Method for forming a metal matrix composite structure

US12358071B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12358071-B2
Application numberUS-202218283253-A
CountryUS
Kind codeB2
Filing dateMar 18, 2022
Priority dateMar 22, 2021
Publication dateJul 15, 2025
Grant dateJul 15, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for friction stir forming a metal matrix composite (MMC) structure ( 76 ). The method includes the step of providing a substrate ( 12 ) comprising a metallic material and securing a preformed MMC layer ( 14, 16 ) comprising an MMC material in a position overlying at least a portion of the substrate ( 12 ). The method further includes the step of friction stirring the preformed MMC layer ( 14, 16 ) with a friction stirring tool ( 50 ) which includes a rotating probe ( 56 ), including locating the probe ( 56 ) at a stirring depth at which the probe ( 56 ) extends through the preformed MMC layer ( 14, 16 ) into a portion of the substrate ( 12 ) and passing the tool ( 50 ) through the preformed MMC layer ( 14 ) at the stirring depth to friction stir the preformed MMC layer ( 14, 16 ) and integrate the preformed MMC layer ( 14, 16 ) with the substrate ( 12 ).

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for friction stir forming a metal matrix composite (MMC) structure, the method including the steps of: a) providing a substrate comprising a metallic material and securing a preformed MMC layer comprising an MMC material in a position overlying at least a portion of the substrate; and b) friction stirring the preformed MMC layer with a friction stirring tool which includes a rotating probe, including locating the probe at a stirring depth at which the probe extends through the preformed MMC layer into a portion of the substrate and passing the rotating probe through the preformed MMC layer at the stirring depth to friction stir the preformed MMC layer and integrate the preformed MMC layer with the substrate; wherein the rotating probe is passed through the preformed MMC layer along an overlapping stir path and wherein the stir path is configured to relocate defects to an edge of the MMC structure to facilitate subsequent removal. 2. A method according to claim 1 , wherein the stirring tool stirs substantially all of the MMC material in the preformed MMC layer. 3. A method according to claim 1 , wherein the preformed MMC layer comprises a rigid sheet. 4. A method according to claim 1 , wherein the preformed MMC layer comprises a metal/ceramic MMC material and wherein the preformed MMC layer has a ceramic volume fraction of at least 20%. 5. A method according to claim 1 , wherein the preformed MMC layer is secured within a recess of the substrate. 6. A method according to claim 1 , wherein securing the preformed MMC layer to the substrate comprises one or more initial passes of the friction stirring tool. 7. A method according to claim 1 , wherein the friction stirring tool includes a rotating shoulder in contact with a surface of the preformed MMC layer and wherein the probe and shoulder are integrally formed in a tool insert and wherein the friction stirring tool further includes a holder for receiving the insert and wherein the insert and holder are configured to minimise heat transfer from the insert to the holder. 8. A method according to claim 1 , wherein the friction stirring tool includes a rotating shoulder in contact with a surface of the preformed MMC layer and wherein the shoulder is circular and a ratio of the shoulder diameter to a root probe diameter is approximately between 3:1 and 5:1. 9. A method according to claim 1 , wherein the substrate is removably secured to a support plate and wherein the support plate is invertible after completion of the friction stirring performed using a first side of the support plate to permit a subsequent friction stirring operation performed using a second and opposite side of the support plate. 10. A method according to claim 1 , wherein the MMC layer comprises a plurality of preformed MMC segments. 11. A method according to claim 10 , wherein each preformed MMC segment comprises a rigid MMC sheet. 12. A method according to claim 10 , wherein the preformed MMC segments are stirred one-by-one according to a predetermined stirring sequence. 13. A method according to claim 10 , wherein the MMC layer has a planar configuration and the plurality of MMC segments is arranged in an approximately co-planar arrangement to collectively form the MMC layer. 14. A method according to claim 1 , wherein the stir path includes a series of overlapping stir passes which conclude at or adjacent an edge of the structure. 15. A method according to claim 5 , wherein the MMC layer corresponds in shape to the recess. 16. A method according to claim 5 , wherein the MMC layer comprises a plurality of MMC segments which collectively form a shape corresponding to the substrate recess. 17. A method according to claim 7 , wherein the tool insert is formed of an insert material and the holder is formed of a holder material having a lower thermal conductivity than the inset material. 18. A method according to claim 7 , wherein the stirring tool includes a void within the holder which surrounds at least a portion of the insert. 19. A method according to claim 1 , wherein the probe is frustoconical and has a tapering angle of between 10° to 20°.

Assignees

Inventors

Classifications

  • Tools therefor, e.g. characterised by the shape of the probe · CPC title

  • Rotary tool drive mechanism · CPC title

  • for other purposes than joining, e.g. built-up welding · CPC title

  • Composite materials · CPC title

  • Dissimilar materials · CPC title

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Frequently asked questions

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What does patent US12358071B2 cover?
A method for friction stir forming a metal matrix composite (MMC) structure ( 76 ). The method includes the step of providing a substrate ( 12 ) comprising a metallic material and securing a preformed MMC layer ( 14, 16 ) comprising an MMC material in a position overlying at least a portion of the substrate ( 12 ). The method further includes the step of friction stirring the preformed MMC laye…
Who is the assignee on this patent?
Commw Scient Ind Res Org
What technology area does this patent fall under?
Primary CPC classification B33Y10/00. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 15 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 9 related publications on this page (citations in our corpus or others sharing the same primary CPC).