Electronic device

Patent metadata

Field	Value
Publication number	US-12340943-B2
Application number	US-202318303703-A
Country	US
Kind code	B2
Filing date	Apr 20, 2023
Priority date	May 30, 2022
Publication date	Jun 24, 2025
Grant date	Jun 24, 2025

Abstract

An electronic device includes a chip component, a case, a resin, and a conductive terminal. The chip component includes a terminal electrode. The case includes an accommodation recess for accommodating the chip component. The resin is filled in the accommodation recess. The conductive terminal is attachable to the case. The conductive terminal includes an inner electrode portion disposed in the accommodation recess and connected to the terminal electrode. The inner electrode portion includes a space formation portion forming a filling space for a conductive agent with an outer surface of the chip component at a position closer to a bottom surface than to an opening of the accommodation recess.

First claim

What is claimed is:

1. An electronic device comprising:
a chip component including a terminal electrode;
a case including an accommodation recess for accommodating the chip component;
a resin filled in the accommodation recess; and
a conductive terminal attachable to the case,
wherein
the conductive terminal includes an inner electrode portion disposed in the accommodation recess and connected to the terminal electrode,
the inner electrode portion includes a space formation portion forming a filling space for a conductive agent with an outer surface of the chip component at a position closer to a bottom surface than to an opening of the accommodation recess,
a side surface of the chip component is opposed to the bottom surface of the accommodation recess,
the space formation portion is located around a corner intersected by an end surface and the side surface of the chip component, and
wherein the space formation portion is bent and surrounds the corner so as to form the filling space between the end surface and the space formation portion and between the side surface and the space formation portion.

2. The electronic device according to claim 1 , wherein the space formation portion and the terminal electrode are connected via the conductive agent filled in the filling space.

3. The electronic device according to claim 1 , wherein the space formation portion protrudes toward a direction away from the outer surface of the chip component.

4. The electronic device according to claim 1 , wherein
the inner electrode portion includes an end-surface opposing portion continuing to the space formation portion and disposed away from the end surface of the chip component, and
a distance between the space formation portion and the end surface of the chip component is larger than a distance between the end-surface opposing portion and the end surface of the chip component.

5. The electronic device according to claim 1 , wherein
the inner electrode portion includes a bent portion bent toward the end surface of the chip component, and
the space formation portion is formed integrally with the bent portion.

6. The electronic device according to claim 1 , wherein the space formation portion has a width narrower than that of the terminal electrode.

7. The electronic device according to claim 1 , wherein
the inner electrode portion includes a plurality of inner electrode portions,
the space formation portion includes a plurality of space formation portions formed in the plurality of inner electrode portions, and
the inner electrode portions are separated from each other.

8. The electronic device according to claim 1 , wherein an outer surface of the case is provided with:
a pair of connection protrusions protruding outward from the outer surface of the case; and
a connection recess recessed inward from the outer surface of the case.

Assignees

• Tdk Corp

Inventors

• Sato Takaaki
• Masuda Akihiro
• Ando Norihisa
• Ito Shinya
• YAZAWA Kosuke

Classifications

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01G4/005

  Electrodes · CPC title

• H01G2/065

  for surface mounting, e.g. chip capacitors · CPC title

• H01G2/10

  Housing; Encapsulation · CPC title