Camera module, manufacturing method and mobile terminal

Patent metadata

Field	Value
Publication number	US-12363404-B2
Application number	US-202118270779-A
Country	US
Kind code	B2
Filing date	Dec 17, 2021
Priority date	Jan 4, 2021
Publication date	Jul 15, 2025
Grant date	Jul 15, 2025

Abstract

Provided in the present application are a camera module and a manufacturing method therefor. The camera module includes: a photosensitive assembly including a circuit board; a first lens structure, which is provided on a photosensitive path of the photosensitive assembly; a second lens structure, which is provided between the first lens structure and the photosensitive assembly, wherein the first lens structure and the second lens structure are jointly used for imaging, and the first lens structure is provided farther away from the photosensitive assembly than the second lens structure; a focusing assembly, which is electrically connected to the circuit board, and which is used to constrain the movement of the second lens structure along the optical axis direction of the first lens structure; and an anti-shake assembly, which is electrically connected to the circuit board, and which is used to drive the photosensitive assembly to move on a plane perpendicular to the optical axis of the first lens structure.

First claim

The invention claimed is:

1. A camera module, which is characterized by comprising:
a photosensitive assembly including a circuit board;
a first lens structure provided on a photosensitive path of the photosensitive assembly;
a second lens structure provided between the first lens structure and the photosensitive assembly, wherein, the first lens structure and the second lens structure are jointly used for imaging together, and the first lens structure is provided away from the photosensitive assembly than the second lens structure;
a focusing assembly electrically connected to the circuit board and used to constrain the movement of the second lens structure along an optical axis direction of the first lens structure; and
an anti-shake assembly electrically connected to the circuit board and including a movable part fixedly connected with the photosensitive assembly and a fixing part fixedly connected with the first lens structure and used for driving the movable part to move on a plane perpendicular to the optical axis of the first lens structure to drive the photosensitive assembly to move on the plane perpendicular to the optical axis of the first lens structure.

2. The camera module according to claim 1 , wherein the electrical connection between the focusing assembly and the circuit board is realized through a laser circuit, and the electrical connection between the anti-shake assembly and the circuit board is realized through the laser circuit.

3. The camera module according to claim 1 , wherein the focusing assembly includes:
a driving part fixedly connected with the second lens structure; and
a fixing frame fixedly connected with the first lens structure and constraining the driving part to move along the direction of the optical axis of the first lens structure.

4. The camera module according to claim 3 , wherein the driving part is provided with at least one first magnetic structure, and is provided with at least one first ball groove parallel to the optical axis of the first lens structure; and the fixing frame is provided with at least one first coil structure and at least one second ball groove, and a position of the first coil structure corresponds to a position of the first magnetic structure, and the position of the first ball groove corresponds to a position of the second ball groove; and the focusing assembly further include a plurality of first balls located between the first ball groove and the second ball groove.

5. The camera module according to claim 1 , wherein the movable part is provided with at least one second magnetic structure, and is provided with a plurality of third ball grooves perpendicular to the optical axis of the first lens structure; the fixing part is provided with at least one second coil structure and at least one fourth ball groove, and a position of the second coil structure corresponds to a position of the second magnetic structure, and a position of the fourth ball groove corresponds to a position of the third ball groove; and the anti-shake assembly further include a plurality of second balls located between the third ball groove and the fourth ball groove.

6. The camera module according to claim 1 , which is characterized in that, further comprising: an installation housing, for accommodating the first lens structure and the second lens structure;
the focusing assembly is fixedly connected to the first lens structure through the installation housing;
the anti-shake assembly is fixedly connected to the first lens structure through the installation housing.

7. The camera module according to claim 6 , wherein the installation housing accommodates the photosensitive assembly, and the movable part is fixedly connected to a top surface of the photosensitive assembly, and an outer periphery of the fixing part is fixedly connected to an inner side of an upper edge of the installation housing.

8. The camera module according to claim 6 , further include:
a third lens structure provided between the second lens structure and the photosensitive assembly, and fixedly connected to the first lens structure through the installation housing;
wherein the focusing assembly includes an extension part located on an radial outer side of the third lens structure and extending to the anti-shake assembly along the direction of the optical axis of the first lens structure, and the focusing assembly and the circuit board of the photosensitive assembly are electrically connected to the extension part.

9. The camera module according to claim 1 , wherein at least one lens of the first lens structure includes: the first lens which is farthest from the photosensitive assembly, and an object side surface of the first lens is a plane.

10. The camera module according to claim 1 , wherein the circuit board has a first surface; and the photosensitive assembly includes:
a photosensitive element provided on the first surface of the circuit board and having the photosensitive path;
an electronic component provided on the first surface of the circuit board and provided spaced apart from the photosensitive element;
a molding base provided on the first surface of the circuit board and having a stepped light-passing hole corresponding to the photosensitive path, wherein the stepped light-passing hole includes a first cavity away from the photosensitive element; and
a color filter provided in the first cavity, wherein a thickness of the color filter on the optical axis of the first lens structure is less than or equal to a height of the first cavity on the optical axis of the first lens structure on axis.

11. The camera module according to claim 10 , wherein the circuit board has an installation groove for accommodating the photosensitive element, and a shape of the installation groove corresponds to a shape of the photosensitive element.

12. The camera module according to claim 11 , wherein a reinforcing plate is provided on a second surface of the circuit board opposite to the first surface, and the reinforcing plate is fixed to the second surface of the circuit board.

13. The camera module according to claim 11 , wherein a depth of the installation groove is less than or equal to the thickness of the circuit board.

14. The camera module according to claim 10 , wherein the electronic component is encapsulated by the molding base.

15. A method for manufacturing a camera module, which is characterized by comprising:
providing a second lens structure on an image side of a first lens structure along an optical axis of the first lens structure;
providing a focusing assembly on the image side of the first lens structure along the optical axis of the first lens structure, wherein the focusing assembly is used to constrain the movement of the second lens structure along a direction of the optical axis of the first lens structure;
providing a photosensitive assembly including a circuit board on an image side of the second lens structure, wherein the second lens structure is located on a photosensitive path of the photosensitive assembly;
providing an anti-shake assembly at the photosensitive assembly, wherein the anti-shake assembly includes a movable part fixedly connected with the photosensitive assembly and a fixing part fixedly connected with the first lens structure and used for driving the movable part to move on a plane perpendicular to the optical axis of the first lens structure to drive the photosensitive assembly to move on the plane perpendicular to the optical axis of the first lens structure; and
electrically connecting the anti-shake assembly and the circuit board and electrically connecting t

Assignees

• Ningbo Sunny Opotech Co Ltd

Inventors

• Liu Jia
• Yuan Dongli
• Wei Hangang
• He Yanning

Classifications

• H04N23/67

  Focus control based on electronic image sensor signals · CPC title

• H04N23/52

  Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements · CPC title

• H04N23/54 Primary

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/16

  Optical arrangements associated therewith, e.g. for beam-splitting or for colour correction · CPC title

• H04N23/681

  Motion detection · CPC title