Chemical dispensing system

US12341026B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12341026-B2
Application numberUS-202318447353-A
CountryUS
Kind codeB2
Filing dateAug 10, 2023
Priority dateMay 29, 2020
Publication dateJun 24, 2025
Grant dateJun 24, 2025

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A chemical dispensing system is capable of simultaneously supplying a semiconductor processing chemical for production and testing through the use of independent chemical supply lines, which reduces production downtime of an associated semiconductor process, increases throughput and capability of the semiconductor process, and/or the like. Moreover, the capability to simultaneously supply the semiconductor processing chemical for production and testing allows for an increased quantity of semiconductor processing chemical batches to be tested with minimal impact to production, which increases quality control over the semiconductor processing chemical. In addition, the independent chemical supply lines may be used to supply the semiconductor processing chemical to production while independently filtering semiconductor processing chemical directly from a storage drum through a filtration loop.

First claim

Opening claim text (preview).

What is claimed is: 1. A chemical dispensing system, comprising: a first chemical supply line configured to: provide a semiconductor processing chemical in a day tank to a production point of use (POU) manifold when the chemical dispensing system is in a first independent production and test configuration, and provide the semiconductor processing chemical in the day tank to a chemical test POU manifold when the chemical dispensing system is in a second independent production and test configuration; and a second chemical supply line configured to: provide the semiconductor processing chemical in a storage drum to the chemical test POU manifold when the chemical dispensing system is in the first independent production and test configuration, wherein the first chemical supply line is different from the second chemical supply line when the chemical dispensing system is in the first independent production and test configuration, and wherein the first chemical supply line is configured to simultaneously provide the semiconductor processing chemical in the day tank to the production POU manifold while the second chemical supply line provides the semiconductor processing chemical in the storage drum to the chemical test POU manifold when the chemical dispensing system is in the first independent production and test configuration, and provide the semiconductor processing chemical in the storage drum to the production POU manifold when the chemical dispensing system is in the second independent production and test configuration. 2. The chemical dispensing system of claim 1 , further comprising: a controller configured to cause the chemical dispensing system to be transitioned from a production supply configuration to the first independent production and test configuration. 3. The chemical dispensing system of claim 1 , wherein the first chemical supply line is further configured to provide the semiconductor processing chemical in the day tank to at least the production POU manifold when the chemical dispensing system is in a production supply configuration. 4. The chemical dispensing system of claim 3 , wherein the first chemical supply line is further configured to provide the semiconductor processing chemical in the day tank to the chemical test POU manifold when the chemical dispensing system is in the production supply configuration. 5. The chemical dispensing system of claim 1 , wherein the first chemical supply line is configured to simultaneously provide the semiconductor processing chemical in the day tank to the chemical test POU manifold while the second chemical supply line provides the semiconductor processing chemical in the storage drum to the production POU manifold when the chemical dispensing system is in the second independent production and test configuration. 6. The chemical dispensing system of claim 1 , wherein the first chemical supply line is configured to use one or more of a different valve, a different pump, a different filter, or a different pipe from the second chemical supply line when the chemical dispensing system is in the first independent production and test configuration. 7. The chemical dispensing system of claim 1 , wherein the first chemical supply line is configured to use one or more of a different valve, a different pump, a different filter, or a different pipe from the second chemical supply line when the chemical dispensing system is in the second independent production and test configuration. 8. A method, comprising: determining, by one or more processors, that a new batch of a semiconductor processing chemical was added to a storage drum of a chemical dispensing system; causing, by the one or more processors and based on determining that the new batch was added to the storage drum, the chemical dispensing system to be transitioned from a production supply configuration to an independent production and test configuration; and causing, by the one or more processors and based on the chemical dispensing system being configured in the independent production and test configuration, a first chemical supply line of the chemical dispensing system to provide the semiconductor processing chemical in a day tank to a first one of a production point of use (POU) manifold or a chemical test POU manifold and a second chemical supply line of the chemical dispensing system to provide the semiconductor processing chemical in the storage drum to a second one of the production POU manifold or the chemical test POU manifold. 9. The method of claim 8 , further comprising: causing, based on the chemical dispensing system being configured in the independent production and test configuration, the first chemical supply line to simultaneously provide the semiconductor processing chemical in the day tank to the production POU manifold while the second chemical supply line provides the semiconductor processing chemical in the storage drum to the chemical test POU manifold. 10. The method of claim 8 , further comprising: causing, based on the chemical dispensing system being configured in the independent production and test configuration, the first chemical supply line to simultaneously provide the semiconductor processing chemical in the day tank to the chemical test POU manifold while the second chemical supply line provides the semiconductor processing chemical in the storage drum to the production POU manifold. 11. The method of claim 8 , further comprising: causing, based on the chemical dispensing system being configured in the production supply configuration, the first chemical supply line to provide the semiconductor processing chemical in the day tank to at least the production POU manifold. 12. The method of claim 11 , further comprising: causing, based on the chemical dispensing system being configured in the production supply configuration, the first chemical supply line to provide the semiconductor processing chemical in the day tank to the chemical test POU manifold. 13. The method of claim 8 , further comprising: causing, based on the chemical dispensing system being configured in the independent production and test configuration, a first pump to provide the semiconductor processing chemical in the day tank to the production POU manifold through the first chemical supply line; and causing, based on the chemical dispensing system being configured in the independent production and test configuration, a second pump to provide the semiconductor processing chemical in the storage drum to the chemical test POU manifold through the second chemical supply line. 14. The method of claim 8 , further comprising: causing, based on the chemical dispensing system being configured in the independent production and test configuration, a first pump to provide the semiconductor processing chemical in the day tank to the chemical test POU manifold through the first chemical supply line; and causing, based on the chemical dispensing system being configured in the independent production and test configuration, a second pump to provide the semiconductor processing chemical in the storage drum to the production POU manifold through the second chemical supply line. 15. The method of claim 8 , further comprising: determining, based on determining that the new batch was added to the storage drum, to filter the semiconductor processing chemical in the storage drum; identifying a configured quantity of filtration cycles for filtering the semiconductor processing chemical; and causing a pump to circulate the semiconductor processing chemical through a filter included in the chemical dispensing system

Assignees

Inventors

Classifications

  • Etching of wafers, substrates or parts of devices · CPC title

  • Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

  • Production flow monitoring, e.g. for increasing throughput · CPC title

  • H10P72/04Primary

    Apparatus for manufacture or treatment · CPC title

  • Electricity · mapped topic

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Frequently asked questions

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What does patent US12341026B2 cover?
A chemical dispensing system is capable of simultaneously supplying a semiconductor processing chemical for production and testing through the use of independent chemical supply lines, which reduces production downtime of an associated semiconductor process, increases throughput and capability of the semiconductor process, and/or the like. Moreover, the capability to simultaneously supply the s…
Who is the assignee on this patent?
Taiwan Semiconductor Mfg Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10P72/0402. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 24 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).