Vibration device

Patent metadata

Field	Value
Publication number	US-12349596-B2
Application number	US-202117531976-A
Country	US
Kind code	B2
Filing date	Nov 22, 2021
Priority date	Dec 25, 2020
Publication date	Jul 1, 2025
Grant date	Jul 1, 2025

Abstract

The vibration device includes a piezoelectric element having a connection terminal exposed from a main surface of the piezoelectric element, a first resin layer having conductivity and covering the connection terminal of the piezoelectric element to be electrically connected to the connection terminal, a wiring member overlapping the main surface of the piezoelectric element to cover the first resin layer, including a wire electrically connected to the first resin layer, and extending beyond one end of the piezoelectric element when viewed in a thickness direction of the piezoelectric element, and a second resin layer integrally covering the main surface of the piezoelectric element and the wiring member. The second resin layer includes a first layer in direct contact with the piezoelectric element and the wiring member, and a second layer covering the piezoelectric element and the wiring member via the first layer.

First claim

What is claimed is:

1. A vibration device comprising:
a piezoelectric element having a connection terminal exposed from a main surface of the piezoelectric element;
a first resin layer having conductivity and covering the connection terminal of the piezoelectric element to be electrically connected to the connection terminal;
a wiring member overlapping the main surface of the piezoelectric element to cover the first resin layer, including a wire electrically connected to the first resin layer, and extending beyond one end of the piezoelectric element when viewed in a thickness direction of the piezoelectric element; and
a second resin layer integrally covering the main surface of the piezoelectric element and the wiring member from the main surface side of the piezoelectric element;
wherein the second resin layer includes a first layer in direct contact with the piezoelectric element and the wiring member, and a second layer covering the piezoelectric element and the wiring member via the first layer, and
wherein the second resin layer is thinner than the wiring member.

2. The vibration device according to claim 1 , wherein a covering area where the second resin layer covers the main surface of the piezoelectric element is larger than a covering area where the wiring member covers the main surface of the piezoelectric element.

3. The vibration device according to claim 1 , wherein the second resin layer covers an entire of a portion covering the piezoelectric element of the wiring member.

4. The vibration device according to claim 1 , wherein the wiring member and the second layer of the second resin layer are made of the same material.

5. The vibration device according to claim 1 , wherein the wiring member and the second resin layer are provided on the one end side with respect to the center of the main surface of the piezoelectric element.

6. A vibration device comprising:
a piezoelectric element having a connection terminal exposed from a main surface of the piezoelectric element;
a first resin layer having conductivity and covering the connection terminal of the piezoelectric element to be electrically connected to the connection terminal;
a wiring member overlapping the main surface of the piezoelectric element to cover the first resin layer, including a wire electrically connected to the first resin layer, and extending beyond one end of the piezoelectric element when viewed in a thickness direction of the piezoelectric element; and
a second resin layer integrally covering the main surface of the piezoelectric element and the wiring member from the main surface side of the piezoelectric element;
wherein the second resin layer includes a first layer in direct contact with the piezoelectric element and the wiring member, and a second layer covering the piezoelectric element and the wiring member via the first layer, and
wherein when the thickness of the second resin layer is t1 and the thickness of the wiring member is t2, 0.25≤t1/t2<1 is satisfied.

7. The vibration device according to claim 6 , wherein a covering area where the second resin layer covers the main surface of the piezoelectric element is larger than a covering area where the wiring member covers the main surface of the piezoelectric element.

8. The vibration device according to claim 6 , wherein the second resin layer covers an entire of a portion covering the piezoelectric element of the wiring member.

9. The vibration device according to claim 6 , wherein the wiring member and the second layer of the second resin layer are made of the same material.

10. The vibration device according to claim 6 , wherein the wiring member and the second resin layer are provided on the one end side with respect to the center of the main surface of the piezoelectric element.

11. A vibration device comprising:
a piezoelectric element having a connection terminal exposed from a main surface of the piezoelectric element;
a first resin layer having conductivity and covering the connection terminal of the piezoelectric element to be electrically connected to the connection terminal;
a wiring member overlapping the main surface of the piezoelectric element to cover the first resin layer, including a wire electrically connected to the first resin layer, and extending beyond one end of the piezoelectric element when viewed in a thickness direction of the piezoelectric element; and
a second resin layer integrally covering the main surface of the piezoelectric element and the wiring member from the main surface side of the piezoelectric element;
wherein the second resin layer includes a first layer in direct contact with the piezoelectric element and the wiring member, and a second layer covering the piezoelectric element and the wiring member via the first layer,
the vibration device further comprises a third resin layer provided on the main surface of the piezoelectric element and extending over an entire edge of the one end of the piezoelectric element covered with the wiring member, and
wherein the first resin layer is sealed by the wiring member, the second resin layer, and the third resin layer.

12. The vibration device according to claim 11 , wherein a covering area where the second resin layer covers the main surface of the piezoelectric element is larger than a covering area where the wiring member covers the main surface of the piezoelectric element.

13. The vibration device according to claim 11 , wherein the second resin layer covers an entire of a portion covering the piezoelectric element of the wiring member.

14. The vibration device according to claim 11 , wherein the wiring member and the second layer of the second resin layer are made of the same material.

15. The vibration device according to claim 11 , wherein the wiring member and the second resin layer are provided on the one end side with respect to the center of the main surface of the piezoelectric element.

16. A vibration device comprising:
a piezoelectric element having a connection terminal exposed from a main surface of the piezoelectric element;
a first resin layer having conductivity and covering the connection terminal of the piezoelectric element to be electrically connected to the connection terminal;
a wiring member overlapping the main surface of the piezoelectric element to cover the first resin layer, including a wire electrically connected to the first resin layer, and extending beyond one end of the piezoelectric element when viewed in a thickness direction of the piezoelectric element; and
a second resin layer integrally covering the main surface of the piezoelectric element and the wiring member from the main surface side of the piezoelectric element;
wherein the second resin layer includes a first layer in direct contact with the piezoelectric element and the wiring member, and a second layer covering the piezoelectric element and the wiring member via the first layer, and
wherein the wiring member is sandwiched between the third resin layer and the second resin layer.

17. The vibration device according to claim 16 , wherein a covering area where the second resin layer covers the main surface of the piezoelectric element is larger than a covering area where the wiring member covers the main surface of the piezoelectric element.

18. The vibration device according to claim 16 , wherein the second resin layer covers an entire of a portion covering the piezoelectric element of the wiring member.

19. The vibration device according to claim 16 , wherein the wiring member and the seco

Assignees

• Tdk Corp

Inventors

• Teranishi Keisuke
• Mitsui Hiroki
• Kato Miho
• Sakamoto Hideya
• Sato Narumi

Classifications

• H10N30/204

  using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders · CPC title

• H10N30/88 Primary

  Mounts; Supports; Enclosures; Casings · CPC title

• H04R17/025

  using a piezoelectric polymer · CPC title

• H10N30/875 Primary

  Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins · CPC title

• H04R17/005 Primary

  using a piezoelectric polymer · CPC title