Integrated flexible circuit attachment features with sound dampening and method of forming said features

Patent metadata

Field	Value
Publication number	US-12340924-B2
Application number	US-202218071183-A
Country	US
Kind code	B2
Filing date	Nov 29, 2022
Priority date	Dec 2, 2021
Publication date	Jun 24, 2025
Grant date	Jun 24, 2025

Abstract

A wiring assembly including a flex circuit including a plastic laminate layer and a mount location configured to receive a fastener secured to a substrate. The wiring assembly further includes a flex circuit attachment feature, the flex circuit attachment feature including an extruded material bonded to the plastic laminate layer at the mount location.

First claim

What is claimed is:

1. A wiring assembly, comprising:
a flex circuit including a first surface and a second surface with a conductive layer positioned therebetween, and a plastic laminate layer and a mount location configured to receive a fastener secured to a substrate, the mount location including a through-hole; and
a flex circuit attachment feature, the flex circuit attachment feature including an extruded material bonded to the plastic laminate layer at the mount location, the extruded material forming a perimeter around the through-hole, wherein the flex circuit attachment feature includes an engagement surface configured to be in direct contact with the fastener,
wherein the flex circuit attachment feature provides a structural strength at the mount location and provides a cushion between the flex circuit and the substrate,
wherein the fastener includes a stud having a projection that directly contacts the engagement surface of the extruded material.

2. The wiring assembly of claim 1 , wherein the extruded material comprises a urethane acrylate oligomer.

3. The wiring assembly of claim 2 , wherein the extruded material further comprises a photo-initiator compound configured to provide a photopolymerization cure mechanism.

4. The wiring assembly of claim 1 , wherein the fastener includes a threaded stud secured to the substrate.

5. The wiring assembly of claim 1 , wherein the stud of the fastener is configured to be inserted into the substrate via an interference fit.

6. The wiring assembly of claim 1 , wherein the fastener includes a fir tree fastener and wherein the extruded material is configured to engage with the fir tree fastener.

7. The wiring assembly of claim 1 , wherein the fastener is configured to secure to an edge of the substrate.

8. The wiring assembly of claim 1 , wherein the through-hole includes one or more tabs extending radially inward from a perimeter of the through-hole.

9. The wiring assembly of claim 1 , wherein the extruded material is deposited solely on the first surface of the flex circuit.

10. A method of securing a flex circuit to a vehicle substrate, comprising:
providing the flex circuit, the flex circuit including a plastic laminate layer, a first surface diametrically opposed to a second surface with a conductive layer positioned therebetween, and one or more mount locations;
depositing an extruded material on the first surface of the flex circuit adjacent to the one or more mount locations;
bonding the extruded material to the plastic laminate layer; and
providing a fastener at the one or more mount locations,
wherein the fastener is configured to secure the flex circuit to the vehicle substrate,
wherein the extruded material forms an engagement surface, wherein the fastener is configured to be in direct contact with the engagement surface, and
wherein the fastener includes a stud having a projection that directly contacts the engagement surface of the extruded material.

11. The method of claim 10 further comprising:
curing the extruded material.

12. The method of claim 11 , wherein curing the extruded material includes a photopolymerization cure mechanism.

13. The method of claim 10 , wherein the extruded material includes a urethane acrylate oligomer and a photo-initiator compound.

14. The method of claim 10 , wherein the extruded material is configured to space the flex circuit from the vehicle substrate.

15. The method of claim 10 , wherein the extruded material is configured to provide a squeak and rattle abatement between the flex circuit and the vehicle substrate.

16. The method of claim 10 , wherein the extruded material is configured to provide an additional attachment strength between the flex circuit and the vehicle substrate.

17. The method of claim 10 , wherein the extruded material is configured to provide an electrical insulation between the flex circuit and the vehicle substrate.

18. The method of claim 10 further comprising:
depositing the extruded material on the second surface of the flex circuit adjacent to the one or more mount locations.

19. The method of claim 10 further comprising:
providing a controller configured to selectively deposit the extruded material on the flex circuit.

Assignees

• Aptiv Technologies AG

Inventors

• Peterson David R
• Sudik Jr Joseph
• Braun Jesse
• Siegfried David

Classifications

• H01B19/04

  Treating the surfaces, e.g. applying coatings · CPC title

• H01B19/02

  Drying; Impregnating · CPC title

• H05K2201/2045

  Protection against vibrations · CPC title

• H05K2201/1059

  Connections made by press-fit insertion · CPC title

• H05K2201/10409

  Screws · CPC title