High-frequency dielectric heating adhesive sheet

Patent metadata

Field	Value
Publication number	US-12359096-B2
Application number	US-202117915059-A
Country	US
Kind code	B2
Filing date	Mar 26, 2021
Priority date	Mar 31, 2020
Publication date	Jul 15, 2025
Grant date	Jul 15, 2025

Abstract

A high-frequency dielectric heating adhesive sheet includes: a first bonding layer containing a first thermoplastic resin and a first dielectric filler; and a second bonding layer containing a second thermoplastic resin and a second dielectric filler. A volume content VA1 of the first thermoplastic resin in the first bonding layer and a volume content VA2 of the second thermoplastic resin in the second bonding layer are in a range from 60% by volume to 100% by volume. Change rates Vx1 and Vx2 represented by formulas below are less than 80%. VB1 is the volume content of the first thermoplastic resin in a layer in direct contact with the first bonding layer, and VB2 is the volume content of the second thermoplastic resin in a layer in direct contact with the second bonding layer. (Formula 1): Vx1={(VA1−VB1)/VA1}×100 (Formula 2): Vx2={(VA2−VB2)/VA2}×100

First claim

The invention claimed is:

1. A high-frequency dielectric heating adhesive sheet comprising:
a first bonding layer serving as an outermost layer; and
a second bonding layer serving as an outermost layer and located on a side opposite to the first bonding layer, wherein
the first bonding layer comprises: a first thermoplastic resin; and a first dielectric filler that generates heat under application of a high-frequency wave,
the second bonding layer comprises: a second thermoplastic resin; and a second dielectric filler that generates heat under application of a high-frequency wave,
the first thermoplastic resin and the second thermoplastic resin are different resins,
a volume content VA1 of the first thermoplastic resin with respect to a total volume of all thermoplastic resins in the first bonding layer is in a range from 60% by volume to 100% by volume,
a volume content VA2 of the second thermoplastic resin with respect to the total volume of all thermoplastic resins in the second bonding layer is in a range from 60% by volume to 100% by volume,
a change rate Vx1 represented by a numerical formula (Numerical Formula 1) below and indicating a rate of change between the volume content VA1 of the first thermoplastic resin and a volume content VB1 of the first thermoplastic resin with respect to the total volume of all thermoplastic resins in a layer (1) in direct contact with the first bonding layer is less than 80%,
a change rate Vx2 represented by a numerical formula (Numerical Formula 2) below and indicating a rate of change between the volume content VA2 of the second thermoplastic resin and a volume content VB2 of the second thermoplastic resin with respect to the total volume of all thermoplastic resins in a layer (2) in direct contact with the second bonding layer is less than 80%,
when an intermediate layer is disposed between the first bonding layer and the second bonding layer, the layer (2) in direct contact with the second bonding layer is the intermediate layer, and the layer (1) in direct contact with the first bonding layer is the intermediate layer, and
when the first bonding layer is in direct contact with the second bonding layer, the layer (2) in direct contact with the second bonding layer is the first bonding layer, and the layer (1) in direct contact with the first bonding layer is the second bonding layer,
Vx 1={( VA 1 −VB 1)/ VA 1}×100  (Numerical Formula 1)

Vx 2={( VA 2 −VB 2)/ VA 2}×100  (Numerical Formula 2).

2. The high-frequency dielectric heating adhesive sheet according to claim 1 , wherein
the high-frequency dielectric heating adhesive sheet is a sheet for bonding together a first adherend and a second adherend made of a material different from a material forming the first adherend,
the first adherend comprises a third thermoplastic resin,
the second adherend comprises a fourth thermoplastic resin,
a main component of the first thermoplastic resin is the same as a main component of the third thermoplastic resin,
a main component of the second thermoplastic resin is the same as a main component of the fourth thermoplastic resin,
the first bonding layer is bonded to the first adherend, and
the second bonding layer is bonded to the second adherend.

3. The high-frequency dielectric heating adhesive sheet according to claim 1 , wherein
at least one of a volume content of the first dielectric filler in the first bonding layer or a volume content of the second dielectric filler in the second bonding layer is in a range from 5% by volume to 50% by volume.

4. The high-frequency dielectric heating adhesive sheet according to claim 1 , wherein
at least one of the first dielectric filler or the second dielectric filler is at least one selected from the group consisting of zinc oxide, silicon carbide, titanium oxide, and barium titanate.

5. The high-frequency dielectric heating adhesive sheet according to claim 1 , wherein
at least one of a volume average particle size of the first dielectric filler or a volume average particle size of the second dielectric filler is in a range from 1 μm to 30 μm, and
the volume average particle size is determined by measuring a particle size distribution of the at least one of the first dielectric filler or the second dielectric filler by a laser diffraction/scattering method and calculating the volume average particle size according to JIS Z 8819-2:2001 from results of the measurement of the particle size distribution.

6. The high-frequency dielectric heating adhesive sheet according to claim 1 , wherein
the first thermoplastic resin is a polyolefin resin.

7. The high-frequency dielectric heating adhesive sheet according to claim 1 , wherein
an absolute value of a difference between a flow start temperature Tx1 of the first thermoplastic resin and a flow start temperature Tx2 of the second thermoplastic resin satisfies a relationship of a numerical formula (Numerical Formula 4) below,
| Tx 1 −Tx 2|≤70 degrees C.  (Numerical Formula 4).

8. The high-frequency dielectric heating adhesive sheet according to claim 1 , wherein
in each of the layers included in the high-frequency dielectric heating adhesive sheet, after a cross-cut test according to JIS K5600-5-6:1999, a ratio of the number of grids that are not peeled off from and are adhering to a layer in contact with the each of the layers is 50% or more.

9. The high-frequency dielectric heating adhesive sheet according to claim 1 , wherein
the intermediate layer is disposed between the first bonding layer and the second bonding layer.

10. The high-frequency dielectric heating adhesive sheet according to claim 9 , wherein
the intermediate layer comprises the first thermoplastic resin and the second thermoplastic resin.

11. The high-frequency dielectric heating adhesive sheet according to claim 1 , wherein
the layer (1) in direct contact with the first bonding layer is the second bonding layer.

Assignees

• Lintec Corp

Inventors

• Taya Naoki
• Miyata Sou

Classifications

• H05B6/46

  Dielectric heating (H05B6/64 takes precedence) · CPC title

• C09J2433/00

  Presence of (meth)acrylic polymer · CPC title

• C09J2425/00

  Presence of styrenic polymer · CPC title

• C09J2423/10

  Presence of homo or copolymers of propene · CPC title

• C09J133/12

  Homopolymers or copolymers of methyl methacrylate · CPC title