Heat dissipation device

Patent metadata

Field	Value
Publication number	US-12347746-B2
Application number	US-202318186641-A
Country	US
Kind code	B2
Filing date	Mar 20, 2023
Priority date	Mar 24, 2022
Publication date	Jul 1, 2025
Grant date	Jul 1, 2025

Abstract

A heat dissipation device includes a main fixed base plate, a main heat pipe set, a lower heat dissipation fin set and an upper heat dissipation module. The main heat pipe set is fixed on the main fixed base plate, and the lower heat dissipation fin set is also fixed on the main fixed base plate, and the main heat pipe set passes through the lower heat dissipation fin set, and is exposed on the lower heat dissipation fin set. In addition, the upper heat dissipation module is detachably installed on the lower heat dissipation fin set and contacts the main heat pipe set.

First claim

What is claimed is:

1. A heat dissipation device, comprising:
a main fixed base plate;
a main heat pipe set fixed on the main fixed base plate;
a lower heat dissipation fin set fixed on the main fixed base plate, and the main heat pipe set passing through the lower heat dissipation fin set and exposed on the lower heat dissipation fin set;
an upper heat dissipation module detachably installed on the lower heat dissipation fin set and contacting the main heat pipe set;
an upper main heat dissipation fin set;
at least one auxiliary heat dissipation fin set disposed on a side of the upper main heat dissipation fin set;
a first auxiliary heat dissipation fin set and a second auxiliary heat dissipation fin set respectively disposed on two sides of the upper main heat dissipation fin set, and a thickness of the upper main heat dissipation fin set is less than or equal to a thickness of the first auxiliary heat dissipation fin set and a thickness of the second auxiliary heat dissipation fin set; and
an upper heat pipe set passing through the first auxiliary heat dissipation fin set, the upper main heat dissipation fin set and the second auxiliary heat dissipation fin set.

2. The heat dissipation device of claim 1 , wherein the upper heat dissipation module further comprises:
an upper fixing base plate fixing the upper heat pipe set, wherein the upper fixing base plate comprises a plurality of openings.

3. The heat dissipation device of claim 2 , wherein the upper heat pipe set comprises:
a plurality of upper heat pipes, wherein each of the upper heat pipes comprises a first part, a second part and a third part, wherein second parts of the upper heat pipes are disposed at equal intervals on the upper fixing base plate and exposed to the openings.

4. The heat dissipation device of claim 3 , wherein the upper heat dissipation module further comprises:
an upper heat conduction block directly contacting the upper heat pipes through the openings; and
a thermal pad disposed between the upper heat conduction block and the main heat pipe set to transfer a heat in the main heat pipe set to the upper heat conduction block.

5. The heat dissipation device of claim 1 , wherein the main heat pipe set comprises:
a plurality of main heat pipes, wherein each of the main heat pipes comprises a first part, a second part and a third part, wherein the first part is fixed on the main fixed base plate, the second part is a rising portion to upwardly transfer a heat absorbed by the first part to the third part, and the third part is exposed to the lower heat dissipation fin set and contacts the upper heat dissipation module.

6. The heat dissipation device of claim 5 , wherein the main heat pipes comprise:
a first main heat pipe; and
a second main heat pipe, wherein a first part of the second main heat pipe is fixed beside a first part of the first main heat pipe and forms an U-shaped portion.

7. The heat dissipation device of claim 6 , wherein the main heat pipes further comprise:
a third main heat pipe, wherein a first part of the third main heat pipe is disposed in the U-shaped portion formed by the first part of the second main heat pipe.

8. The heat dissipation device of claim 1 , further comprising:
a main heat conduction block fixed under the main fixed base plate to contact the main heat pipe set through openings of the main fixed base plate.

9. The heat dissipation device of claim 1 , further comprising:
a plurality of fixing crossbars disposed on the lower heat dissipation fin set and between main heat pipes of the main heat pipe set to fix the upper heat dissipation module.

Assignees

• Auras Technology Co Ltd

Inventors

• Chang Cheng-Ju
• Lin Wan-Hsuan
• Su Chung-Chien

Classifications

• H10W40/242

  comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H10W40/611

  Bolts or screws · CPC title

• H10W40/641

  Snap-on arrangements, e.g. clips · CPC title

• H10W40/625

  Clamping parts not primarily conducting heat · CPC title