Radio frequency power return path

Patent metadata

Field	Value
Publication number	US-12340984-B2
Application number	US-202016941994-A
Country	US
Kind code	B2
Filing date	Jul 29, 2020
Priority date	Aug 2, 2019
Publication date	Jun 24, 2025
Grant date	Jun 24, 2025

Abstract

Embodiments presented herein are directed to radio frequency (RF) grounding in process chambers. In one embodiment, a dielectric plate is disposed between a chamber body and a lid of a process chamber. The dielectric plate extends laterally into a volume defined by the chamber body and the lid. A substrate support is disposed in the volume opposite the lid. The substrate support includes a support body disposed on a stem. The support body includes a central region and a peripheral region. The peripheral region is radially outward of the central region. The central region has a thickness less than a thickness of the peripheral region. A flange is disposed adjacent to a bottom surface of the peripheral region. The flange extends radially outward from an outer edge of the peripheral region. A bellows is disposed on the flange and configured to sealingly couple to the dielectric plate.

First claim

What is claimed is:

1. An apparatus, comprising:
a chamber body and a lid defining a volume therein;
a dielectric plate physically separating and electrically isolating the chamber body and the lid;
a substrate support disposed in the volume opposite the lid, the substrate support comprising:
a support body disposed on a stem, the support body including a central region and a peripheral region radially outward of the central region, the central region having a thickness less than a thickness of the peripheral region;
a ground plate disposed between the support body and the stem; and
a flange adjacent to a bottom surface of the peripheral region and coupled to the ground plate, the flange extending radially outward of an outer edge of the peripheral region;

a conductive rod extending through the stem, coupled to the ground plate and adapted for coupling to a ground; and
a grounding arrangement disposed about the support body and coupled to the ground plate, the grounding arrangement actuatable to physically contact the dielectric plate.

2. The apparatus of claim 1 , further comprising:
one or more ground blocks positioned in the volume and disposed on the chamber body; and
one or more ground straps coupled to the one or more ground blocks and the ground plate.

3. The apparatus of claim 1 , wherein the grounding arrangement comprises a plurality of conductive loops.

4. The apparatus of claim 3 , wherein the grounding arrangement further comprises a plate corresponding to each conductive loop of the plurality of conductive loops, one or more fasteners that couple each conductive loop to the plate, and one or more fasteners that couple each plate to the flange at a center of each plate.

5. The apparatus of claim 1 , wherein the support body is constructed as a unitary member.

6. The apparatus of claim 1 , wherein the ground plate is coupled to a bottom surface of the central region and a radially interior surface of the peripheral region.

7. The apparatus of claim 1 , wherein the grounding arrangement is adjacent to an outer surface of the peripheral region.

8. The apparatus of claim 1 , wherein at least a portion of the peripheral region extends towards a chamber bottom.

9. The apparatus of claim 1 , wherein the peripheral region surrounds at least a portion of the stem.

10. An apparatus, comprising:
a chamber body and a lid defining a volume therein;
a dielectric plate physically separating and electrically isolating the chamber body and the lid;
a channel formed through the lid adjacent to the dielectric plate, the channel surrounding at least a portion of the volume;
a substrate support disposed in the volume opposite the lid, the substrate support comprising:
a support body disposed on a stem, the support body including a central region and a peripheral region radially outward of the central region, the central region having a thickness less than a thickness of the peripheral region;
a ground plate disposed between the support body and the stem; and
a flange disposed adjacent to a bottom surface of the peripheral region and coupled to the ground plate, the flange extending radially outward of an outer edge of the peripheral region;

a conductive rod extending through the stem, coupled to the ground plate and adapted for coupling to a ground; and
a plurality of conductive loops disposed on the flange and configured to physically contact the dielectric plate.

11. The apparatus of claim 10 , further comprising:
one or more ground blocks positioned in the volume and disposed on the chamber body; and
one or more ground straps coupled to the one or more ground blocks and the ground plate.

12. The apparatus of claim 10 , further comprising a ground strip having a first end and a second end, the first end coupled to the ground plate adjacent to the stem and the second end coupled to the chamber body.

13. The apparatus of claim 10 , further comprising a plurality of ground strips, each ground strip having a first end and a second end, wherein:
each of the first ends are coupled to the ground plate adjacent to the stem, and
each of the second ends are coupled to the chamber body.

14. The apparatus of claim 10 , further comprising a plurality of plates with each plate corresponding to one conductive loop of the plurality of conductive loops, one or more fasteners that couple each of the conductive loops to each of the plates, and one or more fasteners that couple each of the plates to the flange at a center of each plate.

15. The apparatus of claim 10 , wherein the channel is configured to remove gases from the volume.

16. The apparatus of claim 10 , wherein the support body is constructed as a unitary member.

17. The apparatus of claim 10 , wherein the ground plate is coupled to a bottom surface of the central region and a radially interior surface of the peripheral region.

18. The apparatus of claim 10 , wherein the plurality of conductive loops is adjacent to an outer surface of the peripheral region.

19. The apparatus of claim 10 , wherein at least a portion of the peripheral region extends towards a chamber bottom.

20. The apparatus of claim 10 , wherein the peripheral region surrounds at least a portion of the stem.

Assignees

• Applied Materials Inc

Inventors

• Bonecutter Luke
• Blahnik David
• Nguyen Tuan Anh
• Bansal Amit Kumar

Classifications

• C23C16/4409

  characterised by sealing means · CPC title

• H01J37/32082 Primary

  Radio frequency generated discharge (H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence) · CPC title

• C23C16/4585 Primary

  Devices at or outside the perimeter of the substrate support, e.g. clamping rings, shrouds · CPC title

• H01J37/32091

  the radio frequency energy being capacitively coupled to the plasma · CPC title

• H01J37/32577

  Electrical connecting means · CPC title