Method of manufacturing light emitting package structure

Patent metadata

Field	Value
Publication number	US-12364069-B2
Application number	US-202217971528-A
Country	US
Kind code	B2
Filing date	Oct 21, 2022
Priority date	Dec 5, 2018
Publication date	Jul 15, 2025
Grant date	Jul 15, 2025

Abstract

A method of manufacturing the light emitting package structure is provided. The method includes: a preparation process: mounting a light emitting unit on a substrate; a dispensing process: coating a sealant on a first joint area of the substrate; a cover-enclosing process: disposing a cover element having a second joint area on the substrate, the first joint area and the second joint area joined to each other by the sealant; a vacuum process: reducing an ambient pressure to a first pressure lower than the original ambient pressure; a pressure-adjusting process: adjusting the ambient pressure around the package structure to a second pressure higher than the first pressure; and a curing process: curing the sealant.

First claim

What is claimed is:

1. A method of manufacturing a light emitting package structure including a substrate, a cover element, a light emitting unit and a sealant, an accommodation space being formed between the substrate and the cover element, the light emitting unit being accommodated in the accommodation space, the method comprising:
a preparation process: mounting the light emitting unit on the substrate under an original ambient pressure;
a dispensing process: coating the sealant on a first joint area of the substrate under the original ambient pressure, wherein the sealant has an outer profile;
an cover-enclosing process: disposing the cover element having a second joint area on the substrate under the original ambient pressure, the first joint area and the second joint area being joined to each other by the sealant so as to form the light emitting package structure in a joined status;
a vacuum process: accommodating the light emitting package structure in the joined status into a vacuum chamber, and reducing an ambient pressure in the vacuum chamber to a first pressure by extracting air, wherein the first pressure is lower than the original ambient pressure, the first pressure is maintained for a predetermined time, so that the pressure of the accommodation space approaches the first pressure;
a pressure-adjusting process: adjusting the ambient pressure around the light emitting package structure to a second pressure higher than the first pressure, wherein a pressure difference between the first pressure and the second pressure is between 0.01 and 0.03 MPa, to form a negative pressure environment in the accommodation space of the light emitting package structure, so that at least one side of the outer profile of the sealant forms a recess portion recessed toward the accommodation space, and a depth of the recess portion is greater than or equal to a quarter of a width of the first joint area or the second joint area; and
a curing process: curing the sealant.

2. The method according to claim 1 , wherein the first pressure is maintained for 2 to 5 minutes in the vacuum process.

3. The method according to claim 1 , wherein the pressure-adjusting process begins during the curing process.

4. The method according to claim 1 , wherein a width of the sealant coated on the first joint area is between a quarter and three quarters of a width of the first joint area.

5. The method according to claim 1 , wherein the sealant has a thixotropic coefficient between 2.8 and 4.

6. The method according to claim 1 , wherein the sealant has a viscosity between 10 Pas and 18 Pas.

7. The method according to claim 1 , wherein the curing process further comprises a step of curing the sealant cure at a temperature between 140° C. and 160° C. for a period of time between 180 and 300 minutes.

8. The method according to claim 1 , wherein the curing process is a two-stage curing process, a first stage of the curing process is performed under negative pressure, a second stage of the curing process is performed under normal pressure, a heating process is performed under the second pressure and the cure temperature is maintained for 40 to 60 minutes to preliminarily cure the sealant, and the cure temperature is further maintained for 120 to 260 minutes to completely cure the sealant.

9. The method according to claim 1 , wherein the sealant is a silicon thermosetting adhesive.

10. The method according to claim 1 , further comprising a step of coating a waterproof layer on a surface of the light emitting unit.

11. The method according to claim 10 , wherein a material of the waterproof layer is a silicone resin or a fluorine resin.

12. The method according to claim 1 , wherein the substrate includes a wall structure, the first joint area is extended from an inner edge of the wall structure to an outer edge of the wall structure of the substrate, the sealant is provided between the first joint area of the wall structure and the second joint area and bonded to the first joint area and the second joint area.

13. The method according to claim 12 , wherein the recess portion recessed toward the accommodation space along a traverse direction perpendicular to the at least one side of the outer profile and being in an arc-shaped; wherein an inner side edge of the at least one side of the outer profile is aligned with the inner edge of the wall structure; wherein a maximum depth of the recess portion is greater than or equal to a quarter of a width of the first joint area of the wall structure along the traverse direction.

Assignees

• Lite On Opto Tech Changzhou Co Ltd
• Lite On Technology Corp

Inventors

• Cheng Wei-Te
• Chiu Kuo-Ming
• Liang Kai-Chieh
• Tsai Jie-Ting

Classifications

• H10H20/0362

  of encapsulations · CPC title

• H10H20/036

  of packages · CPC title

• H10H20/852

  Encapsulations · CPC title

• H10H20/0363

  of optical field-shaping means · CPC title

• H10H20/034

  of coatings · CPC title