Silicon photonics connector
US-10146009-B2 · Dec 4, 2018 · US
US12353032B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12353032-B2 |
| Application number | US-202117213131-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 25, 2021 |
| Priority date | Mar 25, 2021 |
| Publication date | Jul 8, 2025 |
| Grant date | Jul 8, 2025 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package comprises a photonics die and a plurality of v-grooves on the photonics die. In an embodiment, a lens array is optically coupled to a spot size converter on the photonics die. In an embodiment, the lens array comprises a main body and a plurality of lenses extending out from the main body.
Opening claim text (preview).
What is claimed is: 1. A photonics package, comprising: a photonics die; a plurality of v-grooves on the photonics die; and a lens array optically coupled to a spot size converter on the photonics die, wherein the lens array comprises: a main body; and a plurality of lenses extending out from the main body. 2. The photonics package of claim 1 , wherein individual ones of the plurality of lenses are disposed in different ones of the plurality of v-grooves. 3. The photonics package of claim 1 , wherein the lens array further comprises: a pair of alignment posts extending out from the main body. 4. The photonics package of claim 3 , wherein the alignment posts and the plurality of lenses extend out from a first surface of the main body. 5. The photonics package of claim 3 , wherein the alignment posts extend out from a first surface of the main body, and wherein the plurality of lenses extend out from a second surface of the main body. 6. The photonics package of claim 3 , wherein the alignment posts are disposed in the v-grooves. 7. The photonics package of claim 1 , wherein the lens array further comprises: a pair of holes through the main body; a second body; a pair of alignment posts extending out from the second body, wherein the alignment posts extend through the pair of holes through the main body. 8. The photonics package of claim 7 , wherein the second body is secured to the first body by an epoxy. 9. The photonics package of claim 7 , further comprising: a pair of barriers between the pair of holes and the lenses. 10. The photonics package of claim 1 , further comprising: a plurality of waveguides extending through the main body, wherein each waveguide is optically coupled to one of the plurality of lenses; and a saw-tooth pattern on a bottom surface of the main body. 11. The photonics package of claim 10 , wherein the saw-tooth pattern sits into the plurality of v-grooves on the photonics die. 12. The photonics package of claim 1 , wherein the main body is L-shaped. 13. The photonics package of claim 12 , wherein cylindrical protrusions extend out from a surface of the main body, and wherein the plurality of lenses are at ends of the cylindrical protrusions. 14. The photonics package of claim 13 , wherein the cylindrical protrusions are set into the plurality of v-grooves on the photonics die. 15. The photonics package of claim 1 , further comprising: cylindrical ridges on a first surface of the main body; and a recessed surface on a second surface of the main body, wherein the lenses are on the recessed surface. 16. The photonics package of claim 15 , wherein the cylindrical ridges are set into the plurality of v-grooves on the photonics die. 17. A photonics package, comprising: a photonics die; a plurality of v-grooves in the photonics die; and a lens array optically coupled to a spot size converter on the photonics die, wherein the lens array comprises: a fiber housing; a plurality of optical fibers in the fiber housing; and a plurality of lenses at an end of the optical fibers. 18. The photonics package of claim 17 , wherein the plurality of optical fibers are set into the plurality of v-grooves on the photonics die. 19. The photonics package of claim 17 , wherein the plurality of lenses are discrete bodies from the plurality of optical fibers. 20. The photonics package of claim 17 , wherein the plurality of lenses are fabricated as part of the plurality of optical fibers. 21. A photonics system, comprising: a board; a package substrate coupled to the board; a processor on the package substrate; a photonics die on the package substrate and communicatively coupled to the processor, and a plurality of v-grooves on the photonics die; and a lens array coupled to an edge of the photonics die. 22. The photonics system of claim 21 , wherein the lens array comprises: a main body; and a plurality of lenses extending out from the main body. 23. The photonics system of claim 22 , wherein individual ones of the plurality of lenses are disposed in different ones of the plurality of v-grooves. 24. The photonics system of claim 22 , wherein the lens array further comprises: a pair of alignment posts extending out from the main body. 25. The photonics system of claim 22 , wherein the lens array further comprises: a pair of holes through the main body; a second body; a pair of alignment posts extending out from the second body, wherein the alignment posts extend through the pair of holes through the main body.
Mounting of the optical elements · CPC title
Optical features (G02B6/4207, G02B6/421 take precedence) · CPC title
the coupling comprising intermediate optical elements, e.g. lenses, holograms (encapsulated active devices H01S5/02208) · CPC title
the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers · CPC title
the mechanical coupling means being grooves (G02B6/3652 takes precedence) · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.