Electronic device

Patent metadata

Field	Value
Publication number	US-12349279-B2
Application number	US-202217878319-A
Country	US
Kind code	B2
Filing date	Aug 1, 2022
Priority date	Feb 4, 2020
Publication date	Jul 1, 2025
Grant date	Jul 1, 2025

Abstract

An electronic device includes a mounting member having a surface, an electronic component, a solder and a sidefill. The electronic component has a plurality of electrodes on a surface and is mounted on the surface of the mounting member so that the surface of the electronic component having the electrodes faces the surface of the mounting member. The solder is disposed between the mounting member and at least one of the electrodes of the electronic component to electrically and mechanically connect between the at least one of the electrodes and the mounting member. The sidefill is disposed on a periphery of the solder and mechanically connects between the electronic component and the mounting member.

First claim

What is claimed is:

1. An electronic device comprising:
a mounting member having a surface;
an electronic component mounted on the surface of the mounting member, the electronic component having a rectangular parallelepiped outer shape including a first surface, a second surface opposite to the first surface, and four sides surfaces connecting between the first surface and the second surface, the electronic component including a plurality of electrodes on the second surface that faces the surface of the mounting member;
a solder disposed between the mounting member and each of the electrodes of the electronic component, and electrically and mechanically connecting between the mounting member and each of the electrodes; and
a sidefill disposed on a periphery of the solder, and mechanically connecting between the electronic component and the mounting member, wherein
the sidefill is disposed on each of the four side surfaces of the electronic component at least in a region adjacent to the second surface of the electronic component while exposing a corner portion of the electronic component on a side opposite to the mounting member,
the sidefill has a height from the surface of the mounting member, and the height of the sidefill in an area within a width of a corresponding one of the four side surfaces is smaller at opposite ends in a width direction than on an inner side in the width direction, the width direction being a direction on the corresponding one of the four side surfaces and along the surface of the mounting member,
on the second surface of the electronic component, the plurality of electrodes are disposed only along an outer edge of the second surface,
the plurality of electrodes are disposed to extend from the second surface to the side surfaces over corner portions defined between the second surfaces and the side surfaces,
the sidefill is absent in an area inside the plurality of electrodes on the second surface of the electronic component,
the second surface of the electronic component in the area inside the plurality of electrodes is exposed from the solder and the sidefill,
the solder is provided at a plurality of locations corresponding to the plurality of electrodes, and the solder provided at each of the plurality of locations covers a corresponding one of the electrodes on the second surface and the corresponding one of the four side surfaces,
on each of the four side surfaces, the sidefill is disposed to cover at least two of a plurality of the solders and to expose at least part of the plurality of the solders located at ends in the width direction,
the electronic component is an inertial measurement unit (IMU) including an inertial force sensor configured to detect an inertial force,
a plurality of the sidefills are arranged so as to be mechanically connected to the four side surfaces of the electronic component, and
portions of the plurality of the sidefills mechanically connected to the four side surfaces are connected to each other.

2. The electronic device according to claim 1 , wherein
a plurality of the sidefills are arranged to be at least one of point-symmetry with respect to a center of the electronic component and line-symmetry with respect to a virtual line passing through the center of the electronic component.

3. The electronic device according to claim 1 , wherein
the sidefill has a thickness in a direction orthogonal to the at least one of the four side surfaces, and
the thickness of the sidefill in the area within the width of the at least one of the four side surfaces is smaller at the opposite ends than on the inner side in the width direction.

4. The electronic device according to claim 1 , wherein
an outer surface of the sidefill is flat so as to be linear in a cross section view.

5. The electronic device according to claim 1 , wherein
an outer surface of the sidefill is curved so as to be concave in a cross section view.

6. The electronic device according to claim 1 , wherein
on each of the four side surfaces, the sidefill further is disposed to expose both lower corner portions of the electronic component, the lower corner portions being on a side adjacent to the mounting member.

Assignees

• Denso Corp

Inventors

• Ito Keitaro
• Akashi Teruhisa
• Terasawa Hideki
• Houchi Suguru
• Yoshida Naoki

Classifications

• H05K2201/10151

  Sensor · CPC title

• H05K1/181 Primary

  associated with surface mounted components · CPC title

• H05K2201/10977

  Encapsulated connections · CPC title

• G01C19/5783

  Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719 · CPC title

• H05K3/3431 Primary

  Leadless components · CPC title