Laminating and shaping copper powder, laminated and shaped object, manufacturing method of laminated and shaped object, and laminating and shaping apparatus

Patent metadata

Field	Value
Publication number	US-12358076-B2
Application number	US-202017607736-A
Country	US
Kind code	B2
Filing date	Jun 4, 2020
Priority date	Jun 13, 2019
Publication date	Jul 15, 2025
Grant date	Jul 15, 2025

Abstract

The present invention provides a laminating and shaping copper powder capable of shaping a laminated and shaped object of copper having a high electrical conductivity of, for example, 80% IACS or more. The present invention is a laminating and shaping copper powder obtained by mixing a nano-oxide of equal to or more than 0.01 wt % and equal to or less than 0.20 wt % and a pure copper powder. There is also provided a laminated and shaped object using the laminating and shaping copper powder of the present invention. There are also provided a manufacturing method of the laminated and shaped object using the laminating and shaping copper powder of the present invention and a laminating and shaping apparatus using the laminating and shaping copper powder.

First claim

The invention claimed is:

1. A laminating and shaping copper powder, in which a pure copper powder and a nano-oxide of equal to or more than 0.10 wt % and equal to or less than 0.20 wt % are mixed,
wherein the pure copper powder comprises spherical particles having an average particle diameter equal to or more than 5 μm and equal to or less than 10 μm,
wherein the nano-oxide comprises spherical particles having a primary average particle diameter equal to or more than 10 nm and equal to or less than 100 nm,
wherein a powder resistance value of the laminating and shaping copper powder is equal to or more than (7.50E+5) Ω and equal to or less than (2.50E+7) Ω, and
wherein the laminating and shaping copper powder, when melted with energy from a laser, is shapable into an object having an electrical conductivity of at least 94.1% IACS.

2. The laminating and shaping copper powder according to claim 1 , wherein the nano-oxide is SiO 2 .

3. The laminating and shaping copper powder according to claim 1 , wherein a flow rate of the laminating and shaping copper powder measured by JIS Z2502 is equal to or more than 15 sec/50 g and equal to or less than 120 sec/50 g.

Assignees

• Fukuda Metal Foil & Powder Co Ltd
• Tech Res Association Future Additive Manufacturing

Inventors

• Sugitani Yuji
• Kyogoku Hideki

Classifications

• C22C1/059

  Making alloys comprising less than 5% by weight of dispersed reinforcing phases · CPC title

• C22C32/0021

  Matrix based on noble metals, Cu or alloys thereof · CPC title

• C22C1/10

  Alloys containing non-metals (C22C1/05, C22C1/08 take precedence) · CPC title

• B22F1/00

  Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties · CPC title

• B22F1/105

  containing inorganic lubricating or binding agents, e.g. metal salts · CPC title