Integrated electro-magnetically preloaded kinematic joint for on-orbit assembly of modular space vehicles

US12354777B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12354777-B2
Application numberUS-202117492887-A
CountryUS
Kind codeB2
Filing dateOct 4, 2021
Priority dateOct 4, 2021
Publication dateJul 8, 2025
Grant dateJul 8, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A payload-bus kinematic interface system includes one or more kinematic devices. Each kinematic device includes a first contacting surface and a second contacting surface. The first contacting surface kinematically interfaces with the second contacting surface, passing loads or forces to the second contacting surface.

First claim

Opening claim text (preview).

The invention claimed is: 1. A payload-bus kinematic interface system, comprising: one or more reusable kinematic devices, each of which comprise a first internal contacting surface and a second internal contacting surface, wherein the first internal contacting surface kinematically interfaces with the second internal contacting surface, passing loads or forces to the second internal contacting surface; and one or more electropermanent magnets (EPMs) is associated with each of the one or more of kinematic devices. 2. The payload-bus kinematic interface system of claim 1 , wherein each of the one or more EPMs are configured to provide a clamping force during an ON state, the clamping force connects the first internal contacting surface with the second internal contacting surface. 3. The payload-bus kinematic interface system of claim 1 , wherein the first internal contacting surface comprises a cone-shaped interface sphere configured to interface with a cup-shaped receiving portion of the second contacting point. 4. The payload-bus kinematic interface system of claim 1 , wherein the second internal contacting surface comprises a cup-shaped receiving portion configured to interface with a cone-shaped interface sphere of the first contacting surface. 5. The payload-bus kinematic interface system of claim 4 , wherein the cup-shaped receiving portion comprises a bevel configured to aid with initial alignment of the first contacting surface. 6. The payload-bus kinematic interface system of claim 4 , wherein the cup-shaped receiving portion further comprises a lateral slipping support configured to support lateral loads when the lateral loads exceed a capability of a preloaded first and second surface. 7. The payload-bus kinematic interface system of claim 1 , further comprising: a first complementary contacting surface comprises a plurality of mounting features, each of which are configured to assemble the first complementary contacting surface onto an adjacent structure. 8. The payload-bus kinematic interface system of claim 1 , further comprising: a second complementary contacting surface comprises a plurality of mounting features, each of which are configured to assemble the second complementary contacting surface onto an adjacent structure. 9. The payload-bus kinematic interface system of claim 1 , wherein the first internal contacting surface and second internal contacting surface are configured to provide a mechanical connection between two separate adjacent structures when the first internal contacting surface and the second internal contacting surface interface with one another. 10. The system of claim 1 , further comprising: a first set of thermal insulative washers attached to a first complementary contacting surface; and a second set of thermal insulative washers attached to first complementary contacting surface, wherein the first set of thermal insulative washers and the second set of thermal insulative washers are configured to decrease thermal conductance. 11. A system configured to provide an interface between a first device and a second device, the system comprising: a plurality of kinematic devices arranged in a pattern to support expected on-orbit maneuver loads; and one or more electropermanent magnets (EPMs) surrounding each of the plurality of kinematic devices, wherein each of the plurality of kinematic devices comprises a first complementary surface attached to a first adjacent surface of the first device and a second complementary surface attached to a second adjacent surface of the second device, and the first complementary surface and the second complementary surface are configured to provide a mechanical connection integrated with the one or more EPMs. 12. The system of claim 11 , wherein the one or more EPMs is configured to provide the clamping and restraining force. 13. The system of claim 11 , wherein the first adjacent surface is an attachment panel of the first device or an attachment panel of the second device. 14. The system of claim 11 , wherein the second adjacent surface is an attachment panel of the first device or an attachment panel of the second device. 15. The system of claim 11 , wherein the first complementary surface and the second complementary surface are configured to pass loads between the first device and second device. 16. The system of claim 11 , wherein the first complementary surface and the second complementary surface are configured to provide alignment and precision positioning between the first device and second device. 17. A payload-bus kinematic interface system, comprising: one or more kinematic devices arranged in a pattern between a payload and a bus, each of which comprise a first contacting surface, a second contacting surface, and a plurality of electropermanent magnets (EPMs) surrounding the first contacting surface and the second contacting surface, wherein each of the plurality of EPMs apply a magnetically induced preload, the magnetically induced preload with the first contacting surface and the second contacting surface constrain up to 6 degrees of freedom (DOF). 18. The payload-bus kinematic interface system of claim 17 , wherein the magnetically induced preload constrains an insertion axis. 19. The payload-bus kinematic interface system of claim 17 , wherein the first contacting surface kinematically interfaces with the second contacting surface, passing loads or forces to the second contacting surface or vice versa. 20. The payload-bus kinematic interface system of claim 17 , wherein the first complementary surface and the second complementary surface are configured to provide alignment and precision positioning between the payload and bus.

Assignees

Inventors

Classifications

  • Clamps, e.g. Marman clamps · CPC title

  • Magnetic drives, magnetic coupling devices · CPC title

  • Construction of PM (H01F7/0278 takes precedence; PM compositions H01F1/032) · CPC title

  • Electromagnets for lifting, handling or transporting of magnetic pieces or material (electromagnets for guidance of vehicles, workpieces B65G21/2009; for magnetic suspension or levitation H02N15/00) · CPC title

  • combined with permanent magnets · CPC title

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Frequently asked questions

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What does patent US12354777B2 cover?
A payload-bus kinematic interface system includes one or more kinematic devices. Each kinematic device includes a first contacting surface and a second contacting surface. The first contacting surface kinematically interfaces with the second contacting surface, passing loads or forces to the second contacting surface.
Who is the assignee on this patent?
Aerospace Corp
What technology area does this patent fall under?
Primary CPC classification H01F7/0231. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jul 08 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).