Low cost, low loss material for microwave or antenna printed circuit board

Patent metadata

Field	Value
Publication number	US-12347927-B2
Application number	US-201916685986-A
Country	US
Kind code	B2
Filing date	Nov 15, 2019
Priority date	Nov 15, 2019
Publication date	Jul 1, 2025
Grant date	Jul 1, 2025

Abstract

An apparatus and method for producing a low loss printed circuit board (PCB). The PCB includes an antenna patch, a ground plane, and a polarizer. The antenna patch consists of a plastic base having a first plurality of circuit patterns formed directly on its top surface. The ground plane is formed directly on a bottom surface of the plastic base used for the antenna patch, and contains one or more coupling circuit patterns. A polarizer spacer is provided on the antenna patch to provide separation from the polarizer. The polarizer also consists of a second plastic base having a second plurality of circuit patterns formed directly thereon.

First claim

What is claimed is:

1. A method comprising:
forming an antenna patch by forming a first plurality of circuit patterns directly on a top surface of a first plastic base;
forming a ground plane directly on a bottom surface of the first plastic base with a coupling circuit pattern formed directly on a bottom surface of the ground plane;
disposing a separator directly on the first plurality of circuit patterns; and
forming a polarizer directly on the separator by disposing a second plastic base on the separator, and forming a second plurality of circuit patterns directly on a top surface of the second plastic base.

2. The method of claim 1 , further comprising forming at least one additional antenna patch on the antenna patch.

3. The method of claim 1 , further comprising:
disposing a foam cap on the polarizer; and
sealing the antenna patch, ground plane, separator, and polarizer within a hydrophobic film.

4. The method of claim 1 , further comprising:
forming at least one additional polarizer on the polarizer; and
aligning a polarizer spacer between the polarizer and one of the at least one additional polarizer, or between two of the at least one additional polarizer.

5. The method of claim 1 , wherein forming the ground plane comprises printing the one or more coupling circuit patterns on the bottom surface of the first plastic base using a conductive ink.

6. The method of claim 1 , wherein forming the ground plane comprises:
depositing a metallic layer onto the bottom surface of the first plastic base;
aligning a photomask containing the one or more circuit patterns with the first plastic base;
transferring the one or more circuit patterns to the metallic layer; and
etching the metallic layer to retain the one or more circuit patterns on the first plastic base.

7. The method of claim 1 , wherein the first plastic base and the second plastic base comprise a polyethylene terephthalate (PET) material.

8. The method of claim 1 , wherein the first plastic base and the second plastic base comprise a copolymer.

9. The method of claim 1 , wherein the first plastic base and the second plastic base each comprise either a PET material or a copolymer.

10. The method of claim 1 , further comprising forming one or more vias between the antenna patch, the spacer, and/or the polarizer.

11. The method of claim 10 , wherein forming the one or more vias comprises:
creating, for each of the one or more vias, a cavity extending between the antenna patch, the spacer, and/or the polarizer; and
drawing the conductive ink into each of the cavities by generating a vacuum.

12. An antenna patch apparatus comprising:
a first plurality of circuit patterns directly on a top surface of a first plastic base;
a ground plane directly on a bottom surface of the first plastic base with a coupling circuit pattern directly on a bottom surface of the ground plane;
a separator disposed directly on the first plurality of circuit patterns; and
a polarizer disposed directly on the separator, wherein the polarizer includes a second plastic base disposed on the separator, and a second plurality of circuit patterns directly on a top surface of the second plastic base.

13. The apparatus of claim 12 , further comprising at least one additional antenna disposed on the antenna patch.

14. The apparatus of claim 12 , further comprising:
a foam cap disposed on the polarizer; and
a hydrophobic film for sealing the antenna patch, ground plane, separator, and polarizer.

15. The apparatus of claim 12 , further comprising:
at least one additional polarizer disposed on the polarizer; and
a polarizer spacer aligned either between the polarizer and one of the at least one additional polarizer, between two of the at least one additional polarizer, or any combination thereof.

16. The apparatus of claim 12 wherein the first plurality of circuit patterns, the ground plane, and the second plurality of circuit patterns are formed by printing using a conductive ink.

17. The apparatus of claim 12 wherein the first plastic base and the second plastic base comprise a polyethylene terephthalate (PET) material.

18. The apparatus of claim 12 wherein the first plastic base and the second plastic base comprise a copolymer.

19. The apparatus of claim 12 wherein:
the first plastic base comprises either a PET material or a copolymer; and
the second plastic base comprises either a PET material or a copolymer.

20. The apparatus of claim 12 , further comprising one or more vias interconnecting any combination of the antenna patch, the ground plane, and/or the polarizer.

Assignees

• Hughes Network Systems Llc

Inventors

• Lu Bingqian
• Hou Peter
• Yue Taiwei
• Clough Brian
• Johnson Harry
• Corrigan John

Classifications

• H05K2203/085

  Using vacuum or low pressure · CPC title

• H05K2201/093

  Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein · CPC title

• H05K2201/0145

  Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN] · CPC title

• H05K3/4069

  for via connections in organic insulating substrates · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title