Resin composition, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board

Patent metadata

Field	Value
Publication number	US-12344738-B2
Application number	US-202418646300-A
Country	US
Kind code	B2
Filing date	Apr 25, 2024
Priority date	Nov 19, 2021
Publication date	Jul 1, 2025
Grant date	Jul 1, 2025

Abstract

A resin composition contains a polyphenylene ether compound, a styrene block copolymer, a polybutadiene compound, and a curing agent. The polyphenylene ether compound has, in a molecule thereof, at least one of a group expressed by formula (1) or a group expressed by formula (2). The polybutadiene compound has an epoxy group in a molecule thereof. The curing agent contains an allyl compound expressed by formula (3). In the formula (1), p indicates an integer from 0 to 10, Z indicates an arylene group, and R 1 to R 3 each independently indicate either a hydrogen atom or an alkyl group. In the formula (2), R 4 indicates either a hydrogen atom or an alkyl group. In the formula (3), R A indicates either an alkyl group or an alkenyl group, each having 8 to 22 carbon atoms.

First claim

The invention claimed is:

1. A resin composition containing
a polyphenylene ether compound (A),
a styrene block copolymer (B),
a polybutadiene compound (C),
a curing agent (D), and
a silane coupling agent (E) having a triazine ring,
the polyphenylene ether compound (A) having, in a molecule thereof, at least one of a group expressed by the following formula (1) or a group expressed by the following formula (2):

where p indicates an integer falling within a range from 0 to 10, Z indicates an arylene group, and R 1 to R 3 each independently indicate either a hydrogen atom or an alkyl group,

where R 4 indicates either a hydrogen atom or an alkyl group,
the polybutadiene compound (C) having an epoxy group in a molecule thereof, and
the curing agent (D) containing an allyl compound (d1) expressed by the following formula (3):

where R A indicates either an alkyl group or an alkenyl group, each having 8 to 22 carbon atoms.

2. The resin composition of claim 1 , wherein
a ratio by mass of the styrene block copolymer (B) to a total of the polyphenylene ether compound (A) and the allyl compound (d 1 ) is equal to or greater than 50:50 and equal to or less than 95:5.

3. The resin composition of claim 1 , wherein
content of the polybutadiene compound (C) with respect to 100 parts by mass in total of the polyphenylene ether compound (A) and the allyl compound (d 1 ) is equal to or greater than 5 parts by mass and equal to or less than 40 parts by mass.

4. A semi-cured product of the resin composition of claim 1 , wherein
the semi-cured product of the resin composition having a thickness of 75 μm and being obtained by heating the resin composition at a temperature of 100° C. to 160° C. for 2 to 5 minutes has a minimum bending radius equal to or shorter than 2 mm,
the minimum bending radius of the semi-cured product refers to an R value of a folding clamp obtained by subjecting the semi-cured product made of the resin composition to an MIT test compliant with the JIS P8115 standard with the semi-cured product folded once or more under a measuring condition including a load of 0.5 kgf, a bending angle of 135 degrees, and a test rate of 175 cpm.

5. A cured product of the resin composition of claim 1 , wherein
the cured product of the resin composition having a thickness of 75 μm and being obtained by heating the resin composition at a temperature of 100° C. to 160° C. for 2 to 5 minutes, and then heating and pressurizing for 2 hours under the condition of 200° C. and pressure 4 MPa has a minimum bending radius equal to or shorter than 2 mm,
the minimum bending radius of the cured product refers to an R value of a folding clamp obtained by subjecting the cured product made of the resin composition to an MIT test compliant with the JIS P8115 standard with the cured product folded once or more under a measuring condition including a load of 0.5 kgf, a bending angle of 135 degrees, and a test rate of 175 cpm.

6. A film with resin, comprising:
a resin layer containing at least one of
an uncured product of the resin composition of claim 1 or
a semi-cured product of the resin composition of claim 1 ; and

a supporting film laid on top of the resin layer.

7. A sheet of metal foil with resin, comprising:
a resin layer containing at least one of
an uncured product of the resin composition of claim 1 or
a semi-cured product of the resin composition of claim 1 ; and

a sheet of metal foil laid on top of the resin layer.

8. A metal-clad laminate comprising:
an insulating layer containing a cured product of the resin composition of claim 1 ; and
a sheet of metal foil laid on top of the insulating layer.

9. A printed wiring board comprising:
an insulating layer containing a cured product of the resin composition of claim 1 ; and
wiring covered with the insulating layer.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Okuno Kosuke
• Koyama Masaya

Classifications

• H05K1/0373

  containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title

• C09D171/12

  Polyphenylene oxides · CPC title

• C09D153/00

  Coating compositions based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers · CPC title

• C08L71/12 Primary

  Polyphenylene oxides · CPC title

• C08F287/00

  Macromolecular compounds obtained by polymerising monomers on to block polymers · CPC title