Touch module and terminal device

Patent metadata

Field	Value
Publication number	US-12353259-B2
Application number	US-202017793869-A
Country	US
Kind code	B2
Filing date	Dec 10, 2020
Priority date	Jan 20, 2020
Publication date	Jul 8, 2025
Grant date	Jul 8, 2025

Abstract

A touch module is provided, which includes a base layer, an intermediate layer, and a touch layer. The intermediate layer is mounted on the base layer, and the touch layer is mounted on the intermediate layer. The intermediate layer has a heat dissipation substrate and foam that are attached to each other, the heat dissipation substrate has an etched surface and a back surface that are opposite to each other, and a near field communication coil is etched on the etched surface. A terminal device including a housing and a display panel is also provided. The display panel is disposed on the housing, and the touch module is disposed on the display panel. The near field communication coil is integrated on the heat dissipation substrate.

First claim

What is claimed is:

1. A touch module, comprising: a base layer, an intermediate layer, and a touch layer, wherein
the intermediate layer is mounted on the base layer, and the touch layer is mounted on the intermediate layer; and
the intermediate layer has a heat dissipation substrate and foam that are attached to each other, the heat dissipation substrate has an etched surface and a back surface that are opposite to each other, and a near field communication coil is etched on the etched surface; and
wherein a support film is further disposed on the intermediate layer, one surface of the support film is attached to a surface that is of the foam and that is away from the heat dissipation substrate, and an other surface of the support film is attached to the touch layer.

2. The touch module according to claim 1 , wherein the etched surface is a metal foil, the metal foil has a heat dissipation part, and the near field communication coil is etched on the metal foil around the heat dissipation part towards an edge of the metal foil; and the back surface is attached to the base layer, and the metal foil is attached to the foam.

3. The touch module according to claim 1 , wherein the etched surface is a support film, the support film has a heat dissipation part, and the near field communication coil is etched on the support film around the heat dissipation part towards an edge of the support film; and the support film is attached to the touch layer, the back surface is attached to the foam, and a surface that is of the foam and that is away from the heat dissipation substrate is attached to the base layer.

4. The touch module according to claim 2 , wherein an area of the heat dissipation part accounts for ½ to ⅔ of a total area of the heat dissipation substrate.

5. The touch module according to claim 4 , wherein a center of the heat dissipation part coincides with a center of the heat dissipation substrate.

6. The touch module according to claim 1 , wherein the intermediate layer and the base layer are fastened together by using a connection part.

7. The touch module according to claim 6 , wherein two ends of the connection part are respectively connected to an edge of the heat dissipation substrate and an edge of the base layer.

8. The touch module according to claim 7 , wherein the connection part passes through an edge of the foam.

9. The touch module according to claim 6 , wherein the connection part is connected and fastened in a welding manner.

10. A terminal device, comprising a housing and a display panel, wherein the display panel is disposed on the housing, and a touch module is disposed on the display panel;
wherein the touch module comprises: a base layer, an intermediate layer, and a touch layer, wherein the intermediate layer is mounted on the base layer, and the touch layer is mounted on the intermediate layer; and the intermediate layer has a heat dissipation substrate and foam that are attached to each other, the heat dissipation substrate has an etched surface and a back surface that are opposite to each other, and a near field communication coil is etched on the etched surface; and
wherein a support film is further disposed on the intermediate layer, one surface of the support film is attached to a surface that is of the foam and that is away from the heat dissipation substrate, and an other surface of the support film is attached to the touch layer.

11. The terminal device according to claim 10 , wherein the etched surface is a metal foil, the metal foil has a heat dissipation part, and the near field communication coil is etched on the metal foil around the heat dissipation part towards an edge of the metal foil; and the back surface is attached to the base layer, and the metal foil is attached to the foam.

12. The terminal device according to claim 10 , wherein the etched surface is a support film, the support film has a heat dissipation part, and the near field communication coil is etched on the support film around the heat dissipation part towards an edge of the support film; and the support film is attached to the touch layer, the back surface is attached to the foam, and a surface that is of the foam and that is away from the heat dissipation substrate is attached to the base layer.

13. The terminal device according to claim 11 , wherein an area of the heat dissipation part accounts for ½ to ⅔ of a total area of the heat dissipation substrate.

14. The terminal device according to claim 13 , wherein a center of the heat dissipation part coincides with a center of the heat dissipation substrate.

15. The terminal device according to claim 10 , wherein the intermediate layer and the base layer are fastened together by using a connection part.

16. The terminal device according to claim 15 , wherein two ends of the connection part are respectively connected to an edge of the heat dissipation substrate and an edge of the base layer.

17. The terminal device according to claim 16 , wherein the connection part passes through an edge of the foam.

18. The terminal device according to claim 15 , wherein the connection part is connected and fastened in a welding manner.

Assignees

• Huawei Tech Co Ltd

Inventors

• Li Jiewei
• Jia Weibo
• Li Yapeng
• Xie Lubing

Classifications

• H10K59/12

  Active-matrix OLED [AMOLED] displays · CPC title

• H10K59/8794

  Arrangements for heating and cooling · CPC title

• H05K7/20963

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20972 takes precedence) · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• G06F2203/04103

  Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title