Manufacturing method of an electronic device

Patent metadata

Field	Value
Publication number	US-12353100-B2
Application number	US-202318468751-A
Country	US
Kind code	B2
Filing date	Sep 18, 2023
Priority date	Dec 22, 2020
Publication date	Jul 8, 2025
Grant date	Jul 8, 2025

Abstract

A manufacturing method of an electronic device is provided. The manufacturing method of the electronic device includes: providing a substrate; providing an adjustable element, including a liquid crystal layer; and bonding the adjustable element onto the substrate.

First claim

What is claimed is:

1. A manufacturing method of an electronic device, comprising:
providing a substrate, wherein the substrate comprises a first pad and a second pad;
providing an adjustable element, comprising a liquid crystal layer, a third pad, and a fourth pad,
wherein the adjustable element is bonded to the substrate through the third pad and the fourth pad, and the third pad and the fourth pad are separated from each other,
wherein a manufacturing method of the adjustable element comprises:
providing a first substrate;
providing a second substrate;
providing the liquid crystal layer;
sealing the liquid crystal layer between the first substrate and the second substrate; and
forming the third pad and the fourth pad respectively on a sidewall of the first substrate and a sidewall of the second substrate.

2. The manufacturing method of the electronic device according to claim 1 , wherein the first pad is bonded onto the third pad, and the second pad is bonded onto the fourth pad.

3. The manufacturing method of the electronic device according to claim 1 , wherein the manufacturing method of the adjustable element further comprises:
before providing the liquid crystal layer, sequentially providing a first conductive layer and a first alignment layer on the first substrate; and
before providing the liquid crystal layer, sequentially providing a second conductive layer and a second alignment layer on the second substrate.

4. The manufacturing method of the electronic device according to claim 3 , wherein the manufacturing method of the adjustable element further comprises:
before providing the liquid crystal layer, providing a sealing member on a surface of the second alignment layer away from the second substrate.

5. The manufacturing method of the electronic device according to claim 1 , wherein the manufacturing method of the adjustable element further comprises:
disposing a protective layer on another sidewall of the first substrate and another sidewall of the second substrate.

6. The manufacturing method of the electronic device according to claim 1 , wherein the manufacturing method of the adjustable element further comprises:
providing an insulating layer on a side of the first substrate away from the second substrate; and
providing another insulating layer on a side of the second substrate away from the first substrate.

7. The manufacturing method of the electronic device according to claim 1 , wherein the adjustable element is used as a variable capacitor.

8. The manufacturing method of the electronic device according to claim 1 , further comprising:
after bonding the adjustable element onto the substrate, encapsulating the adjustable element with a protective layer.

Assignees

• Innolux Corp

Inventors

• Yeh Chen-Lin
• Wei Chung-Kuang
• Chi Jen-Hai
• Wu Yan-Zheng

Classifications

• G02F1/1339

  Gaskets; Spacers; Sealing of cells · CPC title

• G02F1/1337

  Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers · CPC title

• H01G7/06

  having a dielectric selected for the variation of its permittivity with applied voltage, i.e. ferroelectric capacitors (electrets H01G7/02) · CPC title

• H01Q3/34

  by electrical means (active lenses or reflecting arrays H01Q3/46) · CPC title

• H01Q3/44

  varying the electric or magnetic characteristics of reflecting, refracting, or diffracting devices associated with the radiating element · CPC title