate; forming an insulating layer covering the pixel circuit and comprising at least one contact hole; forming a bridge electrode disposed over the insulating layer and electrically connected to the pixel circuit through the at least one contact hole in the insulating layer; forming a pixel electrode disposed over the insulating layer; forming a pixel definition layer disposed over the pixel electrode and defining an opening overlapping a portion of the pixel electrode; forming an emission layer over the pixel electrode; and forming an opposite electrode over the emission layer, wherein the forming of the pixel electrode comprises: forming a pixel electrode material layer, and patterning the pixel electrode material layer such that the pixel electrode does not overlap the at least one contact hole in the insulating layer through which the pixel electrode is electrically connected to the thin film transistor in a plan view. 2. The method of claim 1 , wherein the forming of the bridge electrode comprises: forming a bridge electrode material layer; and patterning the bridge electrode material layer such that at least a portion of the bridge electrode overlaps the opening of the pixel definition layer in a plan view. 3. The method of claim 2 , wherein the pixel electrode comprises: a conductive layer comprising a transparent conductive oxide; and a reflective layer disposed over the conductive layer and comprising a metal, and wherein the at least a portion of the bridge electrode is disposed over the pixel electrode and contacts an upper surface of the reflective layer of the pixel electrode. 4. The method of claim 2 , wherein the pixel electrode comprises: a lower conductive layer comprising a transparent conductive oxide; a reflective layer disposed over the lower conductive layer and comprising a metal; and an upper conductive layer disposed over the reflective layer and comprising a transparent conductive oxide, and wherein the at least a portion of the bridge electrode is disposed over the pixel electrode and contacts an upper surface of the upper conductive layer of the pixel electrode. 5. The method of claim 2 , wherein the pixel electrode comprises: a reflective layer comprising a metal; and a conductive layer disposed over the reflective layer and comprising a transparent conductive oxide, and wherein the at least a portion of the bridge electrode is disposed between the insulating layer and the pixel electrode and contacts a lower surface of the reflective layer of the pixel electrode. 6. The method of claim 2 , wherein the pixel electrode comprises: a lower conductive layer comprising a transparent conductive oxide; a reflective layer disposed over the lower conductive layer and comprising a metal; and an upper conductive layer disposed over the reflective layer and comprising a transparent conductive oxide, and wherein the at least a portion of the bridge electrode is disposed between the insulating layer and the pixel electrode and contacts a lower surface of the lower conductive layer of the pixel electrode. 7. The method of claim 1 , wherein the bridge electrode comprises a transparent conductive oxide. 8. A method of manufacturing a display apparatus, the method comprising: forming a pixel circuit comprising a thin film transistor and a storage capacitor over a substrate; forming an insulating layer covering the pixel circuit and comprising at least one contact hole; forming a first bridge electrode layer disposed over the insulating layer and electrically connected to the pixel circuit through the at least one contact hole of in the insulating layer; forming a pixel electrode disposed over the first bridge electrode layer; forming a second bridge electrode layer disposed over the first bridge electrode layer with the pixel electrode disposed between the first bridge electrode and the second bridge electrode; forming a pixel definition layer disposed over the pixel electrode and defining an opening overlapping a portion of the pixel electrode; forming an emission layer over the pixel electrode; and forming an opposite electrode over the emission layer, wherein the forming of the pixel electrode comprises: forming a pixel electrode material layer; and patterning the pixel electrode material layer such that the pixel electrode does not overlap the at least one contact hole in the insulating layer in a plan view. 9. The method of claim 8 , wherein the pixel electrode comprises a reflective layer comprising a metal, and wherein the first bridge electrode layer contacts a lower surface of the reflective layer of the pixel electrode. 10. The method of claim 9 , wherein the pixel electrode further comprises a conductive layer disposed over the reflective layer and comprising a transparent conductive oxide, and wherein the second bridge electrode layer contacts an upper surface of the conductive layer of the pixel electrode. 11. A method of manufacturing an apparatus, the method comprising: forming a pixel circuit comprising a thin film transistor and a storage capacitor over a substrate; forming an insulating layer covering the pixel circuit and comprising at least one contact hole; forming a bridge electrode disposed over the insulating layer and electrically connected to the pixel circuit through the at least one contact hole in the insulating layer; forming a pixel electrode disposed over the insulating layer; forming a pixel definition layer disposed over the pixel electrode and defining an opening overlapping a portion of the pixel electrode; forming an emission layer over the pixel electrode; and forming an opposite electrode over the emission layer, wherein the forming of the pixel electrode comprises: forming a pixel electrode material layer, and patterning the pixel electrode material layer such that the pixel electrode does not overlap the at least one contact hole in the insulating layer through which the pixel electrode is electrically connected to the thin film transistor in a plan view. 12. The method of claim 11 , wherein the apparatus is at least one of a television, a notebook computer, a monitor, a billboard, a mobile phone, a smart phone, a tablet personal computer, a mobile communication terminal, an electronic notebook, an electronic book, a portable multimedia player, a navigation, an Ultra Mobile PC, a smart watch, a watch phone, a glasses-type display, a head-mounted display, or a center information display (CID) of a vehicle.
comprising light absorbing layers, e.g. black layers · CPC title
Reflective anodes, e.g. ITO combined with thick metallic layers · CPC title
Manufacture or treatment · CPC title
the pixel elements being capacitors · CPC title
Pixel-defining structures or layers, e.g. banks · CPC title
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