Pressure-sensitive adhesive composition, pressure-sensitive adhesive layer, and pressure-sensitive adhesive sheet

Patent metadata

Field	Value
Publication number	US-12359099-B2
Application number	US-202017630874-A
Country	US
Kind code	B2
Filing date	Jul 29, 2020
Priority date	Jul 30, 2019
Publication date	Jul 15, 2025
Grant date	Jul 15, 2025

Abstract

The present invention relates to a pressure-sensitive adhesive composition including a compound having a substituent represented by the general formula (1) described in the specification, in which when each of R 1 and R 2 in the substituent represented by the general formula (1) represents a hydrogen atom, a distance between an oxygen atom of —OR 1 and an oxygen atom of —OR 2 is 1.31 Å or more and 4.70 Å or less, a pressure-sensitive adhesive layer formed of the pressure-sensitive adhesive composition, and a pressure-sensitive adhesive sheet comprising the pressure-sensitive adhesive layer.

First claim

The invention claimed is:

1. A pressure-sensitive adhesive composition, comprising
a compound having a substituent represented by the following general formula (1),
wherein,
the compound is a polymer containing a structure derived from a (meth) acrylate monomer whose homopolymer has a glass transition temperature of 10° C. or lower, and

when each of R 1 and R 2 in the substituent represented by the general formula (1) represents a hydrogen atom, a distance between an oxygen atom of —OR 1 and an oxygen atom of —OR 2 is 1.31 Å or more and 4.70 Å or less

(in the general formula (1), L represents a phosphorus atom, or a boron atom; and each of R 1 and R 2 independently represents a hydrogen atom, or an aliphatic hydrocarbon group, an aryl group or a heterocyclic group which may have a substituent).

2. A pressure-sensitive adhesive layer formed of the pressure-sensitive adhesive composition according to claim 1 .

3. A pressure-sensitive adhesive sheet comprising the pressure-sensitive adhesive layer according to claim 2 .

4. The pressure-sensitive adhesive sheet according to claim 3 , wherein the pressure-sensitive adhesive layer is formed on a substrate.

Assignees

• Nitto Denko Corp

Inventors

• Mizuno Daisuke
• Tani Kensuke
• Honda Satoshi

Classifications

• C09J143/00

  Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium, or a metal; Adhesives based on derivatives of such polymers · CPC title

• C08F220/1804

  C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate · CPC title

• C09J2203/346

  for building applications e.g. wrap foil · CPC title

• C09J2203/35

  for aeronautic or naval applications · CPC title

• C09J2301/312

  parameters being the characterizing feature · CPC title