Enabling passive alignment for lens attach

US12353032B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12353032-B2
Application numberUS-202117213131-A
CountryUS
Kind codeB2
Filing dateMar 25, 2021
Priority dateMar 25, 2021
Publication dateJul 8, 2025
Grant dateJul 8, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package comprises a photonics die and a plurality of v-grooves on the photonics die. In an embodiment, a lens array is optically coupled to a spot size converter on the photonics die. In an embodiment, the lens array comprises a main body and a plurality of lenses extending out from the main body.

First claim

Opening claim text (preview).

What is claimed is: 1. A photonics package, comprising: a photonics die; a plurality of v-grooves on the photonics die; and a lens array optically coupled to a spot size converter on the photonics die, wherein the lens array comprises: a main body; and a plurality of lenses extending out from the main body. 2. The photonics package of claim 1 , wherein individual ones of the plurality of lenses are disposed in different ones of the plurality of v-grooves. 3. The photonics package of claim 1 , wherein the lens array further comprises: a pair of alignment posts extending out from the main body. 4. The photonics package of claim 3 , wherein the alignment posts and the plurality of lenses extend out from a first surface of the main body. 5. The photonics package of claim 3 , wherein the alignment posts extend out from a first surface of the main body, and wherein the plurality of lenses extend out from a second surface of the main body. 6. The photonics package of claim 3 , wherein the alignment posts are disposed in the v-grooves. 7. The photonics package of claim 1 , wherein the lens array further comprises: a pair of holes through the main body; a second body; a pair of alignment posts extending out from the second body, wherein the alignment posts extend through the pair of holes through the main body. 8. The photonics package of claim 7 , wherein the second body is secured to the first body by an epoxy. 9. The photonics package of claim 7 , further comprising: a pair of barriers between the pair of holes and the lenses. 10. The photonics package of claim 1 , further comprising: a plurality of waveguides extending through the main body, wherein each waveguide is optically coupled to one of the plurality of lenses; and a saw-tooth pattern on a bottom surface of the main body. 11. The photonics package of claim 10 , wherein the saw-tooth pattern sits into the plurality of v-grooves on the photonics die. 12. The photonics package of claim 1 , wherein the main body is L-shaped. 13. The photonics package of claim 12 , wherein cylindrical protrusions extend out from a surface of the main body, and wherein the plurality of lenses are at ends of the cylindrical protrusions. 14. The photonics package of claim 13 , wherein the cylindrical protrusions are set into the plurality of v-grooves on the photonics die. 15. The photonics package of claim 1 , further comprising: cylindrical ridges on a first surface of the main body; and a recessed surface on a second surface of the main body, wherein the lenses are on the recessed surface. 16. The photonics package of claim 15 , wherein the cylindrical ridges are set into the plurality of v-grooves on the photonics die. 17. A photonics package, comprising: a photonics die; a plurality of v-grooves in the photonics die; and a lens array optically coupled to a spot size converter on the photonics die, wherein the lens array comprises: a fiber housing; a plurality of optical fibers in the fiber housing; and a plurality of lenses at an end of the optical fibers. 18. The photonics package of claim 17 , wherein the plurality of optical fibers are set into the plurality of v-grooves on the photonics die. 19. The photonics package of claim 17 , wherein the plurality of lenses are discrete bodies from the plurality of optical fibers. 20. The photonics package of claim 17 , wherein the plurality of lenses are fabricated as part of the plurality of optical fibers. 21. A photonics system, comprising: a board; a package substrate coupled to the board; a processor on the package substrate; a photonics die on the package substrate and communicatively coupled to the processor, and a plurality of v-grooves on the photonics die; and a lens array coupled to an edge of the photonics die. 22. The photonics system of claim 21 , wherein the lens array comprises: a main body; and a plurality of lenses extending out from the main body. 23. The photonics system of claim 22 , wherein individual ones of the plurality of lenses are disposed in different ones of the plurality of v-grooves. 24. The photonics system of claim 22 , wherein the lens array further comprises: a pair of alignment posts extending out from the main body. 25. The photonics system of claim 22 , wherein the lens array further comprises: a pair of holes through the main body; a second body; a pair of alignment posts extending out from the second body, wherein the alignment posts extend through the pair of holes through the main body.

Assignees

Inventors

Classifications

  • Mounting of the optical elements · CPC title

  • Optical features (G02B6/4207, G02B6/421 take precedence) · CPC title

  • G02B6/4204Primary

    the coupling comprising intermediate optical elements, e.g. lenses, holograms (encapsulated active devices H01S5/02208) · CPC title

  • the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers · CPC title

  • the mechanical coupling means being grooves (G02B6/3652 takes precedence) · CPC title

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What does patent US12353032B2 cover?
Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package comprises a photonics die and a plurality of v-grooves on the photonics die. In an embodiment, a lens array is optically coupled to a spot size converter on the photonics die. In an embodiment, the lens array comprises a main body and a plurality of lenses extending out from the main body.
Who is the assignee on this patent?
Intel Corp
What technology area does this patent fall under?
Primary CPC classification G02B6/4204. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jul 08 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).